scholarly journals A Behavioral DC Model of 3D Distributed Diodes in Presence of Wideband Microwaves on Active Substrate Boards

2020 ◽  
Author(s):  
Pragnan Chakravorty
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Circuit Board ◽  
Actual Behavior ◽  
Rf Components ◽  
Active Substrate ◽  
New Type ◽  
Dc Bias ◽  
Ic Technology

In the past few years, a new type of circuit board, named here as active substrate board (ASB), was introduced over circuit applications of diodes. Unlike a traditional printed circuit board (PCB), an ASB has its substrate made of a semiconductor. The inability of the traditional integrated circuit (IC) technology to integrate wavelength dependent radio frequency (RF) components triggered the advent of ASBs. These boards draw desirable features from IC as well as PCB technologies. Unprecedented challenges came up in modeling the different devices fabricated on an ASB owing to their large sizes and the presence of wideband microwaves. So far, modeling the effect of large sizes and ambient microwaves on DC bias of diodes have not been considered in scientific literature. Furthermore, the state of the art numerical simulators are unable to imitate the behavior of such diodes observed over measurements. Here, a semi-analytical, behavioral DC model of three dimensional (3D), distributed diodes on ASB is presented that is fairly accurate in predicting the actual behavior of the diodes. The model also opines a novel phenomenon of an AC affecting a DC with an added resistance.

scholarly journals A DC Circuit Model of Distributed Diodes on Active Substrate Boards for CAD Tools

2021 ◽  
Author(s):  
Pragnan Chakravorty
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Circuit Model ◽  
Circuit Board ◽  
Actual Behavior ◽  
Rf Components ◽  
Active Substrate ◽  
New Type ◽  
Dc Bias ◽  
Ic Technology

In the past few years, a new type of circuit board, named here as active substrate board (ASB), was introduced over circuit applications of diodes. Unlike a traditional printed circuit board (PCB), an ASB has its substrate made of a semiconductor. The inability of the traditional integrated circuit (IC) technology to integrate wavelength dependent radio frequency (RF) components triggered the advent of ASBs. These boards draw desirable features from IC as well as PCB technologies. Unprecedented challenges came up in modeling the different devices fabricated on an ASB owing to their large sizes and the presence of wideband microwaves. So far, modeling the effect of large sizes and ambient microwaves on DC bias of diodes have not been considered in scientific literature. Furthermore, the state of the art numerical simulators are unable to imitate the behavior of such diodes observed over measurements. Here, a semi-analytical, circuit model of distributed diodes on ASB is presented that is fairly accurate in predicting the actual behavior of the diodes. The model also opines a novel phenomenon where microwaves affect the DC characteristics of diodes with added resistances.

scholarly journals A DC Circuit Model of Distributed Diodes on Active Substrate Boards for CAD Tools

2021 ◽  
Author(s):  
Pragnan Chakravorty
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Circuit Model ◽  
Circuit Board ◽  
Actual Behavior ◽  
Rf Components ◽  
Active Substrate ◽  
New Type ◽  
Dc Bias ◽  
Ic Technology

In the past few years, a new type of circuit board, named here as active substrate board (ASB), was introduced over circuit applications of diodes. Unlike a traditional printed circuit board (PCB), an ASB has its substrate made of a semiconductor. The inability of the traditional integrated circuit (IC) technology to integrate wavelength dependent radio frequency (RF) components triggered the advent of ASBs. These boards draw desirable features from IC as well as PCB technologies. Unprecedented challenges came up in modeling the different devices fabricated on an ASB owing to their large sizes and the presence of wideband microwaves. So far, modeling the effect of large sizes and ambient microwaves on DC bias of diodes have not been considered in scientific literature. Furthermore, the state of the art numerical simulators are unable to imitate the behavior of such diodes observed over measurements. Here, a semi-analytical, circuit model of distributed diodes on ASB is presented that is fairly accurate in predicting the actual behavior of the diodes. The model also opines a novel phenomenon where microwaves affect the DC characteristics of diodes with added resistances.

High quality factor fractal inductor with complementary split-ring array inclusion

Circuit World ◽  
2020 ◽  
Vol 46 (3) ◽  
pp. 215-219
Author(s):  
Akhendra Kumar Padavala ◽  
Narayana Kiran Akondi ◽  
Bheema Rao Nistala
Keyword(s):  
Quality Factor ◽  
Circuit Design ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Circuit Board ◽  
Integrated Circuit Design ◽  
Split Ring ◽  
Content Type ◽  
Practical Implications

Purpose This paper aims to present an efficient method to improve quality factor of printed fractal inductors based on electromagnetic band-gap (EBG) surface. Design/methodology/approach Hilbert fractal inductor is designed and simulated using high-frequency structural simulator. To improve the quality factor, an EBG surface underneath the inductor is incorporated without any degradation in inductance value. Findings The proposed inductor and Q factor are measured based on well-known three-dimensional simulator, and the results are compared experimentally. Practical implications The proposed method was able to significantly decrease the noise with increase in the speed of radio frequency and sensor-integrated circuit design. Originality/value Fractal inductor is designed and simulated with and without EBG surfaces. The measurement of printed circuit board prototypes demonstrates that the inclusion of split-ring array as EBG surface increases the quality factor by 90 per cent over standard fractal inductor of the same dimensions with a small degradation in inductance value and is capable of operating up to 2.4 GHz frequency range.

scholarly journals Harmonic Dual-Band Diode Mixer for the X- and K-Bands

2021 ◽  
Vol 21 (1) ◽  
pp. 64-70
Author(s):  
Jeong Hun Park ◽  
Moon-Que Lee
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Dual Band ◽  
Printed Circuit ◽  
Rf Components ◽  
Reconfigurable Devices ◽  
X Band ◽  
Measurement Results ◽  
K Band

This paper presents a new dual-band diode mixer for the X- and K-bands. The proposed mixer consists of a pair of series-connected diodes and a frequency-dependent delay line that operates at 180° and 360° at the X-band of 10.525 GHz and at the K-band of 24.15 GHz, respectively. Without reconfigurable devices such as switches, the proposed mixer operates as a single-balanced diode mixer at the X-band and a subharmonically pumped antiparallel diode mixer at the K-band simultaneously. The designed circuit was implemented in a hybrid microwave integrated circuit using discretely packaged RF components on a microwave printed circuit board. The measurement results showed conversion losses of 6.5 dB and 16.6 dB at the X- and K-bands, respectively.

scholarly journals Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages

Energies ◽  
2020 ◽  
Vol 13 (12) ◽  
pp. 3054
Author(s):  
Konstantin O. Petrosyants ◽  
Nikita I. Ryabov
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Software Tool ◽  
Thermal Design ◽  
Circuit Board ◽  
Processing Unit ◽  
Processor Time ◽  
3D Ic ◽  
Central Processing

The problem of thermal modeling of modern three-dimensional (3D) integrated circuit (IC) systems in packages (SiPs) is discussed. An effective quasi-3D (Q3D) approach of thermal design is proposed taking into account the specific character of 3D IC stacked multilayer constructions. The fully-3D heat transfer equation for global multilayer construction is reduced to the set of coupled two-dimensional (2D) equations for separate construction layers. As a result, computational difficulties, processor time, and RAM volume are significantly reduced, while accuracy can be provided. A software tool, Overheat-3D-IC, was developed on the base of the generalized Q3D package numerical model. For the first time, the global 3D thermal performances across the modern integrated circuit/through-silicon via/ball grid array (IC-TSV-BGA) and multi-chip (MC)-embedded printed circuit board (PCB) packages were simulated. A ten times decrease of central processing unit (CPU) time was achieved as compared with the 3D solutions obtained by commercial universal 3D simulators, while saving the sufficient accuracy. The simulation error of maximal temperature TMAX determination for different types of packages was not more than 10–20%.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Implementation of tunable resonators in planar groove gap waveguide technology

2021 ◽  
pp. 1-7
Author(s):  
Titus Oyedokun ◽  
Riana H. Geschke ◽  
Tinus Stander
Keyword(s):  
Printed Circuit Board ◽  
Tuning Range ◽  
Frequency Tuning ◽  
Resonant Cavity ◽  
Circuit Board ◽  
Resonant Cavities ◽  
Tunable Resonators ◽  
Simulation Strategy ◽  
Dc Bias ◽  
Continuous Frequency

Abstract We present a tunable planar groove gap waveguide (PGGWG) resonant cavity at Ka-band. The cavity demonstrates varactor loading and biasing without bridging wires or annular rings, as commonly is required in conventional substrate-integrated waveguide (SIW) resonant cavities. A detailed co-simulation strategy is also presented, with indicative parametric tuning data. Measured results indicate a 4.48% continuous frequency tuning range of 32.52–33.98 GHz and a Qu tuning range of 63–85, corresponding to the DC bias voltages of 0–16 V. Discrepancies between simulated and measured results are analyzed, and traced to process variation in the multi-layer printed circuit board stack, as well as unaccounted varactor parasitics and surface roughness.

Three Dimensional Detection of the via in the PCB CT Image Using Morphology Operation

2015 ◽  
Vol 752-753 ◽  
pp. 1406-1412
Author(s):  
Lei Zeng ◽  
Jian Chen ◽  
Han Ning Li ◽  
Bin Yan ◽  
Yi Fu Xu ◽  
...  
Keyword(s):  
Nondestructive Testing ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Detection Algorithm ◽  
Circuit Board ◽  
Dimensional Structure ◽  
Three Dimension ◽  
Shape Information ◽  
Printed Circuit ◽  
Testing Technology

In modern industry, the nondestructive testing of printed circuit board (PCB) can prevent effectively the system failure and is becoming more and more important. As a vital part of the PCB, the via connects the devices, the components and the wires and plays a very important role for the connection of the circuits. With the development of testing technology, the nondestructive testing of the via extends from two dimension to three dimension in recent years. This paper proposes a three dimensional detection algorithm using morphology method to test the via. The proposed algorithm takes full advantage of the three dimensional structure and shape information of the via. We have used the proposed method to detect via from PCB images with different size and quality, and found the detection performances to be very encouraging.

Numerical Investigation of Heat Transfer of Twelve Plastic Leaded Chip Carrier (PLCC) by Using Computational Fluid Dynamic, FLUENTTM Software

2013 ◽  
Vol 795 ◽  
pp. 603-610 ◽  
Author(s):  
Mohamed Mazlan ◽  
A. Rahim ◽  
M.A. Iqbal ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
W. Razak ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Fluid Dynamic ◽  
Three Dimensional ◽  
Circuit Board ◽  
Junction Temperature ◽  
Inlet Velocity ◽  
Chip Carrier ◽  
Flow Through ◽  
Package Density ◽  
Heat And Fluid Flow

Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit board, is carried out using a commercial CFD code, FLUENTTM. The simulation is performed for 12 PLCC under different inlet velocities and chip powers. The contours of average junction temperatures are obtained for each package under different conditions. It is observed that the junction temperature of the packages decreases with increase in inlet velocity and increases with chip power. Moreover, the increase in package density significantly contributed to rise in temperature of chips. Thus the present simulation demonstrates that the chip density (the number of packages mounted on a given area), chip power and the coolant inlet velocity are strongly interconnected; hence their appropriate choice would be crucial.

scholarly journals POSIBILITY OF CREATING A PRINTED SINGLE-LAYER TRANSREFLECTOR WITH INCREASED PHASE EFFICIENCY

2019 ◽  
pp. 139-145
Author(s):  
A. N. Mikhailov
Keyword(s):  
Printed Circuit Board ◽  
Single Layer ◽  
Circuit Board ◽  
Horizontal Polarization ◽  
Radiation Characteristics ◽  
Printed Circuit ◽  
W Band ◽  
New Type ◽  
Reflectarray Antenna ◽  
Geometrical Dimensions

A new type of single‑layer transrefleсtor structure based on microstrip reflective antenna array is described. The developed  device is a single‑layer printed circuit board on one side of which a system of printed reflectors is located, and on the other is  a polarization structure consisting of parallel metal conductors, in contrast to a microstrip reflectarray antenna. The shape and  geometrical dimensions of printed reflectors arranged in a rectangular or hexagonal (triangular) pattern are chosen in such a way  that they transform a spherical front of an incident vertically polarized electromagnetic wave into a flat front of reflected wave. In  the case of irradiation of the developed transreflector with a horizontal polarization wave, the printed structure makes minimal  electromagnetic energy loss during its passage. The results of characteristics modeling (including phase curves) of an element  of the reflective lattice in the W‑band for different angles of incidence of the wave on the planar structure under study are given.  Based on the results obtained, the sizes of the reflective elements of the transreflector, which provide for the correction of the  incident wave with the necessary phase discrete, are determined and an electrodynamic model of the transreflector antenna is  built. The simulation of the main radiation characteristics of the antenna with the developed single‑layer transreflector was carried  out.

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