Investigation of Surface Roughness for Grinding Silicon Wafer of the Micro Pellet Diamond Tool

2013 ◽  
Vol 797 ◽  
pp. 273-278
Author(s):  
Shenq Yih Luo ◽  
Tsung Han Yu
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Feed Rate ◽  
Material Removal ◽  
Rotation Speed ◽  
Wafer Surface ◽  
Diamond Grit ◽  
Spindle Rotation ◽  
Optimal Value ◽  
Grinding Tool

The purpose of this paper was to investigate the silicon wafer surface roughness ground by the micro pellet grinding tool and the electroplated disc grinding tool with diamond grit size of 4-6 μm and 10-20μm under the spindle rotation speed of 500-2500 rpm and the feed rate of 1-5 μm/min. The results showed that the micro pellet grinding tool can get a better surface roughness of the silicon wafer than the electroplated disc tool. When the tools containing a larger diamond grit were employed, selecting a higher spindle rotation speed and a lower feed rate can obtain a better wafer roughness. However, when the tools of a smaller diamond grit were used, the spindle rotaion speed operates properly at a optimal value to obtain a best wafer surface roughness, which achieves Ra = 0.03-0.06 μm for the micro pellet tool. Besides, the material removal mechanism during the grinding silicon wafer for these two tools displayed mainly ductile grinding behavior.

scholarly journals Effect to the Surface Composition in Ultrasonic Vibration-Assisted Grinding of BK7 Optical Glass

2020 ◽  
Vol 10 (2) ◽  
pp. 516 ◽  
Author(s):  
Pei Yi Zhao ◽  
Ming Zhou ◽  
Xian Li Liu ◽  
Bin Jiang
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal ◽  
Surface Composition ◽  
Rotation Speed ◽  
Optical Glass ◽  
Machined Surface ◽  
Spindle Rotation ◽  
Ultrasonic Vibration Assisted Grinding ◽  
Ductile Removal

Because of the changes in cutting conditions and ultrasonic vibration status, the proportion of multiple material removal modes are of uncertainty and complexity in ultrasonic vibration-assisted grinding of optical glass. Knowledge of the effect of machined surface composition is the basis for better understanding the influence mechanisms of surface roughness, and also is the key to control the surface composition and surface quality. In the present work, 32 sets of experiments of ultrasonic vibration-assisted grinding of BK7 optical glass were carried out, the machined surface morphologies were observed, and the influence law of machining parameters on the proportion of different material removal was investigated. Based on the above research, the effect of surface composition was briefly summarized. The results indicated that the increasing of spindle rotation speed, the decreasing of feed rate and grinding depth can improve the proportion of ductile removal. The introduction of ultrasonic vibration can highly restrain the powdering removal, and increase the proportion of ductile removal. Grinding depth has a dominant positive effect on the surface roughness, whereas the spindle rotation speed and ultrasonic amplitude both have negative effect, which was caused by the reduction of brittle fracture removal.

scholarly journals Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer

Micromachines ◽  
2020 ◽  
Vol 11 (6) ◽  
pp. 544
Author(s):  
Tianchen Zhao ◽  
Qianfa Deng ◽  
Cheng Zhang ◽  
Kaiping Feng ◽  
Zhaozhong Zhou ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Electric Field ◽  
Silicon Wafer ◽  
Field Intensity ◽  
Process Parameters ◽  
Material Removal ◽  
Electric Field Intensity ◽  
High Efficiency ◽  
Rotation Speed ◽  
High Quality

Silicon wafer with high surface quality is widely used as substrate materials in the fields of micromachines and microelectronics, so a high-efficiency and high-quality polishing method is urgently needed to meet its large demand. In this paper, a dielectrophoresis polishing (DEPP) method was proposed, which applied a non-uniform electric field to the polishing area to slow down the throw-out effect of centrifugal force, thereby achieving high-efficiency and high-quality polishing of silicon wafers. The principle of DEPP was described. Orthogonal experiments on important polishing process parameters were carried out. Contrast polishing experiments of silicon wafer were conducted. The orthogonal experimental results showed that the influence ratio of electric field intensity and rotation speed on material removal rate (MRR) and surface roughness was more than 80%. The optimal combination of process parameters was electric field intensity 450 V/mm, rotation speed 90 rpm, abrasive concentration 30 wt%, size of abrasive particle 80 nm. Contrast polishing experiments indicated that the MRR and material removal uniformity of DEPP were significantly better than traditional chemical mechanical polishing (CMP). Compared with the traditional CMP, the MRR of DEPP was increased by 17.6%, and the final surface roughness of silicon wafer reached Ra 0.31 nm. DEPP can achieve high-efficiency and high-quality processing of silicon wafer.

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

Parametric Study of Micro Machining Three Dimensional Microstructure with the Tiny-Grinding Wheel Based on the EMR Effect

2010 ◽  
Vol 447-448 ◽  
pp. 193-197
Author(s):  
Wei Qiang Gao ◽  
Qiu Sheng Yan ◽  
Yi Liu ◽  
Jia Bin Lu ◽  
Ling Ye Kong
Keyword(s):  
Magnetic Field ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Rotation Speed ◽  
Optical Glass ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Machining Time ◽  
Fluctuation Phenomenon

Electro-magneto-rheological (EMR) fluids, which exhibit Newtonian behavior in the absence of a magnetic field, are abruptly transformed within milliseconds into a Bingham plastic under an applied magnetic field, called the EMR effect. Based on this effect, the particle-dispersed EMR fluid is used as a special instantaneous bond to cohere abrasive particles and magnetic particles together so as to form a dynamical, flexible tiny-grinding wheel to machine micro-groove on the surface of optical glass. Experiments were conducted to reveal the effects of process parameters, such as the feed rate of the horizontal worktable, feeding of the Z axis, machining time and machining gap, on material removal rate of glass. The results indicate that the feed rate of the worktable at horizontal direction has less effect on material removal rate, which shows a fluctuation phenomenon within a certain range. The feed rate of the Z axis directly influences the machining gap and leads to a remarkable change on material removal rate. Larger material removal rate can be obtained when the feeding frequency of Z direction is one time per processing. With the increase of rotation speed of the tool, material removal rate increases firstly and decreases afterwards, and it gets the maximum value with the rotation speed of 4800 rev/min. The machining time is directly proportional to material removal amount, but inversely proportional to material removal rate. Furthermore, material removal rate decreases with the increase of the machining gap between the tool and the workpiece. On the basis of above, the machining mode with the tiny-grinding wheel based on the EMR effect is presented.

Investigation of Surface Roughness and Material Removal Rate for High Speed Micro End Milling on PMMA

2015 ◽  
Vol 1115 ◽  
pp. 12-15
Author(s):  
Nur Atiqah ◽  
Mohammad Yeakub Ali ◽  
Abdul Rahman Mohamed ◽  
Md. Sazzad Hossein Chowdhury
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
High Speed ◽  
End Milling ◽  
Removal Rate ◽  
Spindle Speed ◽  
Depth Of Cut ◽  
Micro End Milling

Micro end milling is one of the most important micromachining process and widely used for producing miniaturized components with high accuracy and surface finish. This paper present the influence of three micro end milling process parameters; spindle speed, feed rate, and depth of cut on surface roughness (Ra) and material removal rate (MRR). The machining was performed using multi-process micro machine tools (DT-110 Mikrotools Inc., Singapore) with poly methyl methacrylate (PMMA) as the workpiece and tungsten carbide as its tool. To develop the mathematical model for the responses in high speed micro end milling machining, Taguchi design has been used to design the experiment by using the orthogonal array of three levels L18 (21×37). The developed models were used for multiple response optimizations by desirability function approach to obtain minimum Ra and maximum MRR. The optimized values of Ra and MRR were 128.24 nm, and 0.0463 mg/min, respectively obtained at spindle speed of 30000 rpm, feed rate of 2.65 mm/min, and depth of cut of 40 μm. The analysis of variance revealed that spindle speeds are the most influential parameters on Ra. The optimization of MRR is mostly influence by feed rate. Keywords:Micromilling,surfaceroughness,MRR,PMMA

scholarly journals Experimental Study on Machinability of Zr-Based Bulk Metallic Glass during Micro Milling

Micromachines ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 86 ◽  
Author(s):  
Tao Wang ◽  
Xiaoyu Wu ◽  
Guoqing Zhang ◽  
Bin Xu ◽  
Yinghua Chen ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Metallic Glass ◽  
Bulk Metallic Glass ◽  
Feed Rate ◽  
Rotation Speed ◽  
Amorphous Structure ◽  
Micro Milling ◽  
Depth Of Cut ◽  
Milling Force ◽  
Coated Cemented Carbide

The micro machinability of Zr41.2Ti13.8Cu12.5Ni10Be22.5 bulk metallic glass (BMG) was investigated by micro milling with coated cemented carbide tools. The corresponding micro milling tests on Al6061 were conducted for comparison. The results showed that the tool was still in stable wear stage after milling 300 mm, and the surface roughness Ra could be maintained around 0.06 μm. The tool experienced only slight chipping and rubbing wear after milling the BMG, while a built-up edge and the coating peeling off occurred severely when milling Al6061. The influence of rotation speed on surface roughness was insignificant, while surface roughness decreased with the reduction of feed rate, and then increased dramatically when the feed rate was below 2 μm/tooth. The surface roughness increased gradually with the axial depth of cut (DOC). Milling force decreased slightly with the increase in rotation speed, while it increased with the increase in axial DOC, and the size effect on milling force occurred when the feed rate decreased below 1 μm/tooth. The results of X-ray diffraction (XRD) showed that all milled surfaces were still dominated by an amorphous structure. This study could pave a solid foundation for structural and functional applications.

Experimental Study on the Surface Roughness in Mesoscopic-Scale Grinding of Nickel-Based Superalloy

2016 ◽  
Vol 1136 ◽  
pp. 9-14
Author(s):  
Yun Guang Zhou ◽  
Ya Dong Gong ◽  
Yang Sun ◽  
Zhong Xiao Zhu ◽  
Qi Gao
Keyword(s):  
Mathematical Model ◽  
Surface Roughness ◽  
Feed Rate ◽  
Theoretical Basis ◽  
Spindle Speed ◽  
Range Analysis ◽  
Mesoscopic Scale ◽  
Nickel Based Superalloy ◽  
Grinding Parameters ◽  
Grinding Tool

This paper uses micro-grinding tool with 500# grains and 0.9 mm diameter to grind nickel-based superalloy Inconel600 through three factors(grinding depth, feed rate, spindle speed ) at three levels orthogonal grinding experiment in mesoscopic scale. Then according to the range analysis of surface roughness, the primary and secondary influencial factors are found; the micro grinding parameters are optimized ,the results show: the influence of the feed rate(vf)is the biggest, followed by the spindle speed(n), the grinding depth(ap) is minimal, when n=50kr/min, vf=100μm/s, ap=6μm, the grinding surface roughness is minimum: Ra=579nm; finally , the regression mathematical model of micro grinding surface roughness is established, the relative error of the calculated value and experimental measurements is low, showing that this regression mathematical model is accurate and effective. This study provides a theoretical basis for the micro grinding parameters and surface quality control of nickel-based superally.

Experimental Study on Parameter Optimization of Silicon Wafer CMP Using Composite Abrasives Slurry

2009 ◽  
Vol 69-70 ◽  
pp. 214-218
Author(s):  
Xue Feng Xu ◽  
H.T. Ma ◽  
B.X. Ma ◽  
Wei Peng
Keyword(s):  
Silicon Wafer ◽  
Material Removal Rate ◽  
Material Removal ◽  
Colloidal Silica ◽  
Rotation Speed ◽  
Removal Rate ◽  
Polymer Particle ◽  
Optimal Parameters ◽  
Polymer Particles ◽  
Mechanism Of Interaction

In order to increase the material removal rate of silicon wafer, composite abrasives slurry was used in CMP. The mechanism of interaction between silica abrasives and polymer particles was analyzed. Small silica abrasives were seen to attach onto the surface of the polymer particles. Composite abrasives slurry was obtained by adding polymer particles into single abrasive slurry. Three key parameters, the concentration of colloidal silica, the concentration of polymer particle and the speed of polishing, which influence the material removal rate of silicon wafer were analyzed by Taguchi method and the optimal parameters were obtained. Experimental results indicated that the maximum material removed rate of 353nm/min was obtained when optimal craft parameters of 5% colloidal silica, 3% polymer particle, 50rpm plate and carrier rotation speed were selected.

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