scholarly journals Diseño de laboratorio lógico programable

2020 ◽  
pp. 24-29
Author(s):  
Ana Lilia González-Monzón ◽  
Luis Kevin Pacheco-Alvarado ◽  
Alfredo Aguilar-López
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Physical Support ◽  
Analog Electronics ◽  
Chip Processing ◽  
On Chip ◽  
Practice Time ◽  
Digital Components ◽  
Electronic Elements ◽  
Improved Characteristics

In the present work, emerging technologies require rapid training in them for SOC (System On Chip) processing, which has improved characteristics such as power consumption, system design and processing speed, which is why electronic elements that help with the learning and practice time of these topics, therefore the objective is to design a prototype of a programmable logic laboratory at the Tecnológico de Estudios Superiores de Jilotepec considering the nature of the project, it was developed through a methodology that will guide step to I pass the activities such as the CDIO that is used in the engineering area which consists of four stages: conception, design, implementation, the main contribution is to help students to carry out their practices through a printed circuit board or PCB that basically it is a physical support where all the electronic and digital components that are They are used in different subjects such as digital electronics, basic programming, advanced programming, digital control, analog electronics, which require using the devices to know their interconnection operation and through programming when carrying out the practices that make it up using the least possible time to carry out each one.

scholarly journals Toward a fully integrated automotive radar system-on-chip in 22 nm FD-SOI CMOS

2021 ◽  
pp. 1-9
Author(s):  
Philipp Ritter
Keyword(s):  
Millimeter Wave ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Digital Signal ◽  
Cmos Technology ◽  
Radar System ◽  
Circuit Board ◽  
Processing Unit ◽  
Automotive Radar ◽  
On Chip

Abstract Next-generation automotive radar sensors are increasingly becoming sensitive to cost and size, which will leverage monolithically integrated radar system-on-Chips (SoC). This article discusses the challenges and the opportunities of the integration of the millimeter-wave frontend along with the digital backend. A 76–81 GHz radar SoC is presented as an evaluation vehicle for an automotive, fully depleted silicon-over-insulator 22 nm CMOS technology. It features a digitally controlled oscillator, 2-millimeter-wave transmit channels and receive channels, an analog base-band with analog-to-digital conversion as well as a digital signal processing unit with on-chip memory. The radar SoC evaluation chip is packaged and flip-chip mounted to a high frequency printed circuit board for functional demonstration and performance evaluation.

scholarly journals Design and Implementation of SOC-Based Noncontact-Type Level Sensing for Conductive and Nonconductive Liquids

2021 ◽  
Vol 2021 ◽  
pp. 1-12
Author(s):  
J. L. Mazher Iqbal ◽  
Munagapati Siva Kishore ◽  
Arulkumaran Ganeshan ◽  
G. Narayan
Keyword(s):  
Printed Circuit Board ◽  
System On Chip ◽  
Circuit Board ◽  
Sensor Technology ◽  
Electromechanical Systems ◽  
Printed Circuit ◽  
Design And Implementation ◽  
Hardware System ◽  
On Chip

In contrast to the existing electromechanical systems, the noncontact-type capacitive measurement allows for a chemically and mechanically isolated, continuous, and inherently wear-free measurement. Integration of the sensor directly into the container’s wall offers considerable savings potential because of miniaturization and installation efforts. This paper presents the implementation of noncontact (NC)-type level sensing techniques utilizing the Programmable System on Chip (PSoC). The hardware system developed based on the PSoC microcontroller is interfaced with capacitive-based printed circuit board (PCB) strip. The designer has the choice of placing the sensors directly on the container or close to it. This sensor technology can measure both the conductive and nonconductive liquids with equal accuracy.

Optimized High Power GaN Transistors

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000195-000199
Author(s):  
J. Roberts ◽  
A. Mizan ◽  
L. Yushyna
Keyword(s):  
High Speed ◽  
Figure Of Merit ◽  
Printed Circuit Board ◽  
Heat Removal ◽  
Vital Role ◽  
Circuit Board ◽  
Die Structure ◽  
Power Switches ◽  
On Chip ◽  
Very High

GaN transistors intended for use at 600–900 V and that are capable of providing of 30–100 A are being introduced this year. These devices have a substantially better switching Figure-of-Merit (FOM) than silicon power switches. Rapid market acceptance is expected leading to compound annual growth rates of 85 %. However these devices present new packaging challenges. Their high speed combined with the very high current being switched demands that very low inductance packaging must be combined with highly controlled drive circuitry. While convention, and the usually vertical power device die structure, has largely determined power transistor package formats in the past, the lateral nature of the today GaN devices requires the use of new package types. The new packages have to operate at high temperatures while providing effective heat removal, low inductance, and low series resistance. Because GaN devices are lateral they require the package metal tracks to be integrated within the on-chip tracks to carry the current away from the thin on-chip metal tracks. The new GaN devices are available in two formats: one for use in embedded modular assemblies and the other for use mounted upon conventional circuit board systems. The package intended for discrete printed circuit board (PCB) assemblies has a top side cooling option that simplifies the thermal interface to the heat sink. The paper describes the die layout including the added copper tracks. The corresponding package elements that interface directly with the surface of the die play a vital role in terms of the current handling. They also provide the interface to the external busbars that allow the package to be mounted within, or on PCB. The assembly has been subject to extensive thermal analysis and the performance of a 30 A, 650 V transistor is described.

An Optimized On-Chip Boost-Type DC-DC Converter With an On-Board Inductance

2014 ◽  
Author(s):  
Paul C.-P. Chao ◽  
Ching-Hua Kuan ◽  
Jia-Wei Su
Keyword(s):  
Printed Circuit Board ◽  
High Efficiency ◽  
Rapid Development ◽  
Current Drive ◽  
Circuit Board ◽  
Electronic Products ◽  
Fully Integrated ◽  
Printed Circuit ◽  
Limited Output ◽  
On Chip

The rapid development of portable electronic products in recent years increases demands of varied displays. With resolutions of panel sizes and pixels under current drive capability improved, this study is intended for designing an inductive DC boost converter circuit for displays, which is fully integrated with IC fabrication technology [1][2]. Most of current displays employ capacitances for voltage-boosting to supply relative high-voltage biases to displays. These booster circuits are in small sizes and with high efficiency, but limited output currents, which are inadequate for some of large-sized displays. To remedy the problem, an on-board, small-sized inductor in the forms of coils in a printed circuit board (PCB) is proposed for a superior solution. This PCB-type inductor can be incorporated into the same board with other drive chips for the displays, while offering large, adequate current, as an incapable task via an on-chip coil.

scholarly journals Load-dependent power transfer efficiency for on-chip coils

2021 ◽  
Author(s):  
Joakim Nilsson ◽  
Johan Borg ◽  
Jonny Johansson
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Transfer Efficiency ◽  
Cmos Process ◽  
Power Transfer ◽  
Single Chip ◽  
Process Technology ◽  
Printed Circuit ◽  
Power Transfer Efficiency ◽  
On Chip

AbstractThis paper presents a theory for the power transfer efficiency of printed circuit board coils to integrated circuit coils, with focus on load-dependence for low-power single-chip systems. The theory is verified with electromagnetic simulations modelled on a 350 nm CMOS process which in turn are verified by measurements on manufactured integrated circuits. The power transfer efficiency is evaluated by on-chip rectification of a 151 MHz signal transmitted by a spiral coil on a printed circuit board at 10 mm of separation to an on-chip coil. Such an approach avoids the influence of off-chip parasitic elements such as bond wires, which would reduce the accuracy of the evaluation. It is found that there is a lower limit for the load below which reducing the power consumption of on-chip circuits yield no increase in voltage generated at the load. For the examined process technology, this limit appears to lie around 56 k$$\Omega$$ Ω . The paper is focused on the analysis and verification of the theory behind this limit. We relate the results presented in this work to the application of wireless single-chip temperature monitoring of power semiconductors and conclude that such a system would be compatible with this limit.

scholarly journals Printable graphene BioFETs for DNA quantification in Lab-on-PCB microsystems

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Sotirios Papamatthaiou ◽  
Pedro Estrela ◽  
Despina Moschou
Keyword(s):  
Printed Circuit Board ◽  
Point Of Care ◽  
Dna Amplification ◽  
Electrochemical Sensing ◽  
Circuit Board ◽  
Label Free ◽  
Transistor Channel ◽  
Lab On Chip ◽  
Passive Electrode ◽  
On Chip

AbstractLab-on-Chip is a technology that aims to transform the Point-of-Care (PoC) diagnostics field; nonetheless a commercial production compatible technology is yet to be established. Lab-on-Printed Circuit Board (Lab-on-PCB) is currently considered as a promising candidate technology for cost-aware but simultaneously high specification applications, requiring multi-component microsystem implementations, due to its inherent compatibility with electronics and the long-standing industrial manufacturing basis. In this work, we demonstrate the first electrolyte gated field-effect transistor (FET) DNA biosensor implemented on commercially fabricated PCB in a planar layout. Graphene ink was drop-casted to form the transistor channel and PNA probes were immobilized on the graphene channel, enabling label-free DNA detection. It is shown that the sensor can selectively detect the complementary DNA sequence, following a fully inkjet-printing compatible manufacturing process. The results demonstrate the potential for the effortless integration of FET sensors into Lab-on-PCB diagnostic platforms, paving the way for even higher sensitivity quantification than the current Lab-on-PCB state-of-the-art of passive electrode electrochemical sensing. The substitution of such biosensors with our presented FET structures, promises further reduction of the time-to-result in microsystems combining sequential DNA amplification and detection modules to few minutes, since much fewer amplification cycles are required even for low-abundance nucleic acid targets.

scholarly journals Study on effect of drilling rotational speed and tool wear on chip evacuation of micro drilling of printed circuit board

2016 ◽  
Vol 82 (834) ◽  
pp. 15-00463-15-00463 ◽  
Author(s):  
Hiromi YOSHIMURA ◽  
Yu KATAHIRA ◽  
Hidehito WATANABE ◽  
Taiju YAMASHITA
Keyword(s):  
Tool Wear ◽  
Rotational Speed ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Micro Drilling ◽  
On Chip

scholarly journals On-chip Direct Laser Writing of PAN-based Carbon Supercapacitor Electrodes

2021 ◽  
Author(s):  
Andreas Hoffmann ◽  
Pablo Jiménez-Calvo ◽  
Volker Strauss ◽  
Alexander Kühne
Keyword(s):  
Laser Power ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Carbon Electrodes ◽  
Direct Laser Writing ◽  
Laser Writing ◽  
Printed Circuit ◽  
Direct Laser ◽  
On Chip

We report carbonization of polyacrylonitrile by direct laser writing to produce microsupercapacitors directly on-chip. We demonstrate the process by producing interdigitated carbon finger electrodes directly on a printed circuit board, which we then employ to characterize our supercapacitor electrodes. By varying the laser power, we are able to tune the process from carbonization to material ablation. This allows to not only convert pristine polyacrylonitrile films into carbon electrodes, but also to pattern and cut away non-carbonized material to produce completely freestanding carbon electrodes. While the carbon electrodes adhere well to the printed circuit board, non-carbonized polyacrylonitrile is peeled off the substrate. We achieve specific capacities as high as 260 µF/cm2 in a supercapacitor with 16 fingers.

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