Induced Magnetic Anisotropy of Sputter NiFe Thin Films on Thin Tantalum Nitride Underlayer

1995 ◽  
Vol 384 ◽  
Author(s):  
T. Yeh ◽  
L. Berg ◽  
J. Falenschek ◽  
J. Yue
Keyword(s):  
Magnetic Anisotropy ◽  
Anisotropy Field ◽  
Tantalum Nitride ◽  
X Ray Diffraction ◽  
Crystalline Orientation ◽  
X Ray ◽  
Anisotropic Stress ◽  
Magnetoelastic Energy ◽  
Thermal Oxide ◽  
Induced Magnetic Anisotropy

ABSTRACTThe structure and properties of sputter NiFe thin film deposited on both thermal oxide and thin tantalum nitride have been studied. The magnetic anisotropy field HK increases to 8.2 Oe when the NiFe film was deposited on a thin tantalum nitride underlayer. Anisotropic stress was found on the sample film with tantalum nitride underlayer. Results of X-ray diffraction show that a thin tantalum nitride underlayer appears to promote a preferred crystalline orientation formation of the NiFe film. The induced magnetic anisotropy is attributed to the formation of the preferred crystalline orientation and the induced anisotropic magnetoelastic energy which is associated with the anisotropic stress of the sample film.

Magnetic Anisotropy in Electrodeposited CO Films and spin-valves on Gaas Substrates

1999 ◽  
Vol 562 ◽  
Author(s):  
K. Attenborough ◽  
M. Cerisier ◽  
H. Boeve ◽  
J. De Boeck ◽  
G. Borghs ◽  
...  
Keyword(s):  
Magnetic Anisotropy ◽  
Buffer Layer ◽  
Structural Properties ◽  
Easy Axis ◽  
Spin Valve ◽  
X Ray Diffraction ◽  
X Ray ◽  
Cu Films ◽  
Gaas Substrates ◽  
Unique Spin

ABSTRACTWe have studied the magnetic and structural properties of thin electrodeposited Co and Cu layers grown directly onto (100) n-GaAs and have investigated the influence of a buffer layer. A dominant fourfold anisotropy with a uniaxial contribution is observed in 10 nm Co electrodeposited films on GaAs. An easy axis is observed in the [001] GaAs direction with two hard axes of differing coercivities parallel to the [011] and [011] directions. For thicker films the easy axes in the [001] direction becomes less pronounced and the fourfold anisotropy becomes less dominant. Co films of similar thicknesses deposited onto an electrodeposited Cu buffer layer were nearly isotropic. From X-ray diffraction 21 nm Co layers on GaAs were found to be hcp with the c-axis tending to be in the plane of the film. The anisotropy is ascribed to the Co/GaAs interface and is held responsible for the unique spin-valve properties seen recently in electrodeposited Co/Cu films.

scholarly journals X-Ray Study of Nanocrystalline Ribbons FeCuNbSiB Subjected to Thermomechanical and Thermomagnetic Treatments

2000 ◽  
Vol 34 (4) ◽  
pp. 227-232
Author(s):  
I. V. Gervasyeva ◽  
H. J. Bunge ◽  
K. Helming ◽  
V. A. Lukshina ◽  
I. V. Alexandrov
Keyword(s):  
Grain Size ◽  
Magnetic Anisotropy ◽  
Thermomagnetic Treatment ◽  
Internal Stresses ◽  
X Ray ◽  
Induced Magnetic Anisotropy

An attempt to discover the structure peculiarities giving rise to induced magnetic anisotropy in a finemet subjected to thermomechanical or thermomagnetic treatment has been undertaken. Grain size, internal stresses and texture in FeCuNbSiB ribbons were investigated. It was concluded that the induced magnetic anisotropy must have another reason e.g., directional ordering of Si atoms.

A Study on CVD TaN as a Diffusion Barrier for Cu Interconnects

2000 ◽  
Vol 612 ◽  
Author(s):  
Se-Joon Im ◽  
Soo-Hyun Kim ◽  
Ki-Chul Park ◽  
Sung-Lae Cho ◽  
Ki-Bum Kim
Keyword(s):  
Activation Energy ◽  
Gas Phase ◽  
Diffusion Barrier ◽  
Surface Reaction ◽  
Film Growth ◽  
Ion Beam ◽  
Barrier Properties ◽  
Tantalum Nitride ◽  
X Ray Diffraction ◽  
X Ray

AbstractTantalum nitride (TaN) films were deposited using pentakis-diethylamido-tantalum [PDEAT, Ta(N(C2H5)2)5] as a precursor. During film growth, N- and Ar-ion beams with an energy of 120 eV were supplied in order to improve the film quality. In case of thermallydecomposed films, the deposition rate is controlled by the surface reaction up to about 350 °C with an activation energy of about 1.07 eV. The activation energy of the surface reaction controlled regime is decreased to 0.26 eV when the Ar-beam is applied. However, in case of Nbeam bombarded films, the deposition is controlled by the precursor diffusion in gas phase at the whole temperature range. By using Ar-beam, the resistivity of the film is drastically reduced from approximately 10000 µω-cm to 600 µω-cm and the density of the film is increased from 5.85 g/cm3 to 8.26 g/cm3, as compared with thermally-decomposed film. The use of N-beam also considerably lowers the resistivity of films (∼ 800 µω-cm) and increases the density of the films (7.5 g/cm3). Finally, the diffusion barrier properties of 50-nm-thick TaN films for Cu were investigated aftre annealing by X-ray diffraction analysis. The films deposited using N- and Arbeam showed the Cu3Si formation after annealing at 650 °C for 1 hour, while thermallydecomposed films showed Cu3Si peaks firstly after annealing at 600 °C. It is considered that the improvements of the diffusion barrier performance of the films deposited using N- and Ar-ion beam are the consequence of the film densification resulting from the ion bombardment during film growth.

The Growth of Si on SiC Complex Substrate by CVD

2012 ◽  
Vol 490-495 ◽  
pp. 3840-3844
Author(s):  
W. Cheng ◽  
P. Han ◽  
F. Yu ◽  
L. Yu ◽  
L.H. Cheng ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Crystalline Quality ◽  
X Ray Diffraction ◽  
Crystalline Orientation ◽  
X Ray ◽  
Measurement Results ◽  
Different Temperatures ◽  
P Type ◽  
Sic Film ◽  
Sic Films

In this work, the Si layer is deposited on the SiC complex substrate which is composed of Si(111) substrate and 3C-SiC film grown on it. These Si and 3C–SiC films grown under different temperatures in a chemical vapor deposition system are analyzed. The crystalline orientation, the crystalline quality and the conduction type of the films are measured by X-ray diffraction, Raman scattering ,Scanning electron microscope, and 1150 °C is found the optimized temperature for the epitaxial growth of SiC film grown on the carbonized layer. Measurement results also show that the epitaxial layer is n-type 3C-SiC which has the same crystalline orientation with the Si (111) substrate. Si film grown on the SiC complex substrate under the temperature of 690 °C has the best crystalline quality. This film is composed of p-type monocrystal Si and has the same crystalline orientation with the substrate.

Crystalline Orientation of PbTiO3 Nanorods Grown by MOCVD Using ZnO Nanorods as a Template

2011 ◽  
Vol 1292 ◽  
Author(s):  
Hironori Fujisawa ◽  
Masaru Shimizu ◽  
Ryohei Kuri ◽  
Seiji Nakashima ◽  
Yasutoshi Kotaka ◽  
...  
Keyword(s):  
Vapor Deposition ◽  
Metalorganic Chemical Vapor Deposition ◽  
Zno Nanorods ◽  
Chemical Vapor ◽  
Piezoresponse Force Microscopy ◽  
Xrd Analysis ◽  
X Ray Diffraction ◽  
Crystalline Orientation ◽  
X Ray ◽  
Force Microscopy

ABSTRACTPbTiO3-covered ZnO nanorods were grown on Al2O3$\left({11\bar 20} \right)$ by metalorganic chemical vapor deposition (MOCVD), and their crystalline orientation was investigated by x-ray diffraction (XRD). Structural analysis by scanning electron microscopy and XRD revealed that the hexagonal ZnO nanorods had $\left\{ {10\bar 10} \right\}$-side facets. XRD analysis of PbTiO3 thin films on ZnO$\left({10\bar 10} \right)$/Al2O3$\left({10\bar 10} \right)$revealed that PbTiO3 was epitaxially grown on ZnO$\left({10\bar 10} \right)$, showing 6 variants of crystallites with the c-axis tilted either 27o or 69o from the surface normal to the ZnO$\left({10\bar 10} \right)$ plane. Effective piezoelectric coefficients calculated for the 27o and 69o-crystallites using piezoresponse force microscopy confirm that deformation of nanorods and nanotubes contributed to the large electrically-induced strain along the radial direction.

Aging Effects on the Durability of Tantalum Nitride Films

1997 ◽  
Vol 505 ◽  
Author(s):  
N. R. Moody ◽  
D. Medlin ◽  
D. Boehme ◽  
D. Norwood
Keyword(s):  
Sputter Deposition ◽  
Tantalum Nitride ◽  
X Ray Diffraction ◽  
Aging Effects ◽  
Subsequent Aging ◽  
X Ray ◽  
Sputter Deposited ◽  
Compressive Residual Stresses ◽  
Deposited Films

ABSTRACTIn this study, nanoindentation and nanoscratch testing were used to determine the effects of annealing and long term aging on the properties and fracture resistance of thin tantalum nitride resistor films on aluminum nitride substrates. These films were sputter-deposited to a thickness of 440 nm. Some films were left in the as-deposited condition while others were annealed or annealed and then aged. X-ray diffraction revealed that sputter deposition created high compressive residual stresses in the as-deposited films which were partially relieved by annealing. Subsequent aging of the annealed films had no effect on residual stress levels. Nanoindentation showed that mechanical properties were unchanged after annealing and after annealing and aging. However, nanoscratch testing showed that annealing markedly reduced the susceptibility to catastrophic failure with no further changes discernible after aging.

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