scholarly journals Hall-Effect Current Sensors Susceptibility to EMI: Experimental Study

Electronics ◽  
2019 ◽  
Vol 8 (11) ◽  
pp. 1310 ◽  
Author(s):  
Orazio Aiello
Keyword(s):  
Power Systems ◽  
Hall Effect ◽  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Current Sensing ◽  
Tem Cell ◽  
Power Injection ◽  
Current Sensors ◽  
Transverse Electromagnetic

The paper deals with the susceptibility to Electromagnetic Interference (EMI) of Hall-effect current sensors. They are usually employed in power systems because of their galvanic isolation. The EMI robustness of such contactless device was compared with that of resistive current sensing (wired method). To this purpose, a printed circuit board (PCB) was fabricated. EMI tests methods such as Bulk Current Injection (BCI), Transverse-Electromagnetic (TEM) cell and Direct Power injection (DPI) were performed to evaluate the robustness of the Hall-Effect current sensor. EMI-induced failures are highlighted by comparing the different measurements tests and setups.

scholarly journals Research on Anti-Radiation Noise Interference of High Definition Multimedia Interface Circuit Layout of a Laptop

Electronics ◽  
2020 ◽  
Vol 9 (3) ◽  
pp. 426 ◽  
Author(s):  
Wei Chien ◽  
Yu-Ting Cheng ◽  
Chiuan-Fu Hsiao ◽  
Kai-Xu Han ◽  
Chien-Ching Chiu
Keyword(s):  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Near Field ◽  
Circuit Board ◽  
High Definition ◽  
Interface Circuit ◽  
Noise Interference ◽  
Multimedia Interface ◽  
Pcb Layout ◽  
Detection Instrument

In this paper, several aspects were studied, including the effect of an electromagnetic interference (EMI) noise interference strategy with High Definition Multimedia Interface (HDMI) 1.4, the analysis of a test on a printed circuit board (PCB) layout, and a comparison of the near field intensity radiation distribution between an EMI with a modified HDMI layout and an original layout. In this study, the near field detection instrument of APREL EM-ISight was employed to analyze the distribution of the strength of an electromagnetic noise field. After the practical validation, we found that the PCB layout complies with the standards after the modifications. Meanwhile, the PCB layout satisfies the requirements of most laptop HDMI-related products for EMI.

scholarly journals A Comprehensive Comparison of EMI Immunity in CMOS Amplifier Topologies

Electronics ◽  
2019 ◽  
Vol 8 (10) ◽  
pp. 1181 ◽  
Author(s):  
Simone Becchetti ◽  
Anna Richelli ◽  
Luigi Colalongo ◽  
Zsolt Kovacs-Vajna
Keyword(s):  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Complementary Metal Oxide Semiconductor ◽  
Circuit Board ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Fair Comparison ◽  
Comprehensive Comparison ◽  
Folded Cascode ◽  
Cmos Amplifier

This paper provides the results of a comprehensive comparison between complementary metal oxide semiconductor (CMOS) amplifiers with low susceptibility to electromagnetic interference (EMI). They represent the state-of-the-art in low EMI susceptibility design. An exhaustive scenario for EMI pollution has been considered: the injected interference can indeed directly reach the amplifier pins or can be coupled from the printed circuit board (PCB) ground. This is also a key point for evaluating the susceptibility from EMI coupled to the output pin. All of the amplifiers are re-designed in a United Microelectronics Corporation (UMC) 180 nm CMOS process in order to have a fair comparison. The topologies investigated and compared are basically derived from the Miller and the folded cascode ones, which are well-known and widely used by CMOS analog designers.

scholarly journals Design and Study of a Wide-Band Printed Circuit Board Near-Field Probe

Electronics ◽  
2021 ◽  
Vol 10 (18) ◽  
pp. 2201 ◽  
Author(s):  
Pedro A. Martinez ◽  
Enrique A. Navarro ◽  
Jorge Victoria ◽  
Adrian Suarez ◽  
Jose Torres ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Transmission Loss ◽  
Near Field ◽  
Fem Simulation ◽  
Numerical Results ◽  
Circuit Board ◽  
Frequency Range ◽  
Printed Circuit

Magnetic near-field probes (NFP) represent a suitable tool to measure the magnetic field level from a small electromagnetic interference (EMI) source. This kind of antenna is useful as a magnetic field probe for pre-compliance EMC measurements or debugging tasks since the user can scan a printed circuit board (PCB) looking for locations with strong magnetic fields. When a strong H-field point is found, the designer should check the PCB layout and components placement in that area to detect if this could result in an EMI source. This contribution focuses on analyzing the performance of an easy to build and low-cost H-field NFP designed and manufactured using a standard PCB stack-up. Thereby, the frequency range and sensitivity of the NFP-PCB are analyzed through a Finite Element Method (FEM) simulation model that makes it possible to evaluate its sensibility and effective frequency range. The numerical results obtained with the FEM models are validated against measurements to verify the design and performance of our NFP. The FEM model reproduces the experimental procedure, which is used to evaluate the performance of the NFP in terms of sensitivity by means of the simulated near-field distribution. The NFP-PCB has almost a flat response from 180 MHz to 6 GHz, with an almost perfect concordance between numerical and experimental S21 results. The numerical results show an average transmission loss of −27.9 dB by considering the flat response bandwidth, whereas the experimental one is −29.7 dB. Finally, the designed NFP is compared to two high-quality commercial probes in order to analyze its performance.

Calculation and analysis of the model of electromagnetic interference on printed circuit board traces

2014 ◽  
Vol 26 (7) ◽  
pp. 73214
Author(s):  
王永峰 Wang Yongfeng ◽  
于成大 Yu Chengda ◽  
陈政新 Chen Zhengxin ◽  
李明 Li Ming
Keyword(s):  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

scholarly journals Stitching equipotential metallization areas on the double-sided printed circuit board

2020 ◽  
Vol 30 (2) ◽  
pp. 55-61
Author(s):  
A. A. Krasilnikov ◽  
S. Yu. Luzin ◽  
M. S. Luzin ◽  
S. A. Sorokin
Keyword(s):  
Thermal Resistance ◽  
Iterative Algorithm ◽  
Electromagnetic Interference ◽  
High Speed ◽  
Printed Circuit Board ◽  
Heat Removal ◽  
Circuit Board ◽  
Current Loop ◽  
Printed Circuit ◽  
Intersection Area

The linking (stitching) of equipotential metallization areas located on different layers of the printed circuit board is carried out using layer-to-layer vias. The purposes can be different, e. g.: heat removal from heat-loaded components, reduction of the thermal resistance of the board (reducing the risk of warping the board when exposed to thermal loads); reduction of the return current loop of high-speed signals, including differential ones; reduction of the level of electromagnetic interference. The paper reviews the problem of connecting the maximum number of unconnected copper islands on the fully routed twolayer board, which has ground planes on both sides with the help of vias. An iterative algorithm is proposed based on determining the area of the projections of isolated islands with the metallization area on the opposite sideboard, if a via can be placed in the intersection area. The algorithm guarantees the connection between the maximum number of islands.

scholarly journals Shielding Elektromagnetik Tembaga dari Proses Elektrolisis Air Limbah Industri Printed Circuit Board

2020 ◽  
Vol 10 (1) ◽  
pp. 9
Author(s):  
Agung Yanuar Wirapraja ◽  
Handaru Bowo Cahyono ◽  
Mohamad Marhaendra Ali
Keyword(s):  
Electromagnetic Interference ◽  
Industrial Wastewater ◽  
Printed Circuit Board ◽  
Negative Impact ◽  
Electromagnetic Shielding ◽  
Circuit Board ◽  
Radiation Emission ◽  
Electronic Products ◽  
Printed Circuit ◽  
Antenna Polarization

Some electronic products have high electromagnetic interference so that it gives a negative impact on the electronic devices around it. The use of electromagnetic shielding is a solution to reduce the value of electromagnetic radiation interference from electronic products. The research conducted includes the manufacture of electromagnetic shielding from copper material resulting from the electrolysis process of PCB (Printed Circuit Board) industrial wastewater and analyzing the effect of electromagnetic shielding from copper waste on the value of radiation emission. Electromagnetic shielding is made of vinyl which is coated with copper as a result of the electrolysis of PCB industrial wastewater. The measurement results show that electromagnetic shielding from copper waste can reduce radiation emissions. The use of electromagnetic shielding from copper waste is effective at frequencies from 250 to 350 MHz with a decrease in the quasi-peak value of 38.02 dB. The measurements with horizontal antenna polarization show that the margin of radiation emission value is higher comparated to vertical antenna polarization.Sebagian produk elektronika memiliki gangguan interferensi elektromagnetik yang tinggi, sehingga berdampak kurang baik terhadap perangkat elektronika di sekitarnya. Pemanfaatan shielding elektromagnetik menjadi solusi untuk mengurangi nilai gangguan radiasi elektromagnetik yang dimiliki oleh produk elektronika. Penelitian yang dilakukan meliputi pembuatan shielding elektromagnetik dari bahan tembaga hasil dari proses elektrolisis limbah industri PCB (Printed Circuit Board) dan melakukan analisa pengaruh shielding elektromagnetik dari limbah tembaga terhadap nilai emisi radiasi. Shielding elektromagnetik terbuat dari bahan vinyl yang dilapisi dengan tembaga hasil elektrolisis limbah cair industri PCB. Hasil pengukuran menunjukkan bahwa shielding elektromagnetik dari limbah tembaga dapat menurunkan emisi radiasi. Penggunaan shielding elektromagnetik dari limbah tembaga efektif di frekuensi 250 – 350 MHz dengan penurunan nilai quasi-peak sebesar 38,02 dB. Pada pengukuran dengan polarisasi antena horisontal, margin nilai emisi radiasi lebih tinggi jika dibandingkan dengan polarisasi antena vertikal. Kata Kunci: Shielding elektromagnetik, Emisi radiasi, Tembaga, PCB

Study of the Effect of Low-Frequency Interference on Resistance-to-Voltage Converter in Cable Insulation Testing

2019 ◽  
Vol 970 ◽  
pp. 297-304 ◽  
Author(s):  
Nikolay I. Yermoshin ◽  
Evgeny V. Yakimov ◽  
Aleksandr E. Goldshtein
Keyword(s):  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Low Frequency ◽  
Circuit Board ◽  
Frequency Noise ◽  
Structural Elements ◽  
Voltage Converter ◽  
Cable Insulation ◽  
Electrostatic Charges ◽  
Alternating Magnetic Fields

The study focuses on the effect of low-frequency noise on resistance converter of teraommeters to test cable insulation. A mathematical pendulum was used to simulate low frequency electromagnetic interference. It was found that the greatest effect is exerted by dynamic effects of electrostatic charges that accumulate on the printed circuit board, electronic components, structural elements of the resistance-to-voltage converter, and on the test cable sheath. The effect of constant and alternating magnetic fields on measurement of resistance of insulating materials is insignificant.

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