Reliability of solder joints assessed by acoustic imaging during accelerated thermal cycling

2010 ◽  
Author(s):  
Ryan S.H. Yang ◽  
David M. Harvey ◽  
Guang-Ming Zhang ◽  
Derek R. Braden
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Acoustic Imaging ◽  
Reliability Of Solder Joints ◽  
Accelerated Thermal Cycling

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

2007 ◽  
Author(s):  
X. Long ◽  
I. Dutta ◽  
R. Guduru ◽  
R. Prasanna ◽  
M. Pacheco
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Inelastic Strain ◽  
Fatigue Reliability ◽  
Element Analysis ◽  
Mechanical Cycling ◽  
Experimental Apparatus ◽  
Dependent Strain ◽  
Accelerated Thermal Cycling

A thermo-mechanical loading system, which can superimpose a temperature and location dependent strain on solder joints, is proposed in order to conduct highly accelerated thermal-mechanical cycling (HATC) tests to assess thermal fatigue reliability of Ball Grid Array (BGA) solder joints in microelectronics packages. The application of this temperature and position dependent strain produces generally similar loading modes (shear and tension) encountered by BGA solder joints during service, but substantially enhances the inelastic strain accumulated during thermal cycling over the same temperature range as conventional ATC (accelerated thermal cycling) tests, thereby leading to a substantial acceleration of low-cycle fatigue damage. Finite element analysis was conducted to aid the design of experimental apparatus and to predict the fatigue life of solder joints in HATC testing. Detailed analysis of the loading locations required to produce failure at the appropriate joint (next to the die-edge ball) under the appropriate tension/shear stress partition are presented. The simulations showed that the proposed HATC test constitutes a valid methodology for further accelerating conventional ATC tests. An experimental apparatus, capable of applying the requisite loads to a BGA package was constructed, and experiments were conducted under both HATC and ATC conditions. It is shown that HATC proffers much reduced cycling times compared to ATC.

Interaction of thermal cycling and electric current on reliability of solder joints in different solder balls

2019 ◽  
Vol 6 (10) ◽  
pp. 106302 ◽  
Author(s):  
Yufeng Jiao ◽  
Kittisak Jermsittiparsert ◽  
Aleksandr Yu Krasnopevtsev ◽  
Qahtan A Yousif ◽  
Mohammad Salmani
Keyword(s):  
Thermal Cycling ◽  
Electric Current ◽  
Solder Joints ◽  
Solder Balls ◽  
Reliability Of Solder Joints

scholarly journals Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

2021 ◽  
Author(s):  
Joshua A. Depiver ◽  
Sabuj Mallik ◽  
Yiling Lu ◽  
Emeka H. Amalu
Keyword(s):  
Energy Density ◽  
Thermal Cycling ◽  
Strain Rate ◽  
Deformation Rate ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Solder Joints ◽  
Creep Fatigue ◽  
Accelerated Thermal Cycling ◽  
Isothermal Ageing

Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly’s heart lies the ‘soldering technology’ and the ‘solder joints’ between electronic components and substrate. During the operation of electronic products, solder joints experience harsh environmental conditions in terms of cyclic change of temperature and vibration and exposure to moisture and chemicals. Due to the cyclic application of loads and higher operational temperature, solder joints fail primarily through creep and fatigue failures. This paper presents the creep-fatigue behaviours of solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB). Using finite element (FE) simulation, the solder joints were subjected to thermal cycling and isothermal ageing. Accelerated thermal cycling (ATC) was carried out using a temperate range from 40°C to 150°C, and isothermal ageing was done at −40, 25, 75 and 150°C temperatures for 45 days (64,800 mins). The solders studied are lead-based eutectic Sn63Pb37 and lead-free SAC305, SAC387, SAC396 and SAC405. The results were analysed using the failure criterion of equivalent stress, strain rate, deformation rate, and the solders’ strain energy density. The SAC405 and SAC396 have the least stress magnitude, strain rate, deformation rate, and strain energy density damage than the lead-based eutectic Sn63Pb37 solder; they have the highest fatigue lives based on the damage mechanisms. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. Furthermore, it proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.

Effect of Selected Manufacturing Variables on Reliability of Lead Free Solder Joints

2006 ◽  
Author(s):  
Leila Jannesari Ladani ◽  
Abhijit Dasgupta ◽  
Idelcio Cardoso ◽  
Eduardo Monlevade
Keyword(s):  
Thermal Cycling ◽  
Waiting Time ◽  
Solder Joints ◽  
Lead Free ◽  
Electrical Performance ◽  
Lead Free Solder ◽  
X Rays ◽  
Response Variable ◽  
Accelerated Thermal Cycling ◽  
Free Solder

This paper presents a systematic approach to study the effect of manufacturing variables on the creation of defects and the effect of those defects on the durability of lead free solder joints. An experiment was designed to systematically vary the reflow and printing process variables in order to fabricate error-seeded test assemblies. The error-seeded samples were then inspected visually and with x-rays, to identify different types of defects, and tested for electrical performance. The specimens were put under accelerated thermal cycling test to characterize the durability of specimens and to study the effect of each manufacturing variable on the durability of solder joints. Thus, the response variable for the design of experiments is the thermal cycling durability of the solder joints. Pre-test micro-structural analysis shows that specimens produced under inadequate reflow profiles suffer from insufficient wetting and insufficient intermetallic formation. Statistical analysis of the response variable shows that waiting time, heating ramp, peak temperature and cooling rate have non-linear effects on the response variable. Two variables, in particular (the heating ramp time and the waiting time), appear to have optimum values within the ranges investigated.

Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints

2006 ◽  
Vol 46 (2-4) ◽  
pp. 574-588 ◽  
Author(s):  
Yan Qi ◽  
Rex Lam ◽  
Hamid R. Ghorbani ◽  
Polina Snugovsky ◽  
Jan K. Spelt
Keyword(s):  
Thermal Cycling ◽  
Temperature Profile ◽  
Solder Joints ◽  
Accelerated Thermal Cycling ◽  
Free Solder

Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices

2003 ◽  
Author(s):  
Guo-Quan Lu ◽  
Xingsheng Liu ◽  
Sihua Wen ◽  
Jesus Noel Calata ◽  
John G. Bai
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Flip Chip ◽  
Solder Joints ◽  
Mechanical Stresses ◽  
Flexible Substrates ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Reliability Of Solder Joints

There has been a significant research effort on area-array flip-chip solder joint technology in order to reduce package footprint, enhance current handling capability, and improve heat dissipation. However, there is a lingering concern over cyclic fatigue of solder alloys by thermo-mechanical stresses arising from mismatched thermal expansion coefficients of expansion among the various components of the package. In this paper, some strategies taken to improve the reliability of solder joints on power devices in single-device and multi-chip packages are presented. A strategy for improving solder joint reliability by adjusting solder joint geometry, underfilling and utilization of flexible substrates is discussed with emphasis on triple-stacked solder joints that resemble the shape of an hourglass. The hourglass shape relocates the highest inelastic strain away from the weaker interface with the chip to the bulk region of the joint while the underfill provides a load transfer from the joints. Flexible substrates can deform to relieve thermo-mechanical stresses. Thermal cycling data show significant improvements in reliability when these techniques are used. The design, testing, and finite-element analyses of an interconnection structure, termed the Dimple-Array Interconnect (DAI), for improving the solder joint reliability is also presented. In the DAI structure, a solder is used to join arrays of dimples pre-formed on a metal sheet onto the bonding pads of a device. Finite-element thermo-mechanical analyses and thermal cycling data show that the dimple-array solder joints are more fatigue-resistant than the conventional barrel-shaped solder joints in flip-chip IC packages.

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