Laser Voltage Imaging: New Perspective Using Second Harmonic Detection on Submicron Technology

2012 ◽  
Author(s):  
Guillaume Celi ◽  
Sylvain Dudit ◽  
Thierry Parrassin ◽  
Michel Vallet ◽  
Philippe Perdu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Case Studies ◽  
Second Harmonic ◽  
New Approach ◽  
Voltage Imaging ◽  
Signal Degradation ◽  
New Perspective ◽  
Process Issue ◽  
The Impact

Abstract The Laser Voltage Imaging (LVI) technique [1], introduced in 2009, appears as a very promising approach for Failure Analysis application which allows mapping frequencies through the backside of integrated circuits. In this paper, we propose a new range of application based on the study of the LVI second harmonic for signal degradation analysis. After a theoretical study of the impact of signal degradation on the second harmonic, we will demonstrate the interest of this new approach on two case studies on ultimate technology (28nm). This technique is a new approach of failure analysis that maps timing degradation and duty cycle degradation. In order to confirm the degradations we will use the LVP Technique. The last part is two real case studies on which this LVI second harmonic technique was used to find the root cause of a 28nm process issue.

Laser Voltage Imaging and Its Derivatives—Efficient Techniques to Address Defect on 28 nm Technology

2013 ◽  
Author(s):  
Thierry Parrassin ◽  
Guillaume Celi ◽  
Sylvain Dudit ◽  
Michel Vallet ◽  
Antoine Reverdy ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Second Harmonic ◽  
Advanced Technology ◽  
Added Value ◽  
Harmonic Detection ◽  
Localization Technique ◽  
Voltage Imaging ◽  
Advanced Technologies ◽  
Defect Localization

Abstract The Laser Voltage Imaging (LVI) technique, introduced in 2007 [1][2], has been demonstrated as a successful defect localization technique to address problems on advanced technologies. In this paper, several 28nm case studies are described on which the LVI technique and its derivatives provide a real added value to the defect localization part of the Failure Analysis flow. We will show that LVI images can be used as a great reference to improve the CAD alignment overlay accuracy which is critical for advanced technology debug. Then, we will introduce several case studies on 28nm technology on which Thermal Frequency Imaging (TFI) and Second Harmonic Detection (two LVI derivative techniques) allow efficient defect localization.

Combine Micro-Probing and OBIRCH to Catch Non-Recognizable Fault in RF and Mixed-Mode Integrated Circuits

2007 ◽  
Author(s):  
Cha-Ming Shen ◽  
Yen-Long Chang ◽  
Lian-Fon Wen ◽  
Tan-Chen Chuang ◽  
Shi-Chen Lin ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Radio Frequency ◽  
Failure Analysis ◽  
Case Studies ◽  
Mixed Mode ◽  
Failure Mechanisms ◽  
Deep Submicron ◽  
Digital Logic ◽  
Successful Approach ◽  
Cmos Processes

Abstract Highly-integrated radio frequency and mixed-mode devices that are manufactured in deep-submicron or more advanced CMOS processes are becoming more complex to analyze. The increased complexity presents us with many eccentric failure mechanisms that are uniquely different from traditional failure mechanisms found during failure analysis on digital logic applications. This paper presents a novel methodology to overcome the difficulties and discusses two case studies which demonstrate the application of the methodology. Through the case studies, the methodology was proven to be a successful approach. It is also proved how this methodology would work for such non-recognizable failures.

Laser Voltage Imaging: A New Perspective of Laser Voltage Probing

2010 ◽  
Author(s):  
Yin S. Ng ◽  
Ted Lundquist ◽  
Dmitry Skvortsov ◽  
Joy Liao ◽  
Steven Kasapi ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Functional Failure ◽  
Voltage Imaging ◽  
Laser Probing ◽  
New Perspective

Abstract Laser Voltage Imaging (LVI) is a new application developed from Laser Voltage Probing (LVP). Most LVP applications have focused on design debug or design characterization, and are seldom used for global functional failure analysis. LVI enables the failure analysis engineer to utilize laser probing techniques in the failure analysis realm. In this paper, we present LVI as an emerging FA technique. We will discuss setting up an LVI acquisition and present its current challenges. Finally, we will present an LVI application in the form of a case study.

Application of Advanced Back-Side Optical Techniques in ASICs

2013 ◽  
Vol 21 (3) ◽  
pp. 30-35
Author(s):  
Douglas Martin ◽  
Samuel Beilin ◽  
Brett Hamilton ◽  
Darin York ◽  
Philip Baker ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Photon Emission ◽  
Back Side ◽  
Voltage Imaging ◽  
Root Cause ◽  
Silicon Transistors ◽  
Cause Of Failure ◽  
Metal Interconnects ◽  
Application Specific

Failure analysis is important in determining root cause for appropriate corrective action. In order to perform failure analysis of microelectronic application-specific integrated circuits (ASICs) delidding the device is often required. However, determining root cause from the front side is not always possible due to shadowing effects caused by the ASIC metal interconnects. Therefore, back-side polishing is used to reveal an unobstructed view of the ASIC silicon transistors. This paper details how back-side polishing in conjunction with laser-scanned imaging (LSI), laser voltage imaging (LVI), laser voltage probing (LVP), photon emission microscopy (PEM), and laser-assisted device alterations (LADA) were used to uncover the root cause of failure of two ASICs.

Debugging Signal Corruption in Scan Chain Using Phase Laser Voltage Imaging

2017 ◽  
Author(s):  
G. Ranganathan ◽  
V.K. Ravikumar ◽  
S.L. Phoa ◽  
C. Nemirow ◽  
N. Leslie
Keyword(s):  
Case Studies ◽  
Duty Cycle ◽  
Second Harmonic ◽  
Harmonic Mapping ◽  
Fault Isolation ◽  
Voltage Imaging ◽  
Scan Chain ◽  
Lock In

Abstract Laser Voltage imaging (LVI) is an established and widely used technique for isolating scan chain failures, especially those that are stuck-at a particular state. Enhancements such as second harmonic mapping have been beneficial in detecting a fault that is not stuck, but caused a shift in duty-cycle of the injected signal. In this paper, we describe Phase LVI which is constructed by integrating a lock-in amplifier as an enhancement to LVI for studying the relative phases between scan flops. Additionally we showcase case studies of successful fault isolation using phase LVI, where traditional LVI techniques were not successful.

Unlocking Novel FA Case Studies Using a Lock-in Amplifier

2020 ◽  
Author(s):  
Sukho Lee ◽  
Marc van Veenhuizen ◽  
Paolo Navaretti ◽  
Gaia Donati
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Micro Electro Mechanical System ◽  
Fault Isolation ◽  
Optical Frequency ◽  
Use Case ◽  
Mems Gyroscope ◽  
Active Devices ◽  
Voltage Imaging ◽  
Lock In

Abstract Lock-in techniques enable the detection of very small signals in a background that can be dominated by noise. This strength makes these techniques valuable especially for failure analysis of active devices where the deviation may be difficult to detect. This paper describes novel use case applications in which the lock-in amplifier plays a key role. The case studies covered are multi-frequency mapping fault isolation with nonperiodic patterns and frequency resonance measurement of a micro electro-mechanical system (MEMS) gyroscope. The paper presents how lock-in amplifiers enable digital failure analysis using compressed scan patterns. It reports on using a lock-in to characterize a MEMS gyroscope and on how to directly observe the gyroscope motion using phase laser voltage imaging/electro-optical frequency mapping. It can be concluded that the lock-in techniques form an essential part of the failure analysis toolkit and will only be more so with this study.

Case Studies of IR Based Rapid PC Motherboard Failure Analysis

2002 ◽  
Author(s):  
Jan Swart ◽  
John Woo ◽  
Randall Zumwalt ◽  
Jeff Birdsley ◽  
Yitages Taffese
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
End Of Life ◽  
Case Studies ◽  
Discovery Process ◽  
Ir Thermography ◽  
Ir Camera ◽  
Manufacturing Defects ◽  
Time Consumption ◽  
Functional Components

Abstract This article discusses the techniques useful in the failure discovery process in PC motherboard. It discusses the application of infrared (IR) camera in failure analysis, which overcomes time consumption problems. The article focuses on the experience gained from nine different case studies, where IR thermography system was used to both measure relative temperatures as well as absolute temperatures of components. The failures investigated are overdriven components, finding end-of-life but still functional components, correctly specified components with quality defects, incorrect component placement, internal voltage common collector to ground low resistance integrated circuits failures, PCB defects resulting in power to ground failures, soldering defects resulting in lead opens or solder bridges, and copper trace manufacturing defects or stress-induced cracks.

Laser Voltage Tracing—A Novel Approach for Imaging Pulsed Signals

2016 ◽  
Author(s):  
Christopher Nemirow ◽  
Neel Leslie
Keyword(s):  
Failure Analysis ◽  
Test Pattern ◽  
Experimental Setup ◽  
New Approach ◽  
Voltage Imaging ◽  
Novel Approach

Abstract LVx, a workhorse in many failure analysis laboratories, consists of laser voltage imaging (LVI) and laser voltage probing. Laser voltage tracing (LVT) eliminates the inherent restrictions bestowed by LVI and reduces the need for costly probing. It monitors a distinct feature of the test pattern and creates a corresponding signal map. This weapon in the LVx arsenal significantly decreases debug time and will prove as invaluable as LVI. Beginning with an overview of the limitations of traditional LVx, this paper provides information on the process steps, experimental setup, and applications of LVT. LVT introduces a new approach to monitoring LVx signals. The most obvious LVT application is debugging problematic peripheral NAND circuitry.

Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI

2012 ◽  
Author(s):  
V.K. Ravikumar ◽  
R. Wampler ◽  
M.Y. Ho ◽  
J. Christensen ◽  
S.L. Phoa
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Case Studies ◽  
Timing Analysis ◽  
Fault Isolation ◽  
Root Cause ◽  
Root Cause Identification

Abstract Laser voltage probing is the newest generation of tools that perform timing analysis for electrical fault isolation in advanced failure analysis facilities. This paper uses failure analysis case studies on SOI to showcase the implementation of laser voltage probing in the failure analysis flow and highlight its significance in root-cause identification.

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

Sign in / Sign up

Export Citation Format

Share Document