The Evaluation of the Simulation of Thermal Conductivity Coefficient Based on the Concrete with Minimum Thermal Resistance

2013 ◽  
Vol 448-453 ◽  
pp. 3320-3323
Author(s):  
Chao Zhao ◽  
Du Shun Ting
Keyword(s):  
Thermal Conductivity ◽  
Temperature Field ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Theoretical Basis ◽  
Thermal Conductivity Coefficient ◽  
Great Influence ◽  
Coefficient Of Thermal Conductivity ◽  
Primary Materials

The coefficient of thermal conductivity is one of the important parameters of concretes thermal performance and it has a relatively great influence on the temperature field inside its structure. This paper explores the basic equipments of the experiment on concretes coefficient of thermal conductivity and the requirements on configuration of primary materials. In the meanwhile, it studies the establishment of the model of concretes coefficient of thermal conductivity from the theoretical basis of thermal conductivity simulation, the division of thermal fluxs pathways and that of K in the formula of the coefficient of thermal conductivity.

scholarly journals An Improved Thermal Performance Modeling for High-speed Spindle of Machine Tool Based on Thermal Contact Resistance Analysis

2021 ◽  
Author(s):  
Bing Fang ◽  
Mengna Cheng ◽  
Tianqi Gu ◽  
Dapeng Ye
Keyword(s):  
Temperature Field ◽  
Temperature Distribution ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
High Speed ◽  
Thermal Contact ◽  
Great Influence ◽  
Contact Thermal Resistance ◽  
Spindle System ◽  
Fea Model

Abstract The distribution of the temperature field has a great influence on structural performance, thermal deformation, thermal error compensation. To improve the prediction accuracy of the temperature distribution of the spindle system, a comprehensive model considering the contact thermal resistance (TCR) of the interfaces was established to analyze the thermal performance of high-speed spindle system in the present work. An elastoplastic contact model was used to calculate the contacting areas and loads of interfaces, which were employed to establish the contact thermal resistance model of the main interfaces of spindle, such as bearing rings and tool holders. Basing on the TCR parameters, a Finite Element Analysis (FEA) model was proposed to analyze the temperature distribution of the spindle system. And a temperature test experiment was set up to verify the accuracy of the FEA model. The results show that the relative error of representative test points was all less than 5%, which means the established model can appropriately reflect the temperature field distribution of the spindle.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

2017 ◽  
Author(s):  
Shenghui Lei ◽  
Alexandre Shen ◽  
Ryan Enright
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Silicon Photonics ◽  
Communication Systems ◽  
Device Fabrication ◽  
Ring Resonators ◽  
Wide Range ◽  
Soi Substrates ◽  
The Impact

Silicon photonics has emerged as a scalable technology platform for future optotelectronic communication systems. However, the current use of SiO2-based silicon-on-insulator (SOI) substrates presents a thermal challenge to integrated active photonic components such as lasers and semiconductor optical amplifiers due to the poor thermal properties of the buried SiO2 optical cladding layer beneath these devices. To improve the thermal performance of these devices, it has been suggested that SiO2 be replaced with aluminum nitride (AlN); a dielectric with suitable optical properties to function as an effective optical cladding that, in its crystalline state, demonstrates a high thermal conductivity (∼100× larger than SiO2 in current SOI substrates). On the other hand, the tuning efficiencies of thermally-controlled optical resonators and phase adjusters, crucial components for widely tunable lasers and modulators, are directly proportional to the thermal resistance of these devices. Therefore, the low thermal conductivity buried SiO2 layer in the SOI substrate is beneficial. Moreover, to further improve the thermal performance of these devices air trenches have been used to further thermally isolate these devices, resulting in up to ∼10× increase in tuning efficiency. Here, we model the impact of changing the buried insulator on a SOI substrate from SiO2 to high quality AlN on the thermal performance of a MRR. We map out the thermal performance of the MRR over a wide range of under-etch levels using a thermo-electrical model that incorporates a pseudo-etching approach. The pseudo-etching model is based on the diffusion equation and distinguishes the regions where substrate material is removed during device fabrication. The simulations reveal the extent to which air trenches defined by a simple etch pattern around the MRR device can increase the thermal resistance of the device. We find a critical under-etch below which no benefit is found in terms of the MRR tuning efficiency. Above this critical under-etch, the tuning efficiency increases exponentially. For the SiO2-based MRR, the thermal resistance increases by ∼7.7× between the un-etched state up to the most extreme etch state. In the unetched state, the thermal resistance of the AlN-based MRR is only ∼4% of the SiO2-based MRR. At the extreme level of under-etch, the thermal resistance of the AlN-based MRR is still only ∼60% of the un-etched SiO2-based MRR. Our results suggest the need for a more complex MRR thermal isolation strategy to significantly improve tuning efficiencies if an AlN-based SOI substrate is used.

Study of Effective Thermal Conductivity of Glazed Hollow Bead Concrete

2016 ◽  
Vol 851 ◽  
pp. 823-828
Author(s):  
Bing Zhang ◽  
Zhong Qing Cheng
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Thermal Conductivity Coefficient ◽  
Interface Thermal Resistance

Based on analyzing the mechanism of thermal conductivity of glazed hollow bead concrete, this paper divides the channels of thermal conductivity in concrete, constructs the model of thermal conductivity coefficient based on the Theory of Minimum Thermal Resistance, and confirms the model by using the data of other related literatures and the data of our own experiment. The consequence indicates that this model can calculate the thermal conductivity coefficient under arid state exactly. In order to improve the accuracy of this model, we should take the shape of framework, the interface thermal resistance between concrete and framework into consideration

Constructal Design of Y-Shaped Conductive Pathways for Cooling a Heat-Generating Body

2014 ◽  
Vol 348 ◽  
pp. 245-260 ◽  
Author(s):  
Cristina dos Santos Horbach ◽  
Elizaldo Domingues dos Santos ◽  
Liércio André Isoldi ◽  
Luiz Alberto Oliveira Rocha
Keyword(s):  
Thermal Conductivity ◽  
Temperature Field ◽  
Thermal Performance ◽  
Hot Spots ◽  
Finite Size ◽  
High Conductivity ◽  
High Thermal Conductivity ◽  
Optimal Distribution ◽  
Constructal Design ◽  
Optimal Geometry

This paper applies constructal design to obtain numerically the configuration that facilitates the access of the heat that flows through Y-shaped pathways of a high-conductivity material embedded within a square-shaped heat-generating medium of low-conductivity to cooling this finite-size volume. The objective is to minimize the maximal excess of temperature of the whole system, i.e., the hot spots, independent of where they are located. The total volume and the volume of the material of high thermal conductivity are fixed. Results show that there is no universal optimal geometry for the Y-shaped pathways for every value of high conductivity investigated here. For small values of high thermal conductivity material the best shape presented a well defined format of Y. However, for larger values of high thermal conductivity the best geometry tends to a V-shaped (i.e., the length of stem is suppressed and the bifurcated branches penetrates deeply the heat-generating body towards the superior corners). A comparison between the Y-shaped pathway configuration with a simpler I-shaped blade and with X-shaped configuration was also performed. For constant values of area fraction occupied with a high-conductivity material and the ratio between the high thermal conductivity material and low conductivity of the heat-generating body (φ = 0.1 and = 100) the Y-shaped pathways performed 46% and 13% better when compared to I-shaped and X-shaped pathway configuration, respectively. The best thermal performance is obtained when the highest temperatures (hot spots) are better distributed in the temperature field, i.e., according to the constructal principle of optimal distribution of imperfections.

Research on Temperature Field about Cutting Area in Plunge Milling Ti Alloy Based on Finite Element

2010 ◽  
Vol 102-104 ◽  
pp. 630-633
Author(s):  
Xu Da Qin ◽  
Wei Cheng Liu ◽  
Hao Jia ◽  
Xiao Lai Ji
Keyword(s):  
Thermal Conductivity ◽  
Finite Element ◽  
Temperature Field ◽  
Thermal Conductivity Coefficient ◽  
Cutting Speed ◽  
Cutting Parameters ◽  
Ti Alloy ◽  
Plunge Milling ◽  
Finite Element Software

Because of the small thermal conductivity coefficient of Ti alloy, the heat cannot disperse timely and accumulate seriously when plunge milling Ti alloy. If the cutting parameters can not be controlled well, the phenomenon of sticking will happen easily. According to the simulation and analysis of temperature field by using finite element software ABAQUS, the influence on cutting speed and feed for the Distributing of Temperature Field about Cutting Area in Plunge Milling Ti Alloy is acquired.

Effect of Soil Moisture on Soil Temperature Field Near Buried Pipe

2012 ◽  
Vol 204-208 ◽  
pp. 650-653
Author(s):  
Jiang Li ◽  
Jun Ping Fu ◽  
Wu Gang Xie
Keyword(s):  
Thermal Conductivity ◽  
Temperature Field ◽  
Soil Moisture ◽  
Heat Exchanger ◽  
Moisture Content ◽  
Field Experiment ◽  
Soil Temperature ◽  
Soil Moisture Content ◽  
Thermal Conductivity Coefficient ◽  
Soil Thermal Conductivity

System effectiveness and useful life of heat pump are directly affected by whether the design of ground heat exchanger is reasonable or not. The efficiency of heat exchanger has a close relationship with soil thermal conductivity coefficient and heat diffusivity, while soil moisture content affects soil thermal conductivity coefficient and soil temperature field. In this paper, we perform numerical simulation on CFD software. Then we study the soil temperature changes through field experiment in different soil moisture content on field experiment and finally obtained the relationships of the moisture content with the single U ground soil temperature field.

Multi-scale thermal modeling of glass interposer for mobile electronics application

2016 ◽  
Vol 26 (3/4) ◽  
pp. 1157-1171 ◽  
Author(s):  
Sangbeom Cho ◽  
Venky Sundaram ◽  
Rao Tummala ◽  
Yogendra Joshi
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Thermal Performance ◽  
Memory Bandwidth ◽  
Vapor Chamber ◽  
Packaging Technology ◽  
Content Type ◽  
Low Thermal Conductivity ◽  
Multi Scale

Purpose – The functionality of personal mobile electronics continues to increase, in turn driving the demand for higher logic-to-memory bandwidth. However, the number of inputs/outputs supported by the current packaging technology is limited by the smallest achievable electrical line spacing, and the associated noise performance. Also, a growing trend in mobile systems is for the memory chips to be stacked to address the growing demand for memory bandwidth, which in turn gives rise to heat removal challenges. The glass interposer substrate is a promising packaging technology to address these emerging demands, because of its many advantages over the traditional organic substrate technology. However, glass has a fundamental limitation, namely low thermal conductivity (∼1 W/m K). The purpose of this paper is to quantify the thermal performance of glass interposer-based electronic packages by solving a multi-scale heat transfer problem for an interposer structure. Also, this paper studies the possible improvement in thermal performance by integrating a fluidic heat spreader or vapor chamber within the interposer. Design/methodology/approach – This paper illustrates the multi-scale modeling approach applied for different components of the interposer, including Through Package Vias (TPVs) and copper traces. For geometrically intricate and repeating structures, such as interconnects and TPVs, the unit cell effective thermal conductivity approach was used. For non-repeating patterns, such as copper traces in redistribution layer, CAD drawing-based thermal resistance network analysis was used. At the end, the thermal performance of vapor chamber integrated within a glass interposer was estimated by using an enhanced effective thermal conductivity, calculated from the published thermal resistance data, in conjunction with the analytical expression for thermal resistance for a given geometry of the vapor chamber. Findings – The limitations arising from the low thermal conductivity of glass can be addressed by using copper structures and vapor chamber technology. Originality/value – A few reports can be found on thermal performance of glass interposers. However thermal characteristics of glass interposer with advanced cooling technology have not been reported.

Investigation on the Use of Nanofluids to Enhance Heat Pipe Performance

Solar Energy ◽  
2005 ◽  
Author(s):  
Tomer Israeli ◽  
T. Agami Reddy ◽  
Young I. Cho
Keyword(s):  
Thermal Conductivity ◽  
Surface Tension ◽  
Thermal Resistance ◽  
Copper Oxide ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Experimental Studies ◽  
Heat Pipes ◽  
Thermal Network ◽  
Overall Resistance

This paper reports on preliminary experimental results on using nanofluids to enhance the thermal performance of heat pipes. Our experience with preparing copper oxide (CuO) nanofluids is described. Contrary to earlier studies which report infinite shelf life, we found that nanofluid stability lasted for about three weeks only; an issue which merits further study. We have also conducted various experiments to measure the variation of thermal conductivity and surface tension with CuO nanofluid concentration. Actual experiments on nanofluid heat pipes were also performed which indicated an average 12.5% decrease in the overall thermal resistance of the heat pipe using nanofluid of 3% vol concentration. This observed improvement is fairly consistent with our predictions using a simple analytical thermal network model for heat pipe overall resistance and the measured nanofluid conductivity. The results, though encouraging, need more careful and elaborate experimental studies before the evidence can be deemed conclusive.

Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications

2000 ◽  
Author(s):  
V. H. Adams ◽  
V. A. Chiriac ◽  
T.-Y. Tom Lee
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Thermal Performance ◽  
Transfer Problem ◽  
Effective Area ◽  
Printed Wiring Board ◽  
Heat Spreader ◽  
Fine Pitch ◽  
Plastic Ball

Abstract Computational Fluid Dynamics (CFD) simulations were conducted to characterize the thermal performance of Molded Array Plastic Ball Grid Array (MAP PBGA) packages for hand-held applications. Due to size constraints, these PBGA packages tend to have fine pitch solder ball arrays and small overall size. Thermal analysis is required to assess the design risks associated with this trend toward smaller size and increasing power dissipation requirements. A conjugate heat transfer problem, in which radiative losses from the exposed surfaces of the package and the printed wiring board to the walls of the wind tunnel, was solved for horizontal natural convection cooling conditions. Thermal model assumptions and development for the MAP PBGA package are provided. The model is benchmarked with measurements obtained for a 64 I/O 0.8 mm pitch, 8 mm MAP PBGA. Predictions for junction-to-ambient thermal resistance were within 10% of measured values. Baseline simulations were conducted for 0.8 mm pitch MAP PBGA packages with substrate/die size combinations in the range of 6 to 12 mm substrate size and 3.81 to 7.62 mm die size. Junction-to-ambient thermal resistances varied over the range of 28.8 °C/W to 62.4 °C/W. Methods to improve thermal performance of these packages were investigated. Previous work indicated that effective conduction to the substrate by heat spreaders, metallic lids, mold compound, heat sinks, and their combinations promoted thermal performance. A necessary further step is to understand how effective area for heat spreading inside the package affects its thermal behavior, while varying the die size for package configurations with and without heat spreader. Studies were conducted to evaluate thermal performance improvement through the use of a copper heat spreader on the package top surface as it is affected by die size, package size, and substrate effective thermal conductivity. Substrate effective thermal conductivity is varied through the use of two and four layer substrates with thermal vias under the die. Results show a modest 1% to 15% reduction in junction-to-ambient thermal resistance for the MAP PBGA package sizes of interest.

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