Research on Bonding of PMMA Microfluidic Chip with Precisely Controlled Bonding Pressure

2011 ◽  
Vol 221 ◽  
pp. 8-14 ◽  
Author(s):  
Bing Yan Jiang ◽  
Zhou Zhou ◽  
Yao Liu
Keyword(s):  
Microfluidic Chip ◽  
Simulation Analysis ◽  
Bonding Temperature ◽  
Production Cycle ◽  
Microfluidic Chips ◽  
Bonding Pressure ◽  
Finite Element Software ◽  
Conventional Procedure ◽  
Bonding Technology ◽  
Increasing Temperature

Microfluidic chips have a great prospect in the field of biochemical analysis with advantages of fast processes, high flux and low consumption. Molding and bonding are separated by the conventional procedure of hot embossing and bonding, resulting in low automation and long production cycle. In order to reduce cycle time and achieve mass production, this paper proposed In-mold Bonding technology with precisely controlled bonding pressure by injection molding machine’s movement of core-pulling. So simulation analysis for bonding process of PMMA microfluidic chip was carried out using finite element software to study microchannel distortion at different bonding temperature and pressure. The results show that, at a certain bonding pressure, when bonding temperature was lower than glass transition temperature(Tg), microchannel distortion didn’t change significantly, when bonding temperature was higher than Tg, microchannel deformation increases with increasing temperature. Small microchannel distortion was obtained at a temperature of 108°C,which was recommended as the suitable bonding temperature.

A process analysis for microchannel deformation and bonding strength by in-mold bonding of microfluidic chips

2015 ◽  
Vol 35 (3) ◽  
pp. 267-275 ◽  
Author(s):  
Chunpeng Chu ◽  
Bingyan Jiang ◽  
Laiyu Zhu ◽  
Fengze Jiang
Keyword(s):  
Bonding Strength ◽  
Process Analysis ◽  
Bonding Temperature ◽  
Bonding Time ◽  
Production Cycle ◽  
Microfluidic Chips ◽  
Bonding Pressure ◽  
Bonding Parameters ◽  
Bonding Technology ◽  
Assembly Technology

Abstract A novel combination of thermal bonding and in-mold assembly technology was created to produce microfluidic chips out of polymethylmethacrylate (PMMA), which is named “in-mold bonding technology”. In-mold bonding experiments of microfluidic chips were carried out to investigate the influences of bonding process parameters on the deformation and bonding strength of microchannels. The results show that bonding temperature has the greatest impact on the deformation of microchannels, while bonding pressure and bonding time have more influence on deformation in height than in top width. Considering the bonding strength, the bonding temperature and the bonding pressure have more impact than the bonding time. The time is crucial for the sealing of the chips. By setting the bonding parameters reasonably, the microchannel deformation is <10%, while the bonding strength of the chips is 350 kPa. The production cycle of the chip is reduced to <5 min.

Efficient Diffusion Bonding between BSCCO Superconducting Multifilamentary Tapes

2008 ◽  
Vol 580-582 ◽  
pp. 295-298
Author(s):  
Gui Sheng Zou ◽  
Yan Ju Wang ◽  
Ai Ping Wu ◽  
Hai Lin Bai ◽  
Nai Jun Hu ◽  
...  
Keyword(s):  
High Temperature ◽  
Diffusion Bonding ◽  
New Technology ◽  
Bonding Temperature ◽  
Interface Bonding ◽  
Bonding Pressure ◽  
Bonding Parameters ◽  
Efficient Diffusion ◽  
Bonding Technology ◽  
Multifilamentary Tapes

To improve the joining efficiency of Bi-Sr-Ca-Cu-O ( BSCCO) superconducting tapes, a new diffusion bonding technology with a direct uniaxial pressing at high temperature was developed to join 61-filament tapes. It was observed that bonding parameters such as bonding pressure and holding time, significantly affected the critical current ratio (CCRo). A peak CCRo value of 89 % for the lap-joined tapes was achieved at 3 MPa for 2 h when bonding temperature was 800 °C. Compared with the conventional diffusion bonding technology, this new technology remarkably shortened the fabrication period and improved the superconductivity of the joints. The bonding interface and microstructures of the joints were evaluated and correlated to the CCRo. An uniaxial pressing at high temperature was beneficial to interface bonding, and there was an optimal pressure value for the CCRo.

scholarly journals A fast and simple bonding method for low cost microfluidic chip fabrication

2018 ◽  
Vol 69 (1) ◽  
pp. 72-78 ◽  
Author(s):  
Zhifu Yin ◽  
Helin Zou
Keyword(s):  
Microfluidic Chip ◽  
Low Cost ◽  
Adhesive Tape ◽  
Microfluidic Chips ◽  
Bonding Pressure ◽  
Gas Leakage ◽  
Microstructure Fabrication ◽  
Chip Fabrication ◽  
Commercial Applications ◽  
Bonding Method

Abstract With the development of the microstructure fabrication technique, microfluidic chips are widely used in biological and medical researchers. Future advances in their commercial applications depend on the mass bonding of microfluidic chip. In this study we are presenting a simple, low cost and fast way of bonding microfluidic chips at room temperature. The influence of the bonding pressure on the deformation of the microchannel and adhesive tape was analyzed by numerical simulation. By this method, the microfluidic chip can be fully sealed at low temperature and pressure without using any equipment. The dye water and gas leakage test indicated that the microfluidic chip can be bonded without leakage or block and its bonding strength can up to 0.84 MPa.

Study on the Manufacture of Microfluidic Chip with Coated Glass

2012 ◽  
Vol 548 ◽  
pp. 254-257 ◽  
Author(s):  
Yan He ◽  
Bai Ling Huang ◽  
Yong Lai Zhang ◽  
Li Gang Niu
Keyword(s):  
Microfluidic Chip ◽  
Low Cost ◽  
Microfluidic Channel ◽  
Critical Factor ◽  
Wet Etching ◽  
Microfluidic Chips ◽  
Etching Technique ◽  
Chip Quality ◽  
Wet Chemical ◽  
Wet Chemical Etching

In this paper, a simple and facile technique for manufacturing glass-based microfluidic chips was developed. Instead of using expensive dry etching technology, the standard UV lithography and wet chemical etching technique was used to fabricate microchannels on a K9 glass substrate. The fabrication process of microfluidic chip including vacuum evaporation, annealing, lithography, and BHF (HF-NH4F-H2O) wet etching were investigated. Through series experiments, we found that anneal was the critical factor for chip quality. As a representative example, a microfluidic channel with 20 m of depth, and 80 m of width was successfully prepared, and the channel surfaces are quite smooth. These results present a simple, low cost, flexible and easy way to fabricate glass-based microfluidic chips.

Numerical Simulation on Heat Dissipating Performance of New Pipe with Grid Plate

2012 ◽  
Vol 532-533 ◽  
pp. 417-421
Author(s):  
Chang Li Song ◽  
Jing Ji
Keyword(s):  
Heat Transfer ◽  
Simulation Analysis ◽  
Heat Transfer Analysis ◽  
Finite Element Software ◽  
Grid Plate ◽  
Steady State Heat ◽  
Steady State Heat Transfer ◽  
Energy Conservation Law ◽  
Optimal Diameter ◽  
Selection Of

In order to improve the pipe dissipating area, a kind of new pipe with grid plate is proposed in this paper. Based on the basic principle of heat transfer and energy conservation law, by finite element software ANSYS the simulation analysis of the steady-state heat transfer of the new pipeline is carried out, process of ANSYS modeling, loading and solving is introduced in detail, the distribution of temperature and stress for pipe with a grid plate is given, these can provide the foundation for the selection of the optimal diameter of the grid plate and transient heat transfer analysis of pipe.

Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000474-000518
Author(s):  
Hiroshi Komatsu
Keyword(s):  
Screen Printing ◽  
Flip Chip ◽  
Bonding Temperature ◽  
Complex Form ◽  
Fine Tuning ◽  
Electric Resistance ◽  
Flip Chip Bonding ◽  
Strong Adhesion ◽  
Bonding Technology ◽  
Ag Paste

Since its early days of the industry, electronics apparatus has been in a rigid and flat surfaced case. ICs have been soldered on rigid substrate at high bonding temperature. However, in the IoT era, electronics components connect with the variety of applications which require different forms and shapes of outlook which lead substrate and board should be flexible and complex form. Conventional flip chip bonding technology, such as solder bump and copper pillar, need to raise bonding temperature around 260-degree C, eventually does not satisfy this flexile hybrid electronics (FHE) application requirement. We have originally developed flip chip bonding technology which consists of the bump formation by Conductive Paste (CP) printing followed by Non-Conductive Paste (NCP) dispensing and flip chip bonding at temperature as low as 120-degree C. Bumps with silver particle loaded epoxy resin on substrate were formed by screen printing. This enable us to make fine bump formation down to 60um minimum bump pitch and 30um bump diameter with tuning of screen-printing process. After the bump formation, NCP dispensing and flip chip bonding at 120-degree C which secure reasonable low electric resistance, 8×1E-4 ohm cm2, and strong adhesion of chip and substrate. The bonding temperature of this technology can be lowered down to 80-degree C without much difficulties, but just by fine tuning of Ag paste and its contents. This momentum will create a lot more of future applications and be one of the core technologies in the coming IoT era in FHE.

Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001009-001032
Author(s):  
Mark Oliver ◽  
Jong-Uk Kim ◽  
Michael Gallagher ◽  
Zidong Wang ◽  
Janet Okada ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Spin Coating ◽  
Bonding Temperature ◽  
High Volume ◽  
Wafer Surface ◽  
Process Time ◽  
Adhesion Promoter ◽  
Excellent Thermal Stability ◽  
Carrier Wafer ◽  
Bonding Technology

Temporary wafer bonding has emerged as the method of choice for handling silicon wafers during the thinning and high-temperature backside processing required for the manufacture of 3D device structures. Among the requirements for temporary wafer bonding materials to be used in high volume manufacturing are simple device and carrier wafer preparation, high-throughput wafer bonding, excellent thermal stability, and clean room-temperature release directly from the device wafer. We will present successful temporary wafer bonding using a new BCB (benzocyclobutene)-based material that can meet these requirements. For this temporary wafer bonding technology, wafer preparation involves spin coating the device wafer with the BCB-based adhesive to a thickness of up to 100 μm and spin coating the carrier wafer with an adhesion promoter. The wafers can then be bonded at temperatures as low as 80 °C for as short as 30 seconds. The low bonding temperature means the wafers can be loaded into a preheated wafer bonding tool, eliminating the time needed to heat and cool the bonding chucks during the bonding cycle. Also, no curing of the material is required during the bonding, enabling a short process time and high wafer throughput. Curing of the adhesive is done as a batch oven cure at 210 °C for one hour after which the material is stable enough for backside processes up to 300 °C. The material has been designed to adhere well to the carrier wafer and debond directly from the device wafer without any chemical or radiation pretreatment, leaving a clean device wafer surface in need of only mild cleaning before further processing.

scholarly journals The new bud light steel system and the geometric shape evolution of light steel framework for COVID-19 patients appointed hospital (Huoshenshan hospital)

2020 ◽  
Vol 39 (6) ◽  
pp. 9015-9026
Author(s):  
Lilin Wang
Keyword(s):  
Simulation Analysis ◽  
Steel Structure ◽  
Model Material ◽  
Construction Process ◽  
Actual Measurement ◽  
Finite Element Software ◽  
Whole Process ◽  
Long Time ◽  
The Common ◽  
Actual Size

The light steel structure is always the common material of the movable plank house, and the new bud light steel system is the light steel system used for a long time after the earthquake. This paper discusses the mechanical system of the light steel structure of Huoshenshan hospital, which was built in ten days. In the process of building, the geometric form of roof stress has changed. In the actual structural design, the designer seldom takes the calculation of construction load into account, which is quite different from the actual construction process. So it is very important to simulate and monitor the whole process of structure installation. In this paper, the finite element software MIDAS / Gen is used for simulation analysis to ensure that the simulation analysis results are consistent with the construction process, the model material and the actual size are completely consistent, and the stress simulated by the software can meet the needs of the actual stress through the actual measurement.

Study on Vertical Wind-Induced Vibration Response for Portal Frame Structures

2011 ◽  
Vol 71-78 ◽  
pp. 3605-3609
Author(s):  
De Zhi Liang ◽  
Min Huang
Keyword(s):  
Simulation Analysis ◽  
Vertical Wind ◽  
Wind Pressure ◽  
Frame Structure ◽  
Finite Element Software ◽  
Average Wind ◽  
Portal Frame ◽  
Wind Vibration ◽  
Portal Frame Structure ◽  
The Impact

In recent years, as the portal frame’s height toward higher and the span toward wider, the influence of wind vibration becomes more and more prominent among the portal frame structure. In the design of the portal frame, there are many different opinions on whether considering the impact of the vertical wind vibration to the portal frame. This paper taking a true engineering as an example, using finite element software to establish the solid model of the portal frame structure, selecting the junction of purlin and roof as a node of imposing vertical fluctuating wind load, we made numerical simulation analysis of vertical wind vibration. The simulation results will be compared with data of the internal forces and deformation under the average wind pressure. The results showed that: vertical wind vibration has a prominent effect to the portal frame and should be considered in the design.

Design and Simulation Analysis of Steel-Truss Cantilever Structur

2012 ◽  
Vol 170-173 ◽  
pp. 3308-3311
Author(s):  
Ke Li ◽  
Jing Ji
Keyword(s):  
Carrying Capacity ◽  
Structural Design ◽  
Simulation Analysis ◽  
Steel Frame ◽  
Industrial Plant ◽  
Structural Form ◽  
Materials Selection ◽  
Finite Element Software ◽  
Cantilever Structure ◽  
Steel Truss

In combination with a industrial plant cantilever structure need be increased for meeting the technological requirements，the three kinds of structural design schemes of cantilever are considered, that is the scheme hanging on steel frame of the plant, prestressed steel frame scheme and steel truss scheme. Three kinds of structural form and materials selection are introduced. By finite element software ANSYS three kinds of schemes are analyzed, carrying capacity and deflection of members under load are acquired, by Comparison steel truss scheme is adopted. Carrying capacity and deflection of structure not only meet requirements, but also the construction is easy. This paper provides reference for resolving similar cantileve r problems in engineering.

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