scholarly journals Surface Properties of Intermetallic Compound Layer Formed on Titanium Alloy by AIH-FPP (Atmospheric Controlled Induction Heating Fine Particle Peening) Treatment

2018 ◽  
Vol 59 (9) ◽  
pp. 1452-1457 ◽  
Author(s):  
Shogo Takesue ◽  
Shuya Saito ◽  
Jun Komotori ◽  
Yoshitaka Misaka ◽  
Kazuhiro Kawasaki
Keyword(s):  
Titanium Alloy ◽  
Intermetallic Compound ◽  
Surface Properties ◽  
Induction Heating ◽  
Fine Particle ◽  
Compound Layer ◽  
Intermetallic Compound Layer

Joining Aluminium to Titanium by MIG Welding-Brazing Process

2011 ◽  
Vol 284-286 ◽  
pp. 165-168
Author(s):  
Bo Chen ◽  
Hong Tao Zhang ◽  
Wen Jie Jiang
Keyword(s):  
Tensile Strength ◽  
Titanium Alloy ◽  
Intermetallic Compound ◽  
Weld Metal ◽  
Filler Metal ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Mig Welding ◽  
Lap Joint ◽  
Welding Wire

With Al-Si welding wire ER4043, lap joint between aluminium and titanium alloy was made by MIG welding-brazing process with nocolok flux aiding filler metal in promoting metal wettability. A thin intermetallic compound layer was formed at the interface between the weld metal and titanium alloy and the layer mainly consits of TiAl3 phase. The tensile strength of the joint can reach 151MPa and fracture occurred in aluminium base metal.

Dissimilar Metal Welding of Steel to Al-Mg Alloy by Spot Resistance Welding

2006 ◽  
Vol 15-17 ◽  
pp. 381-386 ◽  
Author(s):  
I.H. Hwang ◽  
Takehiko Watanabe ◽  
Y. Doi
Keyword(s):  
Intermetallic Compound ◽  
Base Metal ◽  
Joint Strength ◽  
Pure Aluminum ◽  
Compound Layer ◽  
Interfacial Microstructure ◽  
Mg Alloy ◽  
Intermetallic Compound Layer ◽  
Commercially Pure ◽  
Insert Metal

We tried to join steel to Al-Mg alloy using a resistance spot welding method. The effect of Mg in Al-Mg alloy on the strength and the interfacial microstructure of the joint was investigated. Additionally, the effect of insert metal of commercially pure aluminum, which was put into the bonding interface, on the joint strength was examined. The obtained results were as follows. The cross-tensile strength of a joint between SS400 steel and commercially pure aluminum (SS400/Al) was high and fracture occurred in the aluminum base metal. However, the strength of a joint between SS400 and Al-Mg alloy was remarkably low and less than 30% of that of the SS400/Al joint. An intermetallic compound layer developed so thickly at the bonded interface of the SS400/Al-Mg alloy joint that the joint strength decreased. The intermetallic compound layer developed more thickly as Mg content in the Al-Mg alloy increased. Using insert metal of commercially pure aluminum containing little Mg successfully improved the strength of the SS400/Al-Mg alloy joint and the strength was equivalent to that of the base metal.

Formation of intermetallic compound layer in multi-laminated Ni–(TiB2/Al) composite sheets during annealing treatment

Micron ◽  
2013 ◽  
Vol 45 ◽  
pp. 150-154 ◽  
Author(s):  
Q.W. Wang ◽  
G.H. Fan ◽  
L. Geng ◽  
J. Zhang ◽  
Y.Z. Zhang ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Annealing Treatment ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Al Composite

Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 546-550 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Contact Angle ◽  
Intermetallic Compound ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Solder Paste ◽  
X Ray Diffraction ◽  
Free Solder ◽  
Sic Particle

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.

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