scholarly journals The use of quality tools to reduce surface defects of painted steel structures

Author(s):  
Krzysztof Knop
2012 ◽  
Vol 504-506 ◽  
pp. 901-906 ◽  
Author(s):  
Antti Määttä ◽  
Antti Järvenpää ◽  
Matias Jaskari ◽  
Kari Mäntyjärvi ◽  
Jussi A. Karjalainen

The use of ultra-high-strength steels (UHS) has become more and more popular within last decade. Higher strength levels provide lighter and more robust steel structures, but UHS-steels are also more sensitive to surface defects (e.g. scratches). Practically this means that the critical crack size decreases when the strength increases. The aim of the study was to study if the formula of critical crack size is valid on forming processes of UHS-steels. Surface cracks with different depths were created by scratching the surface of the sheet by machining center. Effect of the scratch depth was determined by bending the specimens to 90 degrees. Bents were then visually compared and classified by the minimum achieved bending radius. Test materials used were direct quenched (DQ) bainitic-martensitic UHS steels (YS/TS 960/1000 and 1100/1250). Results from the bending tests were compared to the calculated values given by the formula of critical crack size.


Author(s):  
J. Efrai´n Rodri´guez-Sa´nchez ◽  
William D. Dover ◽  
Feargal P. Brennan

A crack removal has the purpose to stop crack propagation and prevent future crack reinitiation, thus fatigue life of the component is extended. A profile design for the removal of fatigue cracks that grow under bending loading is presented. The design is based on the preferred shape development of surface defects under bending loading. Preferred shape development of surface defects was experimentally identified and validated with observations previously reported by other authors. The design of a crack removal profile consists on determining a notch geometry and its dimensions to cut out a crack. The crack removal profile presented here induces crack reinitiation, if it would occur, on the surface plate at the notch ends rather than in the bottom of the notch, so original plate thickness is reinstalled for propagation and inspection is easier. This repair procedure is recommended for the removal of fatigue cracks in tubular joints of offshore jackets steel structures.


Robotica ◽  
2018 ◽  
Vol 37 (5) ◽  
pp. 947-967 ◽  
Author(s):  
Hung Manh La ◽  
Tran Hiep Dinh ◽  
Nhan Huu Pham ◽  
Quang Phuc Ha ◽  
Anh Quyen Pham

SummaryThis paper presents visual and 3D structure inspection for steel structures and bridges using a developed climbing robot. The robot can move freely on a steel surface, carry sensors, collect data and then send to the ground station in real-time for monitoring as well as further processing. Steel surface image stitching and 3D map building are conducted to provide a current condition of the structure. Also, a computer vision-based method is implemented to detect surface defects on stitched images. The effectiveness of the climbing robot's inspection is tested in multiple circumstances to ensure strong steel adhesion and successful data collection. The detection method was also successfully evaluated on various test images, where steel cracks could be automatically identified, without the requirement of some heuristic reasoning.


Author(s):  
Kenneth R. Lawless

One of the most important applications of the electron microscope in recent years has been to the observation of defects in crystals. Replica techniques have been widely utilized for many years for the observation of surface defects, but more recently the most striking use of the electron microscope has been for the direct observation of internal defects in crystals, utilizing the transmission of electrons through thin samples.Defects in crystals may be classified basically as point defects, line defects, and planar defects, all of which play an important role in determining the physical or chemical properties of a material. Point defects are of two types, either vacancies where individual atoms are missing from lattice sites, or interstitials where an atom is situated in between normal lattice sites. The so-called point defects most commonly observed are actually aggregates of either vacancies or interstitials. Details of crystal defects of this type are considered in the special session on “Irradiation Effects in Materials” and will not be considered in detail in this session.


Author(s):  
D.P. Malta ◽  
S.A. Willard ◽  
R.A. Rudder ◽  
G.C. Hudson ◽  
J.B. Posthill ◽  
...  

Semiconducting diamond films have the potential for use as a material in which to build active electronic devices capable of operating at high temperatures or in high radiation environments. A major goal of current device-related diamond research is to achieve a high quality epitaxial film on an inexpensive, readily available, non-native substrate. One step in the process of achieving this goal is understanding the nucleation and growth processes of diamond films on diamond substrates. Electron microscopy has already proven invaluable for assessing polycrystalline diamond films grown on nonnative surfaces.The quality of the grown diamond film depends on several factors, one of which is the quality of the diamond substrate. Substrates commercially available today have often been found to have scratched surfaces resulting from the polishing process (Fig. 1a). Electron beam-induced current (EBIC) imaging shows that electrically active sub-surface defects can be present to a large degree (Fig. 1c). Growth of homoepitaxial diamond films by rf plasma-enhanced chemical vapor deposition (PECVD) has been found to planarize the scratched substrate surface (Fig. 1b).


Author(s):  
S. Yegnasubramanian ◽  
V.C. Kannan ◽  
R. Dutto ◽  
P.J. Sakach

Recent developments in the fabrication of high performance GaAs devices impose crucial requirements of low resistance ohmic contacts with excellent contact properties such as, thermal stability, contact resistivity, contact depth, Schottky barrier height etc. The nature of the interface plays an important role in the stability of the contacts due to problems associated with interdiffusion and compound formation at the interface during device fabrication. Contacts of pure metal thin films on GaAs are not desirable due to the presence of the native oxide and surface defects at the interface. Nickel has been used as a contact metal on GaAs and has been found to be reactive at low temperatures. Formation Of Ni2 GaAs at 200 - 350C is reported and is found to grow epitaxially on (001) and on (111) GaAs, but is shown to be unstable at 450C. This paper reports the investigations carried out to understand the microstructure, nature of the interface and composition of sputter deposited and annealed (at different temperatures) Ni-Sb ohmic contacts on GaAs by TEM. Attempts were made to correlate the electrical properties of the films such as the sheet resistance and contact resistance, with the microstructure. The observations are corroborated by Scanning Auger Microprobe (SAM) investigations.


Author(s):  
Feng Tsai ◽  
J. M. Cowley

Reflection electron microscopy (REM) has been used to study surface defects such as surface steps, dislocations emerging on crystal surfaces, and surface reconstructions. However, only a few REM studies have been reported about the planar defects emerging on surfaces. The interaction of planar defects with surfaces may be of considerable practical importance but so far there seems to be only one relatively simple theoretical treatment of the REM contrast and very little experimental evidence to support its predications. Recently, intersections of both 90° and 180° ferroelectric domain boundaries with BaTiO3 crystal surfaces have been investigated by Tsai and Cowley with REM.The REM observations of several planar defects, such as stacking faults and domain boundaries have been continued by the present authors. All REM observations are performed on a JEM-2000FX transmission electron microscope. The sample preparations may be seen somewhere else. In REM, the incident electron beam strikes the surface of a crystal with a small glancing angle.


Author(s):  
J.T. Czernuszka ◽  
N.J. Long ◽  
P.B. Hirsch

In the 1970s there was considerable interest in the development of the electron channelling contrast imaging (ECCI) technique for imaging near surface defects in bulk (electron opaque) specimens. The predictions of the theories were realised experimentally by Morin et al., who used a field emission gun (FEG) operating at 40-50kV and an energy filter such that only electrons which had lost no more than a few 100V were detected. This paper presents the results of a set of preliminary experiments which show that an energy filter system is unneccessary to image and characterise the Burgers vectors of dislocations in bulk specimens. The examples in the paper indicatethe general versatility of the technique.A VG HB501 STEM with a FEG was operated at 100kV. A single tilt cartridge was used in the reflection position of the microscope. A retractable back-scattered electron detector was fitted into the secondary electron port and positioned to within a few millimetres of the specimen. The image was acquired using a Synoptics Synergy framestore and digital scan generator and subsequently processed using Semper 6. The beam divergence with the specimen in this position was 2.5 mrads with a spot size of approximately 4nm. Electron channelling patterns were used to orientate the sample.


Author(s):  
Mohan Krishnamurthy ◽  
Jeff S. Drucker ◽  
John A. Venablest

Secondary Electron Imaging (SEI) has become a useful mode of studying surfaces in SEM[1] and STEM[2,3] instruments. Samples have been biassed (b-SEI) to provide increased sensitivity to topographic and thin film deposits in ultra high vacuum (UHV)-SEM[1,4]; but this has not generally been done in previous STEM studies. The recently developed UHV-STEM ( codenamed MIDAS) at ASU has efficient collection of secondary electrons using a 'parallelizer' and full sample preparation system[5]. Here we report in-situ deposition and annealing studies on the Ge/Si(100) epitaxial system, and the observation of surface steps on vicinal Si(100) using b-SEI under UHV conditions in MIDAS.Epitaxial crystal growth has previously been studied using SEM and SAM based experiments [4]. The influence of surface defects such as steps on epitaxial growth requires study with high spatial resolution, which we report for the Ge/Si(100) system. Ge grows on Si(100) in the Stranski-Krastonov growth mode wherein it forms pseudomorphic layers for the first 3-4 ML (critical thickness) and beyond which it clusters into islands[6]. In the present experiment, Ge was deposited onto clean Si(100) substrates misoriented 1° and 5° toward <110>. This was done using a mini MBE Knudsen cell at base pressure ~ 5×10-11 mbar and at typical rates of 0.1ML/min (1ML =0.14nm). Depositions just above the critical thickness were done for substrates kept at room temperature, 375°C and 525°C. The R T deposits were annealed at 375°C and 525°C for various times. Detailed studies were done of the initial stages of clustering into very fine (∼1nm) Ge islands and their subsequent coarsening and facetting with longer anneals. From the particle size distributions as a function of time and temperature, useful film growth parameters have been obtained. Fig. 1 shows a b-SE image of Ge island size distribution for a R T deposit and anneal at 525°C. Fig.2(a) shows the distribution for a deposition at 375°C and Fig.2(b) shows at a higher magnification a large facetted island of Ge. Fig.3 shows a distribution of very fine islands from a 525°C deposition. A strong contrast is obtained from these islands which are at most a few ML thick and mottled structure can be seen in the background between the islands, especially in Fig.2(a) and Fig.3.


Sign in / Sign up

Export Citation Format

Share Document