The Effect of SiC Particle Size on the Microstructure and Hardness of SiCp/Cu Composites
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The chemical plating technology was applied in order to improve the weaker wettability between the copper and SiC particles for electronic packaging applications. The hot-press sintering technique was executed to fabricate SiCp/Cu composites. The influence of SiC particles size on the phase constitute, micro-structure morphology and vickers hardness were investigated in details by means of X-ray diffraction, scanning electron microscope and vickers hardness tester. The results showed that SiC particle were distributed in copper matrix uniformly and interface was clear. The relative density and vickers hardness of SiCp/Cu composites increased as SiC particle size enhanced.
2015 ◽
Vol 50
(8)
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pp. 1049-1058
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2014 ◽
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pp. 621-626
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pp. 192-196
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2008 ◽
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pp. 430-434
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2012 ◽
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