scholarly journals Effect of the Anisotropy Mechanical Properties on LN Crystals Fixed-Abrasive Lapping

Materials ◽  
2020 ◽  
Vol 13 (19) ◽  
pp. 4455
Author(s):  
Nannan Zhu ◽  
Jiapeng Chen ◽  
Piao Zhou ◽  
Yongwei Zhu
Keyword(s):  
Mechanical Properties ◽  
Material Removal ◽  
Removal Rate ◽  
Indentation Hardness ◽  
Nano Indentation ◽  
Brittle Ductile Transition ◽  
Critical Cutting Depth ◽  
Fixed Abrasive ◽  
Better Than

The anisotropy of lithium niobate (LN) single crystals in mechanical properties affects its material removal uniformity during lapping. The nano-indentation hardness (HI) and elastic modulus(E) of Z-cut wafer and X-cut wafer were measured by a nano-indentation tester. The nano-scratching tests were adopted to evaluate its critical cutting depth (dc) of brittle ductile transition along crucial orientations of Z-cut and X-cut, respectively. A series of fixed-abrasive lapping tests were carried out to explore the effect of anisotropy on the lapping process. The results indicated that the HI of Z-cut was slightly higher than that of X-cut, while the E of Z-cut was about 1.1 times of the latter. The dc value of each orientation varies greatly. The lapping tests showed that the material removal rate (MRR) of Z-cut was lower than that of X-cut, for its high HI and E. Meanwhile, the surface quality of Z-cut was better than that of X-cut, for the larger dc of Z-cut. The research of mechanical properties of LN has guiding significance for its lapping process.

Study on 6H-SiC Crystal Substrate (0001) C Surface in FA-CMP Based on Diamond Particle

2015 ◽  
Vol 727-728 ◽  
pp. 244-247
Author(s):  
Zhu Qing Zhang ◽  
Kang Lin Xing
Keyword(s):  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Diamond Particle ◽  
Mechanical Polishing ◽  
Crystal Substrate ◽  
Fixed Abrasive ◽  
Free Abrasive

Through experimental study on the role of the free abrasive in chemical mechanical polishing, in this paper, four different types of abrasive which were chosen were used for the research of material removal rate(MRR) and surface quality of SiC single crystal . Finally ,Diamond abrasive which is considered was the most suitable for chemical mechanical polishing(CMP) abrasive of SiC Crystal Substrate. With diamond Particle polish pad polishing, it is draw a comparison result on the influence of the free abrasive and consolidation abrasive for the material removal rate and surface quality of 6H-SiC. The results showed that: the MRR is 140nm / min, the material removal rate if fixed abrasive chemical mechanical polishing(FA-CMP) more than three times that of traditional CMP, fixed abrasive chemical mechanical polishing pad, are involved in a large proportion of micro abrasive cutting, can greatly improve the material removal efficiency. And results from the test procedure, the FA-CMP surface has scratches after more technical problems for the polishing pad, the surface damage is relatively free of abrasive chemical mechanical polishing is more serious.

scholarly journals Optimal design and experimental study of fixed abrasive pads based on coupling of damping regulation and pellet arrangement

2021 ◽  
Vol 12 (1) ◽  
pp. 97-108
Author(s):  
Chaoqun Xu ◽  
Congfu Fang ◽  
Yuan Li ◽  
Chong Liu
Keyword(s):  
Surface Roughness ◽  
Pressure Distribution ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Wafer Surface ◽  
Test Results ◽  
Workpiece Material ◽  
Fixed Abrasive

Abstract. Lapping and polishing technology is an efficient processing method for wafer planarization processing. The structure of the fixed abrasive pad (FAP) is one of the most concerning issues in the research. The FAP structure affects the pressure distribution on the wafer surface, and the pressure distribution during processing has a significant influence on the wafer surface. Therefore, in this paper, a better pressure distribution is obtained by adjusting the angle of the spiral arrangement and the damping distribution of the damping layer of the FAP, thereby obtaining better processing quality. Based on the above theory, a new type of FAP, with coupling between the arrangement of the pellets and the damping regulation of the damping layer, was designed and optimized. The machining effects of different FAPs on the workpiece surface are compared in terms of material removal rate, material removal thickness, and surface roughness. The test results show that the workpiece material removal rate is higher than that of the traditional FAP when using the optimized FAP. The non-uniformity of the optimized FAP for that of material removal was 4.034 µm, which was lower than the traditional FAPs by 24.4 % and 17.6 %, respectively. The average surface roughness, Ra, of the optimized FAP is 0.21 µm, which is lower than 19.1 % and 12.5 % of the two traditional FAPs, respectively. Therefore, workpiece material removal and distribution are more uniform, and the surface quality of the workpiece is better when the optimized FAP processing is used. The test results prove that the optimized pellet arrangement and damping can achieve a better surface quality of the workpiece, which can meet the precision lapping process requirements for high-quality surfaces and large-scale production of brittle and hard materials such as sapphire.

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

Preparation and Evaluation of Hydrophilic Fixed Abrasive Pad

2010 ◽  
Vol 431-432 ◽  
pp. 17-20 ◽  
Author(s):  
Yong Wei Zhu ◽  
Jun Li ◽  
Jun Wang ◽  
Kui Lin
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Urethane Acrylate ◽  
Swelling Ratio ◽  
Pencil Hardness ◽  
Fixed Abrasive Pad ◽  
Preparation And Evaluation ◽  
Fixed Abrasive

The swelling ratio and the pencil hardness of pad were introduced to evaluate the properties of hydrophilic fixed abrasive (FA) pad. The effect of pad composition on its swelling ratio and pencil hardness was studied. Results show that the swelling ratio increases with the rise of content of Trimethylopropane Triacrylate (TMPTA) and Urethane Acrylate (PUA) and the pad gets harder while there is more TMPTA and less PUA. Results also show that a low swelling ratio corresponds to a high material removal rate (MRR), and a low wet pencil hardness to a low surface roughness in each group.

Productivity Considerations in Face Milling

2019 ◽  
Vol 952 ◽  
pp. 66-73
Author(s):  
János Kundrák ◽  
Viktor Molnár ◽  
István Deszpoth ◽  
Tamás Makkai
Keyword(s):  
Material Removal ◽  
Removal Rate ◽  
Cutting Speed ◽  
Face Milling ◽  
Manufacturing Companies ◽  
Performance Limits ◽  
Machining Time ◽  
High Productivity ◽  
Manufacturing Time

The kinematic versions and applied tools of milling allow for the machining of several surfaces and surface combinations, making it a versatile and widely applied procedure. Face milling for cutting is used for the high productivity manufacturing of prismatic components. Naturally, the enhancement of productivity is a primary goal for manufacturing companies; this study analyzes the efficiency of material removal, which directly influences the time parameters characterizing production performed by face milling. The focus of the paper is to identify the selection of technological data (feed, feed rate, cutting speed, diameter of milling head) that can reduce the machining time or increase the values of material removal rate. Cutting experiments were carried out for machining prismatic components from AlSi9Cu3(Fe) aluminum alloy by diamond tools. It was found that within the performance limits of the manufacturing system it is possible to save a significant amount of manufacturing time while retaining the specified geometric accuracy and surface quality of the component.

Finite Element Modeling of Pad Deformation due to Diamond Disc Conditioning in Chemical Mechanical Polishing (CMP)

2012 ◽  
Author(s):  
Emmanuel A. Baisie ◽  
Z. C. Li ◽  
X. H. Zhang
Keyword(s):  
Mechanical Properties ◽  
Finite Element ◽  
Material Removal ◽  
High Performance ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Element Analysis ◽  
Fea Model ◽  
Pad Wear ◽  
Diamond Disc

Chemical mechanical planarization (CMP) is widely used to planarize and smooth the surface of semiconductor wafers. In CMP, diamond disc conditioning is traditionally employed to restore pad planarity and surface asperity. Pad deformation which occurs during conditioning affects the material removal mechanism of CMP since pad shape, stress and strain are related to cut rate during conditioning, pad wear rate and wafer material removal rate (MRR) during polishing. Available reports concerning the effect of diamond disc conditioning on pad deformation are based on simplified models of the pad and do not consider its microstructure. In this study, a two-dimensional (2-D) finite element analysis (FEA) model is proposed to analyze the interaction between the diamond disc conditioner and the polishing pad. To enhance modeling fidelity, image processing is utilized to characterize the morphological and mechanical properties of the pad. An FEA model of the characterized pad is developed and utilized to study the effects of process parameters (conditioning pressure and pad stiffness) on pad deformation. The study reveals that understanding the morphological and mechanical properties of CMP pads is important to the design of high performance pads.

Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping

2009 ◽  
Vol 416 ◽  
pp. 439-442
Author(s):  
Xun Lv ◽  
Ju Long Yuan ◽  
Dong Hui Wen
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Processing Parameters ◽  
Good Surface ◽  
Ultra Precision ◽  
New Processing ◽  
Short Time

Semi bonded abrasive lapping is an effective ultra-precision lapping method. It can obtain good surface quality of workpiece in short time. This paper focused on the differences of processing features by comparing semi bonded abrasive lapping and loose abrasive lapping in several groups processing parameters. The results showed that the surface roughness of workpiece in semi bonded abrasive lapping was far superior to that of loose abrasive lapping in same processing parameters. And the MRR (material removal rate) of semi bonded abrasive lapping was slightly lower than that of loose abrasive lapping. For these features of semi bonded abrasive, a new processing flow would also be proposed in this paper.

scholarly journals Focused Ion Beam Milling of Single-Crystal Sapphire with A-, C-, and M-Orientations

Materials ◽  
2020 ◽  
Vol 13 (12) ◽  
pp. 2871
Author(s):  
Qiuling Wen ◽  
Xinyu Wei ◽  
Feng Jiang ◽  
Jing Lu ◽  
Xipeng Xu
Keyword(s):  
Single Crystal ◽  
Surface Quality ◽  
Material Removal ◽  
Focused Ion Beam ◽  
Removal Rate ◽  
Ion Beam ◽  
Crystal Orientations ◽  
Aluminum Ions ◽  
Single Crystal Sapphire

Sapphire substrates with different crystal orientations are widely used in optoelectronic applications. In this work, focused ion beam (FIB) milling of single-crystal sapphire with A-, C-, and M-orientations was performed. The material removal rate (MRR) and surface roughness (Sa) of sapphire with the three crystal orientations after FIB etching were derived. The experimental results show that: The MRR of A-plane sapphire is slightly higher than that of C-plane and M-plane sapphires; the Sa of A-plane sapphire after FIB treatment is the smallest among the three different crystal orientations. These results imply that A-plane sapphire allows easier material removal during FIB milling compared with C-plane and M-plane sapphires. Moreover, the surface quality of A-plane sapphire after FIB milling is better than that of C-plane and M-plane sapphires. The theoretical calculation results show that the removal energy of aluminum ions and oxygen ions per square nanometer on the outermost surface of A-plane sapphire is the smallest. This also implies that material is more easily removed from the surface of A-plane sapphire than the surface of C-plane and M-plane sapphires by FIB milling. In addition, it is also found that higher MRR leads to lower Sa and better surface quality of sapphire for FIB etching.

A Feasibility Study of the Material Removal Rate of the Conical End-Face of the Optical Fiber under Polishing

2014 ◽  
Vol 518 ◽  
pp. 19-24 ◽  
Author(s):  
Ying Chien Tsai ◽  
Guang Miao Huang ◽  
Jun Hong Chen ◽  
Inn Chyn Her
Keyword(s):  
Optical Fiber ◽  
Optical Fibers ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
High Quality ◽  
Flat Surfaces ◽  
The Past ◽  
Beam Delivery

The surfaces of the microlenses at the conical end-faces of optical fibers require high quality to keep the best performance of laser beam delivery. The polishing parameters play an important role to get the best quality of the microlenses. Most of the past researches study on the polishing parameters of flat surfaces. In this study, the polishing area of the conical end-face of the optical fiber is varied during fabrication. The relation between removed volume and removed thickness is built to determine the material removal rate. An experiment is carried out and the results show that the first two spinning turns are much effective for polishing under the parameters of the experiment.

Study on Fixed Abrasive Lapping Technology for Ceramic Balls

2006 ◽  
Vol 532-533 ◽  
pp. 460-463 ◽  
Author(s):  
Bing Hai Lv ◽  
Ju Long Yuan ◽  
Ying Xue Yao ◽  
Zhi Wei Wang
Keyword(s):  
Silicon Nitride ◽  
Material Removal Rate ◽  
Wear Mechanism ◽  
Material Removal ◽  
Removal Rate ◽  
Finishing Process ◽  
Photosensitive Resin ◽  
Ball Surface ◽  
Fixed Abrasive ◽  
Free Abrasive

To improve low lapping efficiency of silicon nitride balls in conventional lapping process, fixed abrasive lapping technology for ceramic balls is investigated in this paper. Diamond abrasives and photosensitive resin are used to fabricate the fixed abrasive plate. The lapped ball surface is observed with microscopy to identify the dominant wear mechanism. The results show that the material removal rate of the fixed abrasive lapping is about 20 times of that of conventional free abrasive lapping process, and the roughness is close to the conventional one. The experimental results indicate that the fixed abrasive lapping technology is a promising process to instead of conventional free abrasive lapping process for ceramic balls in rough and semi-finishing process.

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