Thin-Film Absorbing Elements of Adapter-Attenuators for HIC

2021 ◽  
Vol 26 (6) ◽  
pp. 521-532
Author(s):  
A.V. Pilkevich ◽  
◽  
V.D. Sadkov ◽  
Keyword(s):  
Integrated Circuits ◽  
Power Density ◽  
Potential Gradient ◽  
Pulse Mode ◽  
Transformation Coefficient ◽  
Resistive Film ◽  
Input And Output ◽  
Wide Range ◽  
Film Element ◽  
Absorbing Elements

One of the urgent tasks in the design of hybrid integrated circuits (HIC) is the construction of adapter-attenuators – film absorbing elements providing a wide range of attenuations with specified values of input and output resistances. Known variants of adapter-attenuators based on a homogeneous and piecewise homogeneous resistive film provide (by introducing asymmetry in the dimensions of the input and output contacts, changing the location of a piecewise homogeneous resistive film, introducing dielectric or conductive regions) a resistance transformation coefficient of no more than 3 and 10–12, respectively. In this work, promising topologies of adapter-attenuators for HIC with a close to optimal profile of input and output contacts are proposed, which allow not only to obtain a wide range of transformation coefficients (more than 100), but also to reduce the maximum values of the potential gradient and power density by 10‒30 times. The rectangular topology calculations were made using the apparatus of the theory of functions of a complex variable. Modeling of the optimized topology of adapter-attenuators for HIC was carried out by the finite element method implemented in the Elcut software package. The calculated ratios and graphs showing the relationship of attenuation, the transformation coefficient, the gain in the value of the potential gradient and the power density, depending on the ratio of the size of the film element and the resistivity of the resistive films used, have been provided. The features of adapter-attenuators fitting have been considered. The results obtained are especially important for the pulse mode of operation of adapter-attenuators’ film element for HIC.

Microfabrication research at the National Submicron Facility

1983 ◽  
Vol 41 ◽  
pp. 86-89
Author(s):  
E.D. Wolf
Keyword(s):  
Integrated Circuits ◽  
Particle Physics ◽  
High Speed ◽  
New Technology ◽  
High Energy ◽  
High Energy Particle ◽  
New Science ◽  
Wide Range ◽  
Intermediate Domain ◽  
Circuit Function

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.

Electron microscopy study of reactively sputter-deposited Ti/N films on silicon

1992 ◽  
Vol 50 (2) ◽  
pp. 1362-1363
Author(s):  
V. C. Kannan ◽  
A. K. Singh ◽  
R. B. Irwin ◽  
S. Chittipeddi ◽  
F. D. Nkansah ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Hexagonal Phase ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Process Conditions ◽  
Tin Films ◽  
Wide Range ◽  
Fcc Phase ◽  
Circuits Vlsi

Titanium nitride (TiN) films have historically been used as diffusion barrier between silicon and aluminum, as an adhesion layer for tungsten deposition and as an interconnect material etc. Recently, the role of TiN films as contact barriers in very large scale silicon integrated circuits (VLSI) has been extensively studied. TiN films have resistivities on the order of 20μ Ω-cm which is much lower than that of titanium (nearly 66μ Ω-cm). Deposited TiN films show resistivities which vary from 20 to 100μ Ω-cm depending upon the type of deposition and process conditions. TiNx is known to have a NaCl type crystal structure for a wide range of compositions. Change in color from metallic luster to gold reflects the stabilization of the TiNx (FCC) phase over the close packed Ti(N) hexagonal phase. It was found that TiN (1:1) ideal composition with the FCC (NaCl-type) structure gives the best electrical property.

Thermal-aware Output Polarity Selection Based on And-Inverter Graph Manipulation

2019 ◽  
Vol 12 (1) ◽  
pp. 30-39 ◽  
Author(s):  
Apangshu Das ◽  
Sambhu Nath Pradhan
Keyword(s):  
Integrated Circuits ◽  
Power Density ◽  
Logic Synthesis ◽  
Programmable Logic Arrays ◽  
Power Switching ◽  
Nsga Ii ◽  
Multi Level ◽  
Search Approach ◽  
Efficient Power ◽  
The Impact

Background: Output polarity of the sub-function is generally considered to reduce the area and power of a circuit at the two-level realization. Along with area and power, the power-density is also one of the significant parameter which needs to be consider, because power-density directly converges to circuit temperature. More than 50% of the modern day integrated circuits are damaged due to excessive overheating. Methods: This work demonstrates the impact of efficient power density based logic synthesis (in the form of suitable polarity selection of sub-function of Programmable Logic Arrays (PLAs) for its multilevel realization) for the reduction of temperature. Two-level PLA optimization using output polarity selection is considered first and compared with other existing techniques and then And-Invert Graphs (AIG) based multi-level realization has been considered to overcome the redundant solution generated in two-level synthesis. AIG nodes and associated power dissipation can be reduced by rewriting, refactoring and balancing technique. Reduction of nodes leads to the reduction of the area but on the contrary increases power and power density of the circuit. A meta-heuristic search approach i.e., Nondominated Sorting Genetic Algorithm-II (NSGA-II) is proposed to select the suitable output polarity of PLA sub-functions for its optimal realization. Results: Best power density based solution saves up to 8.29% power density compared to ‘espresso – dopo’ based solutions. Around 9.57% saving in area and 9.67% saving in power (switching activity) are obtained with respect to ‘espresso’ based solution using NSGA-II. Conclusion: Suitable output polarity realized circuit is converted into multi-level AIG structure and synthesized to overcome the redundant solution at the two-level circuit. It is observed that with the increase in power density, the temperature of a particular circuit is also increases.

scholarly journals Optimising the AR Engraved Structure on Light-Guide Facets for a Wide Range of Wavelengths

Optics ◽  
2020 ◽  
Vol 2 (1) ◽  
pp. 25-42
Author(s):  
Ioseph Gurwich ◽  
Yakov Greenberg ◽  
Kobi Harush ◽  
Yarden Tzabari
Keyword(s):  
Theoretical Analysis ◽  
Light Guide ◽  
Spectral Band ◽  
Angular Range ◽  
The Past ◽  
Input And Output ◽  
Wide Range ◽  
The Given ◽  
Theoretical Results ◽  
Shape And Size

The present study is aimed at designing anti-reflective (AR) engraving on the input–output surfaces of a rectangular light-guide. We estimate AR efficiency, by the transmittance level in the angular range, determined by the light-guide. Using nano-engraving, we achieve a uniform high transmission over a wide range of wavelengths. In the past, we used smoothed conical pins or indentations on the faces of light-guide crystal as the engraved structure. Here, we widen the class of pins under consideration, following the physical model developed in the previous paper. We analyze the smoothed pyramidal pins with different base shapes. The possible effect of randomization of the pins parameters is also examined. The results obtained demonstrate optimized engraved structure with parameters depending on the required spectral range and facet format. The predicted level of transmittance is close to 99%, and its flatness (estimated by the standard deviation) in the required wavelengths range is 0.2%. The theoretical analysis and numerical calculations indicate that the obtained results demonstrate the best transmission (reflection) we can expect for a facet with the given shape and size for the required spectral band. The approach is equally useful for any other form and of the facet. We also discuss a simple way of comparing experimental and theoretical results for a light-guide with the designed input and output features. In this study, as well as in our previous work, we restrict ourselves to rectangular facets. We also consider the limitations on maximal transmission produced by the size and shape of the light-guide facets. The theoretical analysis is performed for an infinite structure and serves as an upper bound on the transmittance for smaller-size apertures.

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

2018 ◽  
Author(s):  
Richard C. Jaeger ◽  
Jun Chen ◽  
Jeffrey C. Suhling ◽  
Leonid Fursin
Keyword(s):  
Silicon Carbide ◽  
Integrated Circuits ◽  
Stress Sensitivity ◽  
Well Drilling ◽  
Deep Well ◽  
Stress Sensors ◽  
Wide Range ◽  
Higher Temperature ◽  
Van Der Pauw ◽  
Transverse Piezoresistance

Stress sensors have shown potential to provide “health monitoring” of a wide range of issues related to packaging of integrated circuits, and silicon carbide offers the advantage of much higher temperature sensor operation with application in packaged high-voltage, high-power SiC devices as well as both automotive and aerospace systems, geothermal plants, and deep well drilling, to name a few. This paper discusses the theory and uniaxial calibration of resistive stress sensors on 4H silicon carbide (4H-SiC) and provides new theoretical descriptions for four-element resistor rosettes and van der Pauw (VDP) stress sensors. The results delineate the similarities and differences relative to those on (100) silicon: resistors on the silicon face of 4H-SiC respond to only four of the six components of the stress state; a four-element rosette design exists for measuring the in-plane stress components; two stress quantities can be measured in a temperature compensated manner. In contrast to silicon, only one combined coefficient is required for temperature compensated stress measurements. Calibration results from a single VDP device can be used to calculate the basic lateral and transverse piezoresistance coefficients for 4H-SiC material. Experimental results are presented for lateral and transverse piezoresistive coefficients for van der Pauw structures and p- and n-type resistors. The VDP devices exhibit the expected 3.16 times higher stress sensitivity than standard resistor rosettes.

scholarly journals A fine desintegration of plants suitable for composite biofuels production

2012 ◽  
Vol 49 (No. 1) ◽  
pp. 7-11 ◽  
Author(s):  
J. Souček ◽  
I. Hanzlíková ◽  
P. Hutla
Keyword(s):  
Energy Consumption ◽  
Technological Process ◽  
Material Properties ◽  
Statistical Evaluation ◽  
Raw Materials ◽  
Correct Choice ◽  
Input And Output ◽  
Input Material ◽  
Wide Range ◽  
Average Size

In case of pressed composite biofuels production the important part of the production process is the input row materials disintegration. In dependence on disintegrated material properties, disintegration device, grinding stage and technological process there is in practice necessary for disintegration of culm materials 0.5–7% and of wooden species even 0.75–10% of total energetical content of material. A wide range of these figures means that in this sphere of raw materials adaptation can be reached relative high savings through correct choice of technological process and device. The authors of the paper have measured energy consumption of fine disintegration of lignocellulose materials in dependence on particles size and moisture. By the realized measurement of different average size of both input and output particles and consequent statistical evaluation was proved the fiducial energy consumption increase at higher stage of disintegration and higher moisture of the input material. All measurements were carried-out for the grinding mill ŠK 300 and the output particles size was limited by the exchange sieves mesh dimension.

scholarly journals A Survey of NFC Sensors Based on Energy Harvesting for IoT Applications

Sensors ◽  
2018 ◽  
Vol 18 (11) ◽  
pp. 3746 ◽  
Author(s):  
Antonio Lazaro ◽  
Ramon Villarino ◽  
David Girbau
Keyword(s):  
Energy Harvesting ◽  
Integrated Circuits ◽  
Radio Frequency Identification ◽  
Low Cost ◽  
Near Field ◽  
Wearable Sensors ◽  
Cold Chain ◽  
Iot Applications ◽  
Wide Range ◽  
Frequency Identification

In this article, an overview of recent advances in the field of battery-less near-field communication (NFC) sensors is provided, along with a brief comparison of other short-range radio-frequency identification (RFID) technologies. After reviewing power transfer using NFC, recommendations are made for the practical design of NFC-based tags and NFC readers. A list of commercial NFC integrated circuits with energy-harvesting capabilities is also provided. Finally, a survey of the state of the art in NFC-based sensors is presented, which demonstrates that a wide range of sensors (both chemical and physical) can be used with this technology. Particular interest arose in wearable sensors and cold-chain traceability applications. The availability of low-cost devices and the incorporation of NFC readers into most current mobile phones make NFC technology key to the development of green Internet of Things (IoT) applications.

scholarly journals micrIO: An Open-Source Autosampler and Fraction Collector for Automated Microfluidic Input-Output

2019 ◽  
Author(s):  
Scott A. Longwell ◽  
Polly M. Fordyce
Keyword(s):  
Open Source ◽  
Positive Pressure ◽  
Cross Contamination ◽  
Wide Spread ◽  
Fraction Collector ◽  
Input And Output ◽  
Wide Range ◽  
Molecular Separations ◽  
Multiwell Plates

Microfluidic devices are an empowering technology for many labs, enabling a wide range of applications spanning high-throughput encapsulation, molecular separations, and long-term cell culture. In many cases, however, their utility is limited by a ‘world-to-chip’ barrier that makes it difficult to serially interface samples with these devices. As a result, many researchers are forced to rely on low-throughput, manual approaches for managing device input and output (IO) of samples, reagents, and effluent. Here, we present a hardware-software platform for automated microfluidic IO (micrIO). The platform, which is uniquely compatible with positive-pressure microfluidics, comprises an ‘AutoSipper’ for input and a Fraction Collector for output. To facilitate wide-spread adoption, both are open-source builds constructed from components that are readily purchased online or fabricated from included design files. The software control library, written in Python, allows the platform to be integrated with existing experimental setups and to coordinate IO with other functions such as valve actuation and assay imaging. We demonstrate these capabilities by coupling both the AutoSipper and Fraction Collector to a microfluidic device that produces beads with distinct spectral codes, and an analysis of the collected bead fractions establishes the ability of the platform to draw from and output to specific wells of multiwell plates with no detectable cross-contamination between samples.

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