scholarly journals A top-down approach for fabricating three-dimensional closed hollow nanostructures with permeable thin metal walls

2017 ◽  
Vol 8 ◽  
pp. 1231-1237 ◽  
Author(s):  
Carlos Angulo Barrios ◽  
Víctor Canalejas-Tejero
Keyword(s):  
Three Dimensional ◽  
Photonic Devices ◽  
Thin Metal ◽  
Silicon Substrates ◽  
Top Down ◽  
Optical Resonance ◽  
Pattern Design ◽  
Design Flexibility ◽  
Microelectronic Fabrication ◽  
Hollow Nanostructures

We report on a top-down method for the controlled fabrication of three-dimensional (3D), closed, thin-shelled, hollow nanostructures (nanocages) on planar supports. The presented approach is based on conventional microelectronic fabrication processes and exploits the permeability of thin metal films to hollow-out polymer-filled metal nanocages through an oxygen-plasma process. The technique is used for fabricating arrays of cylindrical nanocages made of thin Al shells on silicon substrates. This hollow metal configuration features optical resonance as revealed by spectral reflectance measurements and numerical simulations. The fabricated nanocages were demonstrated as a refractometric sensor with a measured bulk sensitivity of 327 nm/refractive index unit (RIU). The pattern design flexibility and controllability offered by top-down nanofabrication techniques opens the door to the possibility of massive integration of these hollow 3D nano-objects on a chip for applications such as nanocontainers, nanoreactors, nanofluidics, nano-biosensors and photonic devices.

Development of Thin Metal Film Deposition Process for the Intravascular Catheter

1999 ◽  
Author(s):  
Seok Chung ◽  
Jun Keun Chang ◽  
Dong Chul Han
Keyword(s):  
Metal Film ◽  
Three Dimensional ◽  
Deposition Process ◽  
Medical Application ◽  
Thin Metal Film ◽  
Film Deposition ◽  
Thin Metal ◽  
Mems Devices ◽  
Sensors And Actuators ◽  
Custom Made

Abstract To make some MF.MS devices such as sensors and actuators be useful in the medical application, it is required to integrate this devices with power or sensor lines and to keep the hole devices biocompatible. Integrating micro machined sensors and actuators with conventional copper lines is incompatible because the thin copper lines are not easy to handle in the mass production. To achieve the compatibility of wiring method between MEMS devices, we developed the thin metal film deposition process that coats micropattered thin copper films on the non silicon-wafer substrate. The process was developed with the custom-made three-dimensional thin film sputter/evaporation system. The system consists of process chamber, two branch chambers, substrate holder unit and linear/rotary motion feedthrough. Thin metal film was deposited on the biocompatible polymer, polyurethane (PellethaneR) and silicone, catheter that is 2 mm in diameter and 1,000 mm in length. We deposited Cr/Cu and Ti/Cu layer and made a comparative study of the deposition processes, sputtering and evaporation. The temperature of both the processes were maintained below 100°C, for the catheter not melting during the processes. To use the films as signal lines connect the signal source to the actuator on the catheter tip, we machined the films into desired patterns with the eximer laser. In this paper, we developed the thin metal film deposition system and processes for the biopolymeric substrate used in the medical MEMS devices.

Top down nano technologies in surface modification of materials

Open Physics ◽  
2011 ◽  
Vol 9 (2) ◽  
Author(s):  
Branislav Radjenović ◽  
Marija Radmilović-Radjenović
Keyword(s):  
Surface Modification ◽  
Three Dimensional ◽  
Wet Etching ◽  
Plasma Reactors ◽  
Top Down ◽  
Isotropic Etching ◽  
Microelectronic Devices ◽  
Etching Profile ◽  
Simulation Results ◽  
Low K

AbstractThis article contains a broad overview of etch process as one of the most important top-down technologies widely used in semiconductor manufacturing and surface modification of nanostructures. In plasma etching process, the complexity comes from the introduction of new materials and from the constant reduction in dimensions of the structures in microelectronics. The emphasis was made on two types of etching processes: dry etching and wet etching illustrated by three dimensional (3D) simulation results for the etching profile evolution based on the level set method. The etching of low-k dielectrics has been demonstrated via modelling the porous materials. Finally, simulation results for the roughness formation during isotropic etching of nanocomposite materials as well as smoothing of the homogeneous materials have also been shown and analyzed. Simulation results, presented here, indicate that with shrinking microelectronic devices, plasma and wet etching interpretative and predictive modeling and simulation have become increasingly more attractive as a tool for design, control and optimization of plasma reactors.

Fabrication and electrochemical characterization of super-capacitor based on three-dimensional composite structure of graphene and a vertical array of carbon nanotubes

2018 ◽  
Vol 52 (22) ◽  
pp. 3039-3044 ◽  
Author(s):  
Daniel Choi ◽  
Eui-Hyeok Yang ◽  
Waqas Gill ◽  
Aaron Berndt ◽  
Jung-Rae Park ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Vapor Deposition ◽  
Composite Structure ◽  
Graphene Layer ◽  
Three Dimensional ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Silicon Substrates ◽  
Vertical Array ◽  
Pressure Chemical

We have demonstrated a three-dimensional composite structure of graphene and carbon nanotubes as electrodes for super-capacitors. The goal of this study is to fabricate and test the vertically grown carbon nanotubes on the graphene layer acting as a spacer to avoid self-aggregation of the graphene layers while realizing high active surface area for high energy density, specific capacitance, and power density. A vertical array of carbon nanotubes on silicon substrates was grown by a low-pressure chemical vapor deposition process using anodized aluminum oxide nanoporous template fabricated on silicon substrates. Subsequently, a graphene layer was grown by another low-pressure chemical vapor deposition process on top of a vertical array of carbon nanotubes. The Raman spectra confirmed the successful growth of carbon nanotubes followed by the growth of high-quality graphene. The average measured capacitance of the three-dimensional composite structure of graphene-carbon nanotube was 780 µFcm−2 at 100 mVs−1.

iPattern

2017 ◽  
Vol 6 (2) ◽  
pp. 12-27
Author(s):  
Youmna Bassiouny ◽  
Rimon Elias ◽  
Philipp Paulsen
Keyword(s):  
Design Pattern ◽  
Design Patterns ◽  
Three Dimensional ◽  
Computational Design ◽  
Pattern Design ◽  
Design Problems ◽  
Innovative Design ◽  
Rule Based ◽  
Science And Art ◽  
Design Software

Computational design takes a computer science view of design, applying both the science and art of computational approaches and methodologies to design problems. This article proposes to convert design methodologies studied by designers into rule-based computational design software and help them by providing suggestions for designs to build upon given a set of primitive shapes and geometrical rules. iPattern is a pattern-making software dedicated to designers to generate innovative design patterns that can be used in a decorative manner. They may be applied on wallpapers, carpets, fabric textiles, three-dimensional lanterns, tableware, etc. The purpose is to create a modern pattern design collection that adds a new essence to the place. In order to generate creative design patterns, primitive shapes and geometrical rules are used. The generated design pattern is constructed based on the grid of the Flower of Life of the sacred geometry or similar grids constructed using primitive shapes (rectangles, squares and triangles) combined in the layout of the Flower of Life.

A Novel Scheme for Wide Bandwidth Chip-to-Chip Communications

2007 ◽  
Vol 4 (1) ◽  
pp. 1-7 ◽  
Author(s):  
Qing Liu ◽  
Patrick Fay ◽  
Gary H. Bernstein
Keyword(s):  
Integrated Circuits ◽  
Coplanar Waveguide ◽  
Impedance Matching ◽  
Three Dimensional ◽  
Fabrication Process ◽  
Silicon Substrates ◽  
Electromagnetic Simulations ◽  
Communication Paradigm ◽  
On Chip ◽  
Test Chips

Quilt Packaging (QP), a novel chip-to-chip communication paradigm for system-in-package integration, is presented. By forming protruding metal nodules along the edges of the chips and interconnecting integrated circuits (ICs) through them, QP offers an approach to ameliorate the I/O speed bottleneck. A fabrication process that includes deep reactive ion etching, electroplating, and chemical-mechanical polishing is demonstrated. As a low-temperature process, it can be easily integrated into a standard IC fabrication process. Three-dimensional electromagnetic simulations of coplanar waveguide QP structures have been performed, and geometries intended to improve impedance matching at the interface between the on-chip interconnects and the chip-to-chip nodule structures were evaluated. Test chips with 100 μm wide nodules were fabricated on silicon substrates, and s-parameters of chip-to-chip interconnects were measured. The insertion loss of the chip-to-chip interconnects was as low as 0.2 dB at 40 GHz. Simulations of 20 μm wide QP structures suggest that the bandwidth of the inter-chip nodules is expected to be above 200 GHz.

scholarly journals Geometric and Kinematic Analyses and Novel Characteristics of Origami-Inspired Structures

Symmetry ◽  
2019 ◽  
Vol 11 (9) ◽  
pp. 1101 ◽  
Author(s):  
Yao Chen ◽  
Jiayi Yan ◽  
Jian Feng
Keyword(s):  
Flexible Electronics ◽  
Kinematic Analysis ◽  
Three Dimensional ◽  
Research Progress ◽  
The Novel ◽  
Pattern Design ◽  
Research Directions ◽  
Practical Engineering ◽  
Kinematic Analyses ◽  
The Common

In recent years, origami structures have been gradually applied in aerospace, flexible electronics, biomedicine, robotics, and other fields. Origami can be folded from two-dimensional configurations into certain three-dimensional structures without cutting and stretching. This study first introduces basic concepts and applications of origami, and outlines the common crease patterns, whereas the design of crease patterns is focused. Through kinematic analysis and verification on origami structures, origami can be adapted for practical engineering. The novel characteristics of origami structures promote the development of self-folding robots, biomedical devices, and energy absorption members. We briefly describe the development of origami kinematics and the applications of origami characteristics in various fields. Finally, based on the current research progress of crease pattern design, kinematic analysis, and origami characteristics, research directions of origami-inspired structures are discussed.

Study on Body Foundation of Brassiere Steel Ring Shapes

2011 ◽  
Vol 331 ◽  
pp. 101-104
Author(s):  
Su Zhen Liang
Keyword(s):  
Three Dimensional ◽  
Material Design ◽  
Pattern Design ◽  
Body Scanning ◽  
The Core ◽  
Female Breast ◽  
Core Technology ◽  
Breast Shape ◽  
Design And Manufacture ◽  
The Relationship

The pattern design of brassieres is the core technology for the design and manufacture of brassieres, while the female breast shape and part dimensions are the foundations for pattern design of brassieres. Based upon 3D body scanning, this paper studied the relationship between the breast root shape and the steel ring by considering the features of the pattern design of the brassiere. It concludes that the breast root girth is a complicated three-dimensional curve; it’s inappropriate for the neighboring size’s brassieres to adopt the steel ring with the same specification; the material design of the steel ring should be moderate. The purpose is to provide human body basis for pattern design of brassieres and achieve more standard and scientific pattern design of the brassiere by the underwear enterprises.

scholarly journals Active Surface with Dynamic Microstructures and Hierarchical Gradient Enabled by in situ Pneumatic Control

Micromachines ◽  
2020 ◽  
Vol 11 (11) ◽  
pp. 992
Author(s):  
Jian-Nan Wang ◽  
Benfeng Bai ◽  
Qi-Dai Chen ◽  
Hong-Bo Sun
Keyword(s):  
Large Amplitude ◽  
Three Dimensional ◽  
Active Surface ◽  
Bonding Process ◽  
Dynamic Topography ◽  
Large Area ◽  
Pneumatic Control ◽  
Design Flexibility ◽  
Surface Microstructures

An active surface with an on-demand tunable topography holds great potential for various applications, such as reconfigurable metasurfaces, adaptive microlenses, soft robots and four-dimensional (4D) printing. Despite extensive progress, to achieve refined control of microscale surface structures with large-amplitude deformation remains a challenge. Moreover, driven by the demand of constructing a large area of microstructures with increased complexity—for instance, biomimetic functional textures bearing a three-dimensional (3D) gradient—novel strategies are highly desired. Here, we develop an active surface with a dynamic topography and three-tier height gradient via a strain-tunable mismatching-bonding process. Pneumatic actuation allows for rapid, reversible and uniform regulation of surface microstructures at the centimeter scale. The in-situ modulation facilitates large-amplitude deformation with a maximum tuning range of 185 μm. Moreover, the structural gradient can be modulated by programming the strain value of the bonding process. With our strategy, another two types of surfaces with a four-tier gradient and without gradient were also prepared. By providing active modulation and design flexibility of complicated microstructures, the proposed strategy would unlock more opportunities for a wealth of novel utilizations.

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