scholarly journals Microstructure and Properties of Ultrasonic Assisted Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joint S Under Thermal Cycling

2021 ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Thermal Shock Test ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Mixed Fracture ◽  
Reliability Of Solder Joints ◽  
Thermal Cycling Process

Abstract Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu(x=0, 0.05, 0.1) soldering test and -40~125℃ thermal shock test, the microstructure and mechanical properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS andXRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). The addition of an appropriate amount of Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. Under the condition of 1000 cycles of thermal cycling, the thickness and roughness of IMC of the solder joints with 0.05 wt.% Ni were the smallest, and the shear strength of the solder joints was 19.8 MPa, which was 28.6% higher than that of the solder joints without Ni.The interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni) 6Sn5 and Cu3Sn. In the thermal cycling, the thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, the thickness and roughness of IMC increased obviously, the defects such as microcracks and microvoids began to appear, and the shear strength of the solder joints decreased rapidly.The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile-brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

Interaction of thermal cycling and electric current on reliability of solder joints in different solder balls

2019 ◽  
Vol 6 (10) ◽  
pp. 106302 ◽  
Author(s):  
Yufeng Jiao ◽  
Kittisak Jermsittiparsert ◽  
Aleksandr Yu Krasnopevtsev ◽  
Qahtan A Yousif ◽  
Mohammad Salmani
Keyword(s):  
Thermal Cycling ◽  
Electric Current ◽  
Solder Joints ◽  
Solder Balls ◽  
Reliability Of Solder Joints

Effects of SiC nanowires on reliability of Sn58Bi-0.05GNSs/Cu solder joints

2020 ◽  
pp. 2150007
Author(s):  
Nan Jiang ◽  
Liang Zhang ◽  
Kai-Kai Xu ◽  
Mu-Lan Li ◽  
Feng-Jiang Wang
Keyword(s):  
Shear Strength ◽  
Powder Metallurgy ◽  
Melting Temperature ◽  
Composite Solder ◽  
Solder Joints ◽  
Shear Properties ◽  
Wetting Behavior ◽  
Sic Nanowires ◽  
Reliability Of Solder Joints ◽  
Powder Metallurgy Route

In this work, SiC nanowires (SiC NWs) reinforced SBG (Sn-58Bi-0.05GNSs) composite solder was prepared using powder metallurgy route. The effect of SiC NWs on melting temperature, wetting behavior, shear properties, microstructure of the prepared solder joints and interfacial reaction were studied in detail. Results reveal that incorporating SiC NWs can develop the wetting behavior and shear properties of solder joint but has a little effect on melting temperature. The microstructure of solder is refined markedly with the addition of SiC NWs, which is one of the reasons for the increase in the shear strength of the solder joints. Additionally, the dimension of Cu6Sn5 IMC grains diminishes with the doping of SiC NWs, which resulted in the thinning of Cu6Sn5 IMC layer. Thence, the addition of SiC NWs may be an effective way to improve the reliability of solder joints.

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xinmeng Zhai ◽  
Yue Chen ◽  
Yuefeng Li
Keyword(s):  
Shear Strength ◽  
Composite Solder ◽  
Solder Joints ◽  
Layer Growth ◽  
Nano Particles ◽  
Content Type ◽  
Aging Conditions ◽  
Multi Walled Carbon Nanotubes ◽  
Reliability Of Solder Joints ◽  
Effects Of Aging

Purpose The purpose of this paper is to develop a new composite solder to improve the reliability of composite solder joints. Nano-particles modified multi-walled carbon nanotubes (Ni-MWCNTs) can indeed improve the microstructure of composite solder joints and improve the reliability of solder joints. Although many people have conducted in-depth research on the composite solder of Ni-MWCNTs. However, no one has studied the performance of Ni-MWCNTs composite solder under different aging conditions. In this article, Ni-MWCNTs was added to Sn-Ag-Cu (SAC) solder, and the physical properties of composite solder, the microstructure and mechanical properties were evaluated. Design/methodology/approach In this study, the effect of different aging conditions on the intermetallic compound (IMC) layer growth and shear strength of Ni-modified MWCNTs reinforced SAC composite solder was studied. Compared with SAC307 solder alloy, the influence of Ni-MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on composite solder was examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 80°C, 120°C and 150°C. Findings The experimental results show that the content of Ni-MWCNTs affects the morphology and growth of the IMC layer at the interface. The microhardness of the solder increases and the wetting angle decreases. After aging at moderate (120°C) and high temperature (150°C), the morphology of the Cu6Sn5 IMC layer changed from scallop to lamellar and the grain size became coarser. The following two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu3Sn and (Cu, Ni)6Sn5. The fracture surface of the solder joints all appeared ductile dents, and the size of the pits increased significantly with the increase of the aging temperature. Through growth kinetic analysis, Ni-modified MWCNTs in composite solder joints can effectively inhibit the diffusion of atoms in solder joints. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the highest shear strength. Originality/value In this study, the effects of aging conditions on the growth and shear strength of the IMC layer of Ni modified MWCNTs reinforced SAC307 composite solder were studied. The effects of Ni MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on the composite solder were examined.

scholarly journals Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints

2018 ◽  
Vol 2018 ◽  
pp. 1-6
Author(s):  
Tatsuya Kobayashi ◽  
Ikuo Shohji ◽  
Yusuke Nakata
Keyword(s):  
Growth Kinetics ◽  
Aging Temperature ◽  
Solder Joints ◽  
High Reliability ◽  
Power Cycles ◽  
Power Cycle ◽  
Cycling Test ◽  
Power Cycling ◽  
Reliability Of Solder Joints ◽  
Kinetics Of

Power cycle reliability of solder joints with Sn-5Sb (mass%) and Sn-10Sb (mass%) alloys was investigated. The effects of power cycling and heat aging on the growth of intermetallic compound (IMC) layers at the interfaces between Sn-Sb alloys and Cu plates were also investigated. In the power cycling test, the solder joint with Sn-10Sb has high reliability compared with that of Sn-5Sb. IMC layers grew in both joints with increasing number of power cycles. Compared with Sn-5Sb and Sn-10Sb, difference in growth kinetics of IMC layers was negligible. A similar tendency was observed in the heat aging test. Compared with the power cycling and the heat aging, growth of IMC layers at the aging temperature of 200°C is faster than that in the power cycling test at the temperature range of 100°C to 200°C, while that at the aging temperature of 100°C, the growth is slower. On the basis of the comparison between the power cycling and the heat aging, it was clarified that growth kinetics of IMC layers in the power cycling can be predicted by investigating growth kinetics of the IMC layer at the temperatures in the vicinity of the peak temperature in power cycling.

Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices

2003 ◽  
Author(s):  
Guo-Quan Lu ◽  
Xingsheng Liu ◽  
Sihua Wen ◽  
Jesus Noel Calata ◽  
John G. Bai
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Flip Chip ◽  
Solder Joints ◽  
Mechanical Stresses ◽  
Flexible Substrates ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Reliability Of Solder Joints

There has been a significant research effort on area-array flip-chip solder joint technology in order to reduce package footprint, enhance current handling capability, and improve heat dissipation. However, there is a lingering concern over cyclic fatigue of solder alloys by thermo-mechanical stresses arising from mismatched thermal expansion coefficients of expansion among the various components of the package. In this paper, some strategies taken to improve the reliability of solder joints on power devices in single-device and multi-chip packages are presented. A strategy for improving solder joint reliability by adjusting solder joint geometry, underfilling and utilization of flexible substrates is discussed with emphasis on triple-stacked solder joints that resemble the shape of an hourglass. The hourglass shape relocates the highest inelastic strain away from the weaker interface with the chip to the bulk region of the joint while the underfill provides a load transfer from the joints. Flexible substrates can deform to relieve thermo-mechanical stresses. Thermal cycling data show significant improvements in reliability when these techniques are used. The design, testing, and finite-element analyses of an interconnection structure, termed the Dimple-Array Interconnect (DAI), for improving the solder joint reliability is also presented. In the DAI structure, a solder is used to join arrays of dimples pre-formed on a metal sheet onto the bonding pads of a device. Finite-element thermo-mechanical analyses and thermal cycling data show that the dimple-array solder joints are more fatigue-resistant than the conventional barrel-shaped solder joints in flip-chip IC packages.

Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBs

2015 ◽  
Vol 27 (3) ◽  
pp. 120-124 ◽  
Author(s):  
Janusz Sitek ◽  
Aneta Araźna ◽  
Kamil Janeczek ◽  
Wojciech Stęplewski ◽  
Krzysztof Lipiec ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Circuit Board ◽  
Circuit Boards ◽  
Thermal Cycles ◽  
Metal Core ◽  
Content Type ◽  
Printed Circuit ◽  
Reliability Of Solder Joints

Purpose – The purpose of this paper is to evaluate the reliability of solder joints made on long FR-4 and metal core printed circuit boards using the accelerated thermal cycling. Design/methodology/approach – Solder joints of diodes and resistors samples made on long FR-4 and aluminum (Al) core printed circuit boards were examined. Two kinds of solder pastes were used for the samples preparation. All samples were subjected to temperature aging cycles (−40°C – 3 hours/+85°C – 3 hours). Solder joints resistance, X-Ray inspection and metallographic cross-sections for samples as received and after 100, 500 and 1,000 hours of thermal cycles were utilized for solder joints assessment. Findings – It was stated that 1,000 hours of thermal cycles were enough to show reliability problems in solder joints on long and/or AL core printed circuit board assembly (PCBA). The solder joints of R1206 components were the most sensitive reliability elements. The solder joints of LED diodes are more reliable than solder joints of R1206 resistors. Solder joints made on FR-4 substrate were about two times more reliable than ones on AL core substrate. Cracks in solder joints were the visible reason of solder joints failures. Originality/value – The influence of thermal cycles on the reliability of solder joints on long, FR-4 and metal core printed circuit boards were presented. Findings from this paper can be used for planning of reliability trials during validation of reflow processes of products containing long or long metal core printed circuit boards (PCBs).

Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading

1999 ◽  
Vol 121 (2) ◽  
pp. 61-68 ◽  
Author(s):  
R. Chandaroy ◽  
C. Basaran
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Failure Mode ◽  
Dynamic Loading ◽  
Damage Mechanics ◽  
Solder Joints ◽  
Inelastic Strain ◽  
Simultaneous Application ◽  
Reliability Of Solder Joints

In the electronic industry, the dominant failure mode for solder joints is assumed to be thermal cycling. When semiconductor devices are used in vibrating environment, such as automotive and military applications, dynamic stresses contribute to the failure mechanism of the solder joint, and can become the dominant failure mode. In this paper, a damage mechanics based unified constitutive model for Pb40/Sn60 solder joints has been developed to accurately predict the thermomechanical behavior of solder joints under concurrent thermal and dynamic loading. It is shown that simultaneous application of thermal and dynamic loads significantly shorten the fatigue life. Hence, damage induced in the solder joint by the vibrations have to be included, in fatigue life predictions to correctly predict the reliability of solder joints. The common practice of relating only thermal cycling induced inelastic strain to fatigue life can be inadequate to predict solder joint reliability. A series of parametric studies were conducted to show that contrary to popular opinion all dynamic loading induced strains are not elastic. Hence, vibrations can significantly affect the fatigue life and reliability of solder joints in spite of their small mass.

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