scholarly journals Influence of Selected Factors on Thermal Parameters of the Components of Forced Cooling Systems of Electronic Devices

Electronics ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 340
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Electronic Device ◽  
Cooling System ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Cooling Systems ◽  
Peltier Module ◽  
Wide Range ◽  
Peltier Modules ◽  
Analytical Formulas ◽  
Forced Cooling

The paper presents some investigation results on the properties of forced cooling systems dedicated to electronic devices. Different structures of such systems, including Peltier modules, heat sinks, fans, and thermal interfaces, are considered. Compact thermal models of such systems are formulated. These models take into account a multipath heat transfer and make it possible to compute waveforms of the device’s internal temperature at selected values of the power dissipated in the device. The analytical formulas describing the dependences of the thermal resistance of electronic devices co-operating with the considered cooling systems on the power dissipated in the cooled electronic device and the power feeding the Peltier module and the speed of airflow caused by a fan are proposed. The correctness of the proposed models is verified experimentally in a wide range of powers dissipated in electronic devices operating in different configurations of the used cooling system.

Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Cooling Power ◽  
Cooling Systems ◽  
Content Type ◽  
Peltier Module ◽  
Peltier Modules ◽  
Forced Air

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

scholarly journals Cooling Performance of Heat Sinks Used in Electronic Devices

2018 ◽  
Vol 171 ◽  
pp. 02003
Author(s):  
Ibrahim Mjallal ◽  
Hussein Farhat ◽  
Mohammad Hammoud ◽  
Samer Ali ◽  
Ali AL Shaer ◽  
...  
Keyword(s):  
Heat Sink ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Passive Cooling ◽  
Short Term ◽  
Cooling Systems ◽  
Thermal Output ◽  
Electrical Devices

Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

An Experimental Investigation of Pressure Drop During Partial Condensation of Low Pressure Steam

2020 ◽  
Vol 12 (5) ◽  
Author(s):  
Jacques du Plessis ◽  
Michael Owen
Keyword(s):  
Pressure Drop ◽  
Cooling System ◽  
Thermal Power ◽  
Steam Pressure ◽  
Tube Length ◽  
Condenser Tube ◽  
Cooling Systems ◽  
Frictional Pressure Drop ◽  
Wide Range ◽  
Experimental Apparatus

Abstract As direct dry-cooling systems are becoming more popular for thermal power plants, there is a demand to increase the flexibility of the application and performance of these cooling systems. A novel hybrid (dry/wet) dephlegmator (HDWD) cooling system is being developed, and at this stage in the development of the HDWD, the performance analysis and optimization of the HDWD is currently subject to uncertainties in a number of parameters. One of the parameters is the confidence in the correlations to predict the steam-side pressure drop over the wide range of full to partial condensation conditions expected in the system as a result of the design. This study makes use of an experimental apparatus to measure steam pressure drop over a range of partial to full condensation inside a circular horizontal tube. The experiment is conducted by measuring the steam flow and steam pressure drop in a horizontal primary condenser tube with the presence of a secondary condenser tube. The primary condenser has a tube length of 2.5 m and an inside tube diameter of 19.3 mm similar to the proposed HDWD design. Existing correlations for pressure drop in condensing flow are compared with the results to assess the applicability of the correlations for the HDWD case. It was found that the correlation of Lockhart and Martinelli’s with the Chisholm parameter fits the experimental data the best with a mean error of ±15.6%. A parametric study also indicated that there is a prominent increase in the frictional pressure drop at low partial condensation ratios (i.e., high steam through flow) as expected with wave drag at the vapor and condensate interface due to the difference in velocity.

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Varghese Panthalookaran
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Energy Efficient ◽  
Electronic Device ◽  
Cooling System ◽  
Electronic Devices ◽  
Cost Effective ◽  
Transfer Rates ◽  
Slot Opening ◽  
Convection Cooling

Natural convection cooling provides a reliable, cost-effective, energy-efficient and noise-free method to cool electronic equipment. However, the heat transfer coefficient associated with natural convection mode is usually insufficient for electronic cooling and it requires enhancement. Chimneylike flows developed within the cabinets of electronic devices can provide better mass flow and heat transfer rates and can lead to greater cooling efficiency. Constraints in the design of natural convection cooling systems include efficiency of packing, aesthetics, and concerns of material reduction. In this paper, methods based on computational fluid dynamics are used to study the effects of parameters such as (1) vertical alignment of the slots, (2) horizontal alignment of slots, (3) area of slots, (4) differential slot opening, and (5) zonal variation in heat generation on natural convection cooling within such design constraints. Insights thus derived are found useful for designing an energy-efficient and ecofriendly cooling system for electronic devices.

Active Thermal Regulation Systems for Footwear: Development of New Innovative Technologies

2021 ◽  
Vol 893 ◽  
pp. 57-63
Author(s):  
João Ferraz ◽  
Sónia Silva ◽  
Helena Fernandes ◽  
Sarah Bogas ◽  
Bruno Vale ◽  
...  
Keyword(s):  
Cooling System ◽  
Heating System ◽  
Thermal Dissipation ◽  
Thermal Regulation ◽  
Peltier Effect ◽  
Cooling Systems ◽  
Heating And Cooling ◽  
Peltier Modules ◽  
Technological Challenge ◽  
Printing Techniques

This work aims to develop safety shoes, with thermal regulation systems, namely innovative heating and cooling systems. Heating system was developed using printing techniques; and cooling system was developed using the integration of Peltier modules in the shoe structure. These materials are based on the Peltier effect, in which, when an electric current is applied, the heat moves from one face to the other, being subsequently removed using thermal dissipation methods. This effect allows an active cooling. Given the high technological challenge of integrating cooling systems into footwear, this paper will present only developments related to cooling system.

scholarly journals Effect Of Position and Design Parameters of a Fan-Cooled Cold Side Heat Sink of a Thermoelectric Cooling-Module on The Performance of a Hybrid Refrigerator

2021 ◽  
Vol 85 (2) ◽  
pp. 66-79
Author(s):  
Yasser Abdulrazak Alghanima ◽  
Osama Mesalhy ◽  
Ahmed Farouk Abdel Gawad
Keyword(s):  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Design Parameters ◽  
Vapor Compression ◽  
Thermoelectric Cooling ◽  
Cold Side ◽  
Peltier Module ◽  
Cooling Module ◽  
Good Agreement

This paper presents a CFD and experimental study of the thermal behavior of the thermoelectric-compartment in a hybrid household-refrigerator that combines thermoelectric and vapor-compression technologies. The hybrid refrigerator has three compartments. One of them is driven by a thermoelectric cooling system, which was made of one Peltier module and two fan-cooled heat sinks mounted on the hot and cold sides. The simulation results were compared with experimental measurements and showed a good agreement. The performance of the thermoelectric refrigerator was tested with changing the pushing direction. Two pushing directions for the fan were examined. In the first one (direction-I), the fan was fixed such that it sucked the air beside the cold heat sink. While in the second direction (direction-II), the fan was assumed to be flipped to push the air over the cold-side heat sink. The results showed that the second fan direction (direction-II) is more effective for heat transfer mechanism between the cold-side heat sink and the inside air of the thermoelectric-compartment.

scholarly journals A multi-channel cooling system for multiple heat source

2016 ◽  
Vol 20 (6) ◽  
pp. 1991-2000 ◽  
Author(s):  
Shanglong Xu ◽  
Weijie Wang ◽  
Zongkun Guo ◽  
Xinglong Hu ◽  
Wei Guo
Keyword(s):  
Heat Sink ◽  
Electronic Device ◽  
Cooling System ◽  
Electronic Devices ◽  
Heat Removal ◽  
Heat Sources ◽  
Power Electronic ◽  
Require Temperature ◽  
Computer Controlled ◽  
Temperature And Pressure

High-power electronic devices with multiple heating elements often require temperature uniformity and operating within their functional temperature range for optimal performance. A multi-channel cooling experiment apparatus is developed for studying heat removal inside an electronic device with multiple heat sources. It mainly consists of a computer-controlled pump, a multi-channel heat sink for multi-zone cooling and the apparatus for measuring the temperature and pressure drop. The experimental results show the system and the designed multi-channel heat sink structure can control temperature distribution of electronic device with multiple heat sources by altering coolant flow rate.

Conceptual Thermosyphonic Loop Cooled Thermoelectric Power Cogeneration System for Automotive Applications

2014 ◽  
Vol 663 ◽  
pp. 294-298
Author(s):  
Jason Sim ◽  
Rozli Zulkifli ◽  
Shahrir Abdullah
Keyword(s):  
Thermoelectric Power ◽  
Cooling System ◽  
Heat Sinks ◽  
Polar Solvents ◽  
Cooling Systems ◽  
Thermoelectric Modules ◽  
Cogeneration System ◽  
Evaporative Cooling System ◽  
Allowable Temperature ◽  
Better Than

Thermoelectric cogeneration may be applied to the exhaust of an automobile to generate additional electric power, by applying a temperature differential across the thermoelectric power generation modules. To obtain maximum net power, the highest allowable temperature difference should be obtained. Therefore, a cooling system should be employed to ensure that the cold side of the thermoelectric modules remain as cold as possible. An evaporative cooling system patented by Einstein and Szilard is used as a base for a non-parasitic cooling system to be used together with thermoelectric modules. The cooling system utilizes the same heat which powers the thermoelectric modules as a power source. By utilizing the high solubility of ammonia in water, the solubility dependency with temperature, and usage of polar and non-polar solvents to direct the flow of ammonia as a coolant, it is possible to create a cooling system which performs better than passive heat sinks, but negates the power requirements of active cooling systems.

scholarly journals CAA of an Air-Cooling System for Electronic Devices

2016 ◽  
Vol 2016 ◽  
pp. 1-17 ◽  
Author(s):  
Sven Münsterjohann ◽  
Jens Grabinger ◽  
Stefan Becker ◽  
Manfred Kaltenbacher
Keyword(s):  
Shear Stress ◽  
Electronic Device ◽  
Cooling System ◽  
Electronic Devices ◽  
Navier Stokes ◽  
Air Cooling ◽  
Acoustic Analogy ◽  
Shear Stress Transport ◽  
Air Cooling System ◽  
Sst Turbulence Model

This paper presents the workflow and the results of fluid dynamics and aeroacoustic simulations for an air-cooling system as used in electronic devices. The setup represents a generic electronic device with several electronic assemblies with forced convection cooling by two axial fans. The aeroacoustic performance is computed using a hybrid method. In a first step, two unsteady CFD simulations using the Unsteady Reynolds-Averaged Navier-Stokes simulation with Shear Stress Transport (URANS-SST) turbulence model and the Scale Adaptive Simulation with Shear Stress Transport (SAS-SST) models were performed. Based on the unsteady flow results, the acoustic source terms were calculated using Lighthill’s acoustic analogy. Propagation of the flow-induced sound was computed using the Finite Element Method. Finally, the results of the acoustic simulation are compared with measurements and show good agreement.

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