Special features of aerial survey technology using unmanned aircraft

2020 ◽  
Vol 962 (8) ◽  
pp. 58-64
Author(s):  
A.F. Varfolomeev ◽  
E.A. Kovalenko ◽  
V.F. Manukhov ◽  
L.G. Kalashnikova
Keyword(s):  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
Aerial Survey ◽  
Geodetic Survey ◽  
Unmanned Aircraft ◽  
Construction Sites ◽  
Design Work ◽  
Terrain Models ◽  
High Performance Systems

In recent years, there have been qualitative changes in surveying associated with the use of robotic systems, such as unmanned aerial vehicles. Currently, traditional geodetic and topographic technologies are giving way to high-precision and high-performance systems using robotics. The technology of aerial photography from drones for mapping territories, operational monitoring linear structures, construction sites, as well as for engineering and underground surveys, solving cadastral matters, building realistic three-dimensional terrain models, etc., is gaining more and more popularity in the world. The transition to new technologies entails restructuring not only the methods of determining coordinates, but also the stages of pre-design and design work. The authors describes the capabilities of geographic information systems for automating some stages of field geodetic data cameral processing obtained through using unmanned aircraft. As a result of the study, it was discovered that the marks of the earth’s surface, read from the constructed digital map, are in good agreement with those obtained as a result of the ground-based geodetic survey.

scholarly journals 3D Printing of High Viscosity Reinforced Silicone Elastomers

Polymers ◽  
2021 ◽  
Vol 13 (14) ◽  
pp. 2239
Author(s):  
Nicholas Rodriguez ◽  
Samantha Ruelas ◽  
Jean-Baptiste Forien ◽  
Nikola Dudukovic ◽  
Josh DeOtte ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Viscosity ◽  
Layer By Layer ◽  
Silicone Elastomers ◽  
Uv Curable ◽  
Octet Truss ◽  
Tunable Mechanical Properties

Recent advances in additive manufacturing, specifically direct ink writing (DIW) and ink-jetting, have enabled the production of elastomeric silicone parts with deterministic control over the structure, shape, and mechanical properties. These new technologies offer rapid prototyping advantages and find applications in various fields, including biomedical devices, prosthetics, metamaterials, and soft robotics. Stereolithography (SLA) is a complementary approach with the ability to print with finer features and potentially higher throughput. However, all high-performance silicone elastomers are composites of polysiloxane networks reinforced with particulate filler, and consequently, silicone resins tend to have high viscosities (gel- or paste-like), which complicates or completely inhibits the layer-by-layer recoating process central to most SLA technologies. Herein, the design and build of a digital light projection SLA printer suitable for handling high-viscosity resins is demonstrated. Further, a series of UV-curable silicone resins with thiol-ene crosslinking and reinforced by a combination of fumed silica and MQ resins are also described. The resulting silicone elastomers are shown to have tunable mechanical properties, with 100–350% elongation and ultimate tensile strength from 1 to 2.5 MPa. Three-dimensional printed features of 0.4 mm were achieved, and complexity is demonstrated by octet-truss lattices that display negative stiffness.

scholarly journals A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-Via and Solder Bumping Process

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Density ◽  
Internal Stresses ◽  
Deep Reactive Ion Etching ◽  
Fifth Generation ◽  
Precise Understanding ◽  
Fabrication Defects

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

Polyamide 4T: A New Lead-Free Solderable Polymer Enabling Packaging Technology Through Micro Molding and LDS

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001563-001584
Author(s):  
Tamim Sidiki
Keyword(s):  
Value Chain ◽  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
New Technology ◽  
Three Dimensional ◽  
Common Mode ◽  
Packaging Technology ◽  
Semiconductor Chip ◽  
High Flexibility

The continuous trend towards convergence and miniaturization is recently generating significant interest in new technologies for Electronics. This requires the integration of Semiconductors and Magnetics, two entirely different industries with different players in the value chain. In this paper, we demonstrate, a packaging technology which allows three dimensional stacking of Magnets and Semiconductors. We realized the integration of a Semiconductor chip - which provides protection against electro static discharge (ESD) – and a common mode filter (CMF) into one thermoplastic package. For the first time ever, this filter is integrated directly into the thermoplastic part which is used as the substrate, filter and housing at the same time. Laser direct structuring in combination with Stanyl® ForTiiTM as an ultra high performance, entirely halogen-free high temperature thermoplastic omits any wires for the realized coil, and also facilitates high flexibility in design and manufacturing, allowing ultra small footprints and the realization of components suitable for surface mount technology. As an example of this new technology, we demonstrate a component which can provide full ESD protection and common mode filtering for a high speed USB2.0 interface.

Improved 3-D reconstruction using stereo computer graphics and multiple tilt EM images

1995 ◽  
Vol 53 ◽  
pp. 630-631
Author(s):  
Lee D. Peachey ◽  
Lou Fodor ◽  
John C. Haselgrove ◽  
Stanley M. Dunn ◽  
Junqing Huang
Keyword(s):  
Computer Graphics ◽  
High Performance ◽  
Transverse Section ◽  
Three Dimensional ◽  
Stereo Pair ◽  
3D Reconstructions ◽  
Video Cameras ◽  
Biological Objects ◽  
Microscope Images ◽  
High Performance Computer

Stereo pairs of electron microscope images provide valuable visual impressions of the three-dimensional nature of specimens, including biological objects. Beyond this one seeks quantitatively accurate models and measurements of the three dimensional positions and sizes of structures in the specimen. In our laboratory, we have sought to combine high resolution video cameras with high performance computer graphics systems to improve both the ease of building 3D reconstructions and the accuracy of 3D measurements, by using multiple tilt images of the same specimen tilted over a wider range of angles than can be viewed stereoscopically. Ultimately we also wish to automate the reconstruction and measurement process, and have initiated work in that direction.Figure 1 is a stereo pair of 400 kV images from a 1 micrometer thick transverse section of frog skeletal muscle stained with the Golgi stain. This stain selectively increases the density of the transverse tubular network in these muscle cells, and it is this network that we reconstruct in this example.

The Recent Revolution in High Performance Computing

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 5-6
Author(s):  
Horst D. Simon
Keyword(s):  
High Performance Computing ◽  
High Performance ◽  
New Technologies ◽  
New Technology ◽  
Parallel Architecture ◽  
Time Frame ◽  
Good News ◽  
Computing Industry ◽  
Time And Energy ◽  
Performance Computing

Recent events in the high-performance computing industry have concerned scientists and the general public regarding a crisis or a lack of leadership in the field. That concern is understandable considering the industry's history from 1993 to 1996. Cray Research, the historic leader in supercomputing technology, was unable to survive financially as an independent company and was acquired by Silicon Graphics. Two ambitious new companies that introduced new technologies in the late 1980s and early 1990s—Thinking Machines and Kendall Square Research—were commercial failures and went out of business. And Intel, which introduced its Paragon supercomputer in 1994, discontinued production only two years later.During the same time frame, scientists who had finished the laborious task of writing scientific codes to run on vector parallel supercomputers learned that those codes would have to be rewritten if they were to run on the next-generation, highly parallel architecture. Scientists who are not yet involved in high-performance computing are understandably hesitant about committing their time and energy to such an apparently unstable enterprise.However, beneath the commercial chaos of the last several years, a technological revolution has been occurring. The good news is that the revolution is over, leading to five to ten years of predictable stability, steady improvements in system performance, and increased productivity for scientific applications. It is time for scientists who were sitting on the fence to jump in and reap the benefits of the new technology.

Rationally Designed Three-Dimensional Porous Nico 2n@C Reticular Structure for High-Performance Li-Ion Batteries

2020 ◽  
Author(s):  
Peiyao Wang ◽  
Bangchuan Zhao ◽  
Jin Bai ◽  
Kunzhen Li ◽  
Hongyang Ma ◽  
...  
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Li Ion Batteries ◽  
Reticular Structure ◽  
Li Ion

МЕТОДЫ ДОСТИЖЕНИЯ МАКСИМАЛЬНОЙ ЭФФЕКТИВНОСТИ ПЛАТФОРМЫ ПРОТОТИПИРОВАНИЯ ВЫСОКОПРОИЗВОДИТЕЛЬНЫХ СИСТЕМ НА КРИСТАЛЛЕ НА ЗАДАЧАХ ИСКУССТВЕННОГО ИНТЕЛЛЕКТА

2020 ◽  
Vol 96 (3s) ◽  
pp. 585-588
Author(s):  
С.Е. Фролова ◽  
Е.С. Янакова
Keyword(s):  
Neural Network ◽  
Artificial Intelligence ◽  
Computer Vision ◽  
High Performance ◽  
Systems On Chip ◽  
High Performance Systems ◽  
On Chip ◽  
Network Technologies ◽  
Neural Network Technologies

Предлагаются методы построения платформ прототипирования высокопроизводительных систем на кристалле для задач искусственного интеллекта. Изложены требования к платформам подобного класса и принципы изменения проекта СнК для имплементации в прототип. Рассматриваются методы отладки проектов на платформе прототипирования. Приведены результаты работ алгоритмов компьютерного зрения с использованием нейросетевых технологий на FPGA-прототипе семантических ядер ELcore. Methods have been proposed for building prototyping platforms for high-performance systems-on-chip for artificial intelligence tasks. The requirements for platforms of this class and the principles for changing the design of the SoC for implementation in the prototype have been described as well as methods of debugging projects on the prototyping platform. The results of the work of computer vision algorithms using neural network technologies on the FPGA prototype of the ELcore semantic cores have been presented.

scholarly journals Polarization-sensitive photodetectors based on three-dimensional molybdenum disulfide (MoS2) field-effect transistors

Nanophotonics ◽  
2020 ◽  
Vol 9 (16) ◽  
pp. 4719-4728
Author(s):  
Tao Deng ◽  
Shasha Li ◽  
Yuning Li ◽  
Yang Zhang ◽  
Jingye Sun ◽  
...  
Keyword(s):  
Molybdenum Disulfide ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Three Dimensional ◽  
Polarized Light ◽  
Optical Field ◽  
Two Dimensional ◽  
Polarization Ratio ◽  
Two Dimensional Materials

AbstractThe molybdenum disulfide (MoS2)-based photodetectors are facing two challenges: the insensitivity to polarized light and the low photoresponsivity. Herein, three-dimensional (3D) field-effect transistors (FETs) based on monolayer MoS2 were fabricated by applying a self–rolled-up technique. The unique microtubular structure makes 3D MoS2 FETs become polarization sensitive. Moreover, the microtubular structure not only offers a natural resonant microcavity to enhance the optical field inside but also increases the light-MoS2 interaction area, resulting in a higher photoresponsivity. Photoresponsivities as high as 23.8 and 2.9 A/W at 395 and 660 nm, respectively, and a comparable polarization ratio of 1.64 were obtained. The fabrication technique of the 3D MoS2 FET could be transferred to other two-dimensional materials, which is very promising for high-performance polarization-sensitive optical and optoelectronic applications.

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