Correlation of Thin Film Measurement Techniques for Device Packaging Processes

2014 ◽  
Author(s):  
J. Walter ◽  
W. Mack ◽  
C.Y. Lee ◽  
C. Gspan
Keyword(s):  
Thin Film ◽  
Semiconductor Industry ◽  
Measurement Techniques ◽  
Fluorescence Analysis ◽  
Thin Layers ◽  
Layer System ◽  
Tem Analysis ◽  
X Ray ◽  
The Individual ◽  
Non Destructive

Abstract The analysis of thin layers in semiconductor components represents a central point in the quality control of semiconductor companies. Not only to control production processes, but to successfully operate also reverse engineering, reliable thin-film measurement methods are essential. In this work, non-destructive thin film EDX (energy dispersive X-ray micro analysis) software and μXRF (micro x-ray fluorescence analysis) were compared with TEM analysis. These methods ensure a high lateral resolution which is essential in the analysis of semiconductor structures. As an example, four different, for the semiconductor industry interesting, very thin coating systems in the nanometer range have been tested. In the individual cases best TEM detector contrast settings could be found, as well as optimum fluorescence lines settings on the EDX to minimize the errors. The TEM measurements, in thickness and composition, were compared to the thin film EDX software and the μXRF method results to determine their accuracy. It turns out that depending on the layer system recalibration with multilayer standards or at least with elemental standards is recommended. It could be shown that with μXRF and thin film EDX a reliable, rapid and non-destructive layer analysis is possible.

Recognizing the Limits of Archaeological Applications of Non-Destructive Energy-Dispersive X-Ray Fluorescence Analysis of Obsidians

1990 ◽  
Vol 185 ◽  
Author(s):  
Paul D. Bouey
Keyword(s):  
Thin Film ◽  
Fluorescence Analysis ◽  
Volcanic Field ◽  
Energy Dispersive ◽  
X Ray ◽  
Archaeological Artifact ◽  
Analytical Potential ◽  
Non Destructive

AbstractApplication of a non-destructive energy-dispersive XRF technique, involving use of analytc/Compton net peak ratios, has greatly increased the analytical potential for the study of obsidians in archaeological assemblages. Contrary to reported conclusions for obsidians from the Coso Volcanic Field of southeastern California, however, the method lacks the precision associated with powdered-specimen, thin film, and other more rigorous techniques. Tests have shown that changing the orientation and/or placement of an archaeological artifact in a sample slot will produce widely divergent determinations of ppm concentrations for most specimens. These results indicate that discriminating between some chemical subsources at Coso cannot be accomplished reliably.

Basic Studies of Multi-Layer Thin Film Analysis Using Fundamental Parameter Method

1989 ◽  
Vol 33 ◽  
pp. 213-223
Author(s):  
Y. Kataoka ◽  
T. Arai
Keyword(s):  
Thin Film ◽  
Fluorescence Analysis ◽  
Parameter Method ◽  
Fundamental Parameter ◽  
X Ray ◽  
Basic Studies ◽  
Layer Thin Film ◽  
Non Destructive ◽  
Fundamental Parameter Method

X-ray fluorescence analysis is the most suitable method, for the characterization of the thickness and the chemical composition of thin film samples. It is non-destructive, rapid, precise, and accurate for both metal and oxide samples.

scholarly journals Non-destructive handheld XRF study of archaeological composite silver objects—the case study of the late Roman Seuso Treasure

2021 ◽  
Vol 13 (5) ◽  
Author(s):  
Viktória Mozgai ◽  
Bernadett Bajnóczi ◽  
Zoltán May ◽  
Zsolt Mráv
Keyword(s):  
Fluorescence Analysis ◽  
The Body ◽  
High Quality ◽  
X Ray ◽  
Composite Objects ◽  
Mechanical Attachment ◽  
Non Destructive ◽  
Made In ◽  
Late Roman

AbstractThis study details the non-destructive chemical analysis of composite silver objects (ewers, situlas, amphora and casket) from one of the most significant late Roman finds, the Seuso Treasure. The Seuso Treasure consists of fourteen large silver vessels that were made in the fourth–early fifth centuries AD and used for dining during festive banquets and for washing and beautification. The measurements were systematically performed along a pre-designed grid at several points using handheld X-ray fluorescence analysis. The results demonstrate that all the objects were made from high-quality silver (above 90 wt% Ag), with the exception of the base of the Geometric Ewer B. Copper was added intentionally to improve the mechanical properties of soft silver. The gold and lead content of the objects shows constant values (less than 1 wt% Au and Pb). The chemical composition as well as the Bi/Pb ratio suggests that the parts of the composite objects were manufactured from different silver ingots. The ewers were constructed in two ways: (i) the base and the body were made separately, or (ii) the ewer was raised from a single silver sheet. The composite objects were assembled using three methods: (i) mechanical attachment; (ii) low-temperature, lead-tin soft solders; or (iii) high-temperature, copper-silver hard solders. Additionally, two types of gilding were revealed by the XRF analysis, one with remnants of mercury, i.e. fire-gilding, and another type without remnants of mercury, presumably diffusion bonding.

Mycenaean black inlaid metalware in the National Archaeological Museum, Athens: a technical examination

1995 ◽  
Vol 90 ◽  
pp. 137-153 ◽  
Author(s):  
K. Demakopoulou ◽  
E. Mangou ◽  
R. E. Jones ◽  
E. Photos-Jones
Keyword(s):  
Gold Alloy ◽  
Fluorescence Analysis ◽  
Silver Alloys ◽  
X Ray ◽  
Gold Silver ◽  
Technical Examination ◽  
Technical Interest ◽  
Non Destructive ◽  
Analysis Point

Current technical interest in the nature of the black inlaid decoration on ancient metalware has stimulated an examination of some of the well-known bronze daggers, silver vessels, and other fragments, all with inlaid decoration and dating to the 16–14th centuries BC, from Mycenae, Prosymna, Dendra, Routsi, and Pylos. Results of non-destructive X-ray fluorescence analysis point to great versatility in working with copper (or bronze)–gold–silver alloys. The black inlaid decoration is usually copper/bronze–gold alloy with small quantities of silver. Four of the objects were also examined by X-ray radiography.

Synchrotron X-ray Microbeam Characteristics for X-ray Fluorescence Analysis

1994 ◽  
Vol 38 ◽  
pp. 283-289
Author(s):  
A. Iida ◽  
T. Noma
Keyword(s):  
Detection Limit ◽  
Spectroscopic Analysis ◽  
Fluorescence Analysis ◽  
Photon Flux ◽  
Beam Size ◽  
X Ray ◽  
Available Energy ◽  
Practical Analysis ◽  
Micro Analysis ◽  
Non Destructive

X-ray fluorescence analysis using a synchrotron x-ray microprobe has become an indispensable technique for non-destructive micro-analysis. One of the most important parameters that characterize the x-ray microbeam system for x-ray fluorescence analysis is the beam size. For practical analysis, however, the photon flux, the energy resolution and the available energy range are also crucial. Three types of x-ray microbeam systems, including monochromatic and continuum excitation systems, were compared with reference to the sensitivity, the minimum detection limit and the applicability to various types of x-ray spectroscopic analysis.

Determination of the Mechanical Response of Thin Films with X-Rays

1993 ◽  
Vol 308 ◽  
Author(s):  
I. C. Noyan ◽  
G. Sheikh
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Response ◽  
Strain Analysis ◽  
Local Strain ◽  
X Rays ◽  
Stress Strain ◽  
X Ray ◽  
The Individual

ABSTRACTThe mechanical response of a specimen incorporating thin films is dictated by a combination of fundamental mechanical parameters such as Young's moduli of the individual layers, and by configurational parameters such as adhesion strength at the interface(s), residual stress distribution and other process dependent factors. In most systems, the overall response will be dominated by the properties of the (much thicker) substrate. Failure within the individual layers, on the other hand, is dependent on the local strain distributions and can not be predicted from the substrate values alone. To better understand the mechanical response of these systems, the strain within the individual layers of the thin film system must be measured and correlated with applied stresses. Phase selectivity of X-ray stress/strain analysis techniques is well suited for this purpose. In this paper, we will review the use of the traditional x-ray stress/strain analysis methods for the determination of the mechanical properties of thin film systems.

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