New Glass Sealing Method with Lead-Free Solders
2006 ◽
Vol 45
◽
pp. 1604-1607
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Keyword(s):
We have developed a novel technique of joining a pair of glass substrates. In the process, molten solder penetrates the gap between the glass substrates while the solder-glass interfaces are being activated by friction. The activation is given by a metal plate, which slides through the gap along the edge of the paired glass substrates and brings in the molten solder by capillary-action. A Ti-doped Sn-Zn eutectic solder showed good hermetic sealing of glass. A eutectic In-Sn solder also yielded good joining, especially at low sealing temperatures.
2003 ◽
Vol 18
(7)
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pp. 1528-1534
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2004 ◽
Vol 15
(4)
◽
pp. 219-223
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2018 ◽
Vol 32
(19)
◽
pp. 1840059
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Keyword(s):
2003 ◽
Vol 18
(11)
◽
pp. 2540-2543
◽
2013 ◽
Vol 58
(2)
◽
pp. 529-533
◽
Keyword(s):