scholarly journals Влияние давления при эпитаксии на свойства слоев GaN

Author(s):  
А.В. Сахаров ◽  
В.В. Лундин ◽  
Е.Е. Заварин ◽  
С.О. Усов ◽  
П.Н. Брунков ◽  
...  

Growth of GaN layers by MOVPE on sapphire substrates at various pressures, including above atmospheric, was studied. It is shown that epitaxy at higher pressures does not change the crystal perfection of the layers, the electron mobility, and the impurities incorporation, but leads to the formation of a surface with a smaller lateral scale of inhomogeneities. The epitaxy pressure also affects the ratio of the intensity of the band-edge and impurity-related lines in the photoluminescence spectra and the leakage currents in the reverse-biased Schottky barrier.

Author(s):  
В.В. Лундин ◽  
А.В. Сахаров ◽  
Е.Е. Заварин ◽  
Д.А. Закгейм ◽  
А.Е. Николаев ◽  
...  

AbstractAlGaN/AlN/GaN and InAlN/AlN/GaN structures with 2D electron gas have been grown on sapphire substrates by metal-organic vapor-phase epitaxy. The suppression of the parasitic conductivity of buffer GaN layers was provided either by intentionally raising the density of edge dislocations or by doping with iron (GaN:Fe). It was shown that using GaN buffer layers with a better crystal perfection and more planar surface results in the electron mobility in the 2D channel for carriers becoming 1.2–1.5 times higher.


2009 ◽  
Vol 56 (3) ◽  
pp. 499-504 ◽  
Author(s):  
Muhammad Khaled Husain ◽  
Xiaoli V. Li ◽  
Cornelis Hendrik de Groot

2013 ◽  
Vol 740-742 ◽  
pp. 881-886 ◽  
Author(s):  
Hiroyuki Okino ◽  
Norifumi Kameshiro ◽  
Kumiko Konishi ◽  
Naomi Inada ◽  
Kazuhiro Mochizuki ◽  
...  

The reduction of reverse leakage currents was attempted to fabricate 4H-SiC diodes with large current capacity for high voltage applications. Firstly diodes with Schottky metal of titanium (Ti) with active areas of 2.6 mm2 were fabricated to investigate the mechanisms of reverse leakage currents. The reverse current of a Ti Schottky barrier diode (SBD) is well explained by the tunneling current through the Schottky barrier. Then, the effects of Schottky barrier height and electric field on the reverse currents were investigated. The high Schottky barrier metal of nickel (Ni) effectively reduced the reverse leakage current to 2 x 10-3 times that of the Ti SBD. The suppression of the electric field at the Schottky junction by applying a junction barrier Schottky (JBS) structure reduced the reverse leakage current to 10-2 times that of the Ni SBD. JBS structure with high Schottky barrier metal of Ni was applied to fabricate large chip-size SiC diodes and we achieved 30 A- and 75 A-diodes with low leakage current and high breakdown voltage of 4 kV.


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