A New Methodology to Protect PCBs from Nondestructive Reverse Engineering

2016 ◽  
Author(s):  
Zimu Guo ◽  
Bicky Shakya ◽  
Haoting Shen ◽  
Swarup Bhunia ◽  
Navid Asadizanjani ◽  
...  
Keyword(s):  
Reverse Engineering ◽  
Printed Circuit Boards ◽  
Advanced Characterization ◽  
Electronic Systems ◽  
Circuit Boards ◽  
X Ray ◽  
Reverse Engineer ◽  
Electronic Hardware ◽  
Non Destructive ◽  
Destructive Methods

Abstract Reverse engineering of electronic hardware has been performed for decades for two broad purposes: (1) honest and legal means for failure analysis and trust verification; and (2) dishonest and illegal means of cloning, counterfeiting, and development of attacks on hardware to gain competitive edge in a market. Destructive methods have been typically considered most effective to reverse engineer Printed Circuit Boards (PCBs) – a platform used in nearly all electronic systems to mechanically support and electrically connect all hardware components. However, the advent of advanced characterization and imaging tools such as X-ray tomography has shifted the reverse engineering of electronics toward non-destructive methods. These methods considerably lower the associated time and cost to reverse engineer a complex multi-layer PCB. In this paper, we introduce a new anti–reverse engineering method to protect PCBs from non-destructive reverse engineering. We add high-Z materials inside PCBs and develop advanced layout algorithms, which create inevitable imaging artifacts during tomography, thereby making it practically infeasible for an adversary to extract correct design information with X-ray tomography.

Non-Destructive PCB Reverse Engineering Using X-Ray Micro Computed Tomography

2015 ◽  
Author(s):  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Mark Tehranipoor ◽  
Domenic Forte
Keyword(s):  
Reverse Engineering ◽  
Printed Circuit Boards ◽  
Advanced Characterization ◽  
Fault Isolation ◽  
Lessons Learned ◽  
Circuit Boards ◽  
Micro Computed Tomography ◽  
X Ray ◽  
Printed Circuit ◽  
Non Destructive

Abstract Reverse engineering of electronics systems is performed for various reasons ranging from honest ones such as failure analysis, fault isolation, trustworthiness verification, obsolescence management, etc. to dishonest ones such as cloning, counterfeiting, identification of vulnerabilities, development of attacks, etc. Regardless of the goal, it is imperative that the research community understands the requirements, complexities, and limitations of reverse engineering. Until recently, the reverse engineering was considered as destructive, time consuming, and prohibitively expensive, thereby restricting its application to a few remote cases. However, the advents of advanced characterization and imaging tools and software have counteracted this point of view. In this paper, we show how X-ray micro-tomography imaging can be combined with advanced 3D image processing and analysis to facilitate the automation of reverse engineering, and thereby lowering the associated time and cost. In this paper, we demonstrate our proposed process on two different printed circuit boards (PCBs). The first PCB is a four-layer custom designed board while the latter is a more complex commercial system. Lessons learned from this effort can be used to both develop advanced countermeasures and establish a more efficient workflow for instances where reverse engineering is deemed necessary. Keywords: Printed circuit boards, non-destructive imaging, X-ray tomography, reverse engineering.

In-Situ Thermal Chamber 3D X-Ray Computed Tomography for Non-Destructive Detection of Submicron Via-Crack in Printed Circuit Boards

2020 ◽  
Author(s):  
Daechul Choi ◽  
Sooyoung Ji ◽  
Jaelim Choi ◽  
Miyang Kim ◽  
Eunju Yang ◽  
...  
Keyword(s):  
Computed Tomography ◽  
Printed Circuit Boards ◽  
Fault Isolation ◽  
Circuit Boards ◽  
X Ray ◽  
Printed Circuit ◽  
Thermal Chamber ◽  
X Ray Computed ◽  
Non Destructive

Abstract In this paper, we demonstrate a case for non-destructive detection of submicron wide via-crack in printed circuit boards (PCBs) by using in-situ thermal chamber 3D x-ray computed tomography. The defect location is verified by a PFA (Physical Failure Analysis), and good agreement was made. This fault isolation method is proposed as a possible solution for identifying submicron cracks in PCB substrates during challenging investigations.

Coating-Based PCB Protection against Tampering, Snooping, EM Attack, and X-ray Reverse Engineering

2018 ◽  
Author(s):  
Haoting Shen ◽  
M Tanjidur Rahman ◽  
Navid Asadizanjani ◽  
Mark Tehranipoor ◽  
Swarup Bhunia
Keyword(s):  
Integrated Circuits ◽  
Reverse Engineering ◽  
Printed Circuit Boards ◽  
Economic Trend ◽  
Circuit Boards ◽  
X Ray ◽  
Active Defense ◽  
Non Invasive ◽  
Pcb Manufacturing ◽  
Cost Efficient

Abstract In the last decades, the supply chain of printed circuit boards (PCBs) becomes distributed with growing complexity of PCB designs and the economic trend of outsourcing the PCB manufacturing. This makes the PCBs more vulnerable to security attacks, such as tampering, snooping, and electromagnetic (EM) attacks. Because of the large feature size of PCBs (compared to integrated circuits), it is challenging to protect the PCBs from those attacks or proof the suspected attacks. For the same reason, PCBs are vulnerable to non-invasive reverse engineering by X-ray tomography as well. In this paper, we propose a novel silicon carbide (SiC) coating technique to provide passive protection for PCBs from in-field tampering, snooping and EM attacks. In addition, capacitive sensors are designed based on the SiC coating, offering active defense against those attacks. The coating and sensors can be implemented on PCBs in cost-efficient ways and the area overheads are minimized. The insulating coating also allows an extra tungsten-based painting to be applied to prevent the X-ray reverse engineering.

An Educational Scheme for a CNC Drilling Machine

2012 ◽  
Vol 2 (2) ◽  
pp. 1-11 ◽  
Author(s):  
Salah Haridy ◽  
Zhang Wu ◽  
Amro Shafik
Keyword(s):  
Printed Circuit Boards ◽  
Numerical Data ◽  
Numerical Control ◽  
Electronic Systems ◽  
Parallel Port ◽  
Circuit Boards ◽  
Cnc Machine ◽  
Printed Circuit ◽  
Stepper Motors ◽  
C Program

Computer numerical control (CNC) involves machines controlled by electronic systems designed to accept numerical data and other instructions, usually in a coded form. CNC machines are more productive than conventional equipment and consequently produce parts at less cost and higher accuracy even when the higher investment is considered. This article proposes an educational scheme for designing a CNC machine for drilling printed circuit boards (PCB) holes with small diameters. The machine consists of three-independently move-fully controlled tables. Output pulses from the personal computer (PC) parallel port are used to control the machine after processing by an interface card. A flexible, responsive and real-time visual C # program is developed to control the motion of the stepper motors. The educational scheme proposed in this article can provide engineers and students in academic institutions with a simple foundation to efficiently build a CNC machine based on the available resources.

scholarly journals Qualitative comparison of non-destructive methods for inspection of carbon fiber-reinforced polymer laminates

2020 ◽  
Vol 54 (27) ◽  
pp. 4325-4337 ◽  
Author(s):  
Janez Rus ◽  
Alex Gustschin ◽  
Hubert Mooshofer ◽  
Jan-Carl Grager ◽  
Klaas Bente ◽  
...  
Keyword(s):  
Carbon Fiber ◽  
Dark Field ◽  
Piezoelectric Transducers ◽  
Fiber Reinforced Polymer ◽  
Carbon Fiber Reinforced Polymer ◽  
X Ray ◽  
Reinforced Polymer ◽  
Non Destructive ◽  
Ultrasound Testing ◽  
Destructive Methods

In the rapidly expanding composite industry, novel inspection methods have been developed in recent years. Particularly promising for air-coupled testing are cellular polypropylene transducers which offer better impedance matching to air than piezoelectric transducers. Furthermore, broadband transmitters (laser-induced ultrasound and thermoacoustic emitters) and receivers (optical microphones) have opened a completely new chapter for advanced contact-free ultrasound inspection. X-ray dark-field radiography offers a different approach to detect porosity and microcracks, employing small angle X-ray scattering. These innovative ultrasonic and radiographic alternatives were evaluated in comparison with well-established inspection techniques. We applied thirteen different non-destructive methods to inspect the same specimen (a carbon fiber-reinforced polymer laminate with induced impact damage): air-coupled ultrasound testing (using piezoelectric transducers, broadband optical microphones, cellular polypropylene transducers, and a thermoacoustic emitter), laser-induced ultrasound testing, ultrasonic immersion testing, phased array ultrasonic testing, optically excited lock-in thermography, and X-ray radiography (projectional absorption and dark-field, tomosynthesis, and micro-computed tomography). The inspection methods were qualitatively characterized by comparing the scan results. The conclusions are advantageous for a decision on the optimal method for certain testing constraints.

scholarly journals Design-of-experiment analysis of non-destructive detachment of electric parts from printed circuit boards of mobile phones using a cross-flow shredder

2021 ◽  
Vol 134 ◽  
pp. 52-56
Author(s):  
Takao UEDA ◽  
Hideaki FUKUSAWA ◽  
Naoki SUNAHARA ◽  
Hiroshi YAMADA ◽  
Tatsuya OKI ◽  
...  
Keyword(s):  
Mobile Phones ◽  
Design Of Experiment ◽  
Printed Circuit Boards ◽  
Cross Flow ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Non Destructive ◽  
Experiment Analysis

Non-destructive detection methods for discontinuities of interconnection structures

2016 ◽  
Vol 33 (1) ◽  
pp. 23-35 ◽  
Author(s):  
Tomas Blecha
Keyword(s):  
Transmission Lines ◽  
Printed Circuit Boards ◽  
Characteristic Impedance ◽  
Diagnostic Methods ◽  
Detection Methods ◽  
Circuit Boards ◽  
Content Type ◽  
Multiple Line ◽  
Detection And Localization ◽  
Non Destructive

Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices.

scholarly journals Capabilities to Assess Health/Maintenance Status of Gas Turbine Blades with Non-Destructive Methods

2015 ◽  
Vol 21 (4) ◽  
pp. 41-47 ◽  
Author(s):  
Józef Błachnio
Keyword(s):  
Computed Tomography ◽  
Gas Turbine ◽  
Turbine Blades ◽  
Health Maintenance ◽  
Visual Method ◽  
X Ray ◽  
Active Thermography ◽  
X Ray Computed ◽  
Non Destructive ◽  
Destructive Methods

Abstract The paper has been intended to discuss non-destructive testing methods and to present capabilities of applying them to diagnose objectively changes in the microstructure of a turbine blade with computer software engaged to assist with the analyses. The following techniques are discussed: a visual method, based on the processing of images of the material surface in visible light, active thermography, based on the detection of infrared radiation, and the X-ray computed tomography. All these are new non-destructive methods of assessing technical condition of structural components of machines. They have been intensively developed at research centers worldwide, and in Poland. The computer-aided visual method of analyzing images enables diagnosis of the condition of turbine blades, without the necessity of dismantling of the turbine. On the other hand, the active thermography and the X-ray computed tomography, although more sensitive and more reliable, can both be used with the blades dismounted from the turbine. If applied in a complex way, the non-destructive methods presented in this paper, are expected to increase significantly probability of detecting changes in the blade's condition, which in turn would be advantageous to reliability and safety of gas turbine service.

scholarly journals METHODS OF STUDYING THE STRUCTURE AND PROPERTIES OF MOUNTAIN BREEDS ON SAMPLES (QUICK REVIEW)

2018 ◽  
pp. 10-20
Author(s):  
A. A. Karabutov ◽  
E. B. Cherepetskaya ◽  
A. N. Kravcov ◽  
M. Arrigoni
Keyword(s):  
Internal Structure ◽  
Acoustic Microscopy ◽  
Laser Ultrasound ◽  
Structure And Properties ◽  
X Ray ◽  
Local Porosity ◽  
Non Destructive ◽  
Tomography Scanning ◽  
Destructive Methods ◽  
Scanning Electron

Some non-destructive methods for controlling the internal structure of rocks are described and examples of their use are given. Examples of the use of X-ray and neural tomography, scanning electron and acoustic microscopy are also given. It is shown that the method of laser-ultrasound struktroskopii is promising. Two examples of the use of the latter are given: measuring the local porosity of samples of geomaterials and monitoring changes in the internal structure as a result of electromagnetic exposure.

Sign in / Sign up

Export Citation Format

Share Document