Development of the Protection Coat for Metallic Structures Based on the Intercalated Graphite Compounds

2021 ◽  
Vol 1045 ◽  
pp. 9-16
Author(s):  
Valeriy Kassov ◽  
Elena Berezshnaya ◽  
Nikolay Malyhin ◽  
Yana Antonenko ◽  
Kateryna Zubenko
Keyword(s):  
Thermal Stability ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Metallic Structures ◽  
Metal Structures ◽  
Graphite Content ◽  
Intercalated Graphite ◽  
Technological Characteristics ◽  
Preliminary Preparation ◽  
Oxidized Graphite

The practicability of introducing a synthesized graphite compound, intercalated with oxygen, into the protection coat is grounded. The composition and the method of manufacturing a protection coat based on the oxidized graphite, which does not require preliminary preparation of the metal structures surface before welding with an open arc, have been developed. The effect of the oxidized graphite content in the composition of the protection coat on its thermal stability and thermal expansion coefficient is analyzed. The main technological characteristics of the developed protection coat have been investigated and their compliance with the basic criteria for constructing protection coats has been confirmed.

Hollow doughnut shaped mesoporous silica nanoparticles for reduction of the thermal expansion coefficient of poly(ether sulfone) films

2018 ◽  
Vol 42 (7) ◽  
pp. 5045-5051
Author(s):  
Nhat Tri Vo ◽  
Astam K. Patra ◽  
Dukjoon Kim
Keyword(s):  
Thermal Stability ◽  
Thermal Expansion ◽  
Optical Properties ◽  
Mesoporous Silica ◽  
Silica Nanoparticles ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Mesoporous Silica Nanoparticles ◽  
Silica Nanoparticle ◽  
Mesoporous Silica Nanoparticle

A hollow doughnut shaped mesoporous silica nanoparticle filler that significantly enhances the dimensional thermal stability without sacrificing the optical properties of poly(ether sulfone) films is reported.

Temperature-driven directional coalescence of silver nanoparticles

2016 ◽  
Vol 23 (3) ◽  
pp. 718-728 ◽  
Author(s):  
Shi Yan ◽  
Dongbai Sun ◽  
Yu Gong ◽  
Yuanyuan Tan ◽  
Xueqing Xing ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Thermal Stability ◽  
Silver Nanoparticles ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Temperature Dependent ◽  
X Ray ◽  
Nanoparticle Growth

Silver nanoparticles were synthesized with a chemical reduction method in the presence of polyvinylpyrrolidone as stabilizing agent. The thermal stability behavior of the silver nanoparticles was studied in the temperature range from 25 to 700°C. Thermal gravimetric analysis was used to measure the weight loss of the silver nanoparticles. Scanning electron microscopy and high-resolution transmission electron microscopy were used to observe the morphology and the change in shape of the silver nanoparticles.In situtemperature-dependent small-angle X-ray scattering was used to detect the increase in particle size with temperature.In situtemperature-dependent X-ray diffraction was used to characterize the increase in nanocrystal size and the thermal expansion coefficient. The results demonstrate that sequential slow and fast Ostward ripening are the main methods of nanoparticle growth at lower temperatures (<500°C), whereas successive random and directional coalescences are the main methods of nanoparticle growth at higher temperatures (>500°C). A four-stage model can be used to describe the whole sintering process. The thermal expansion coefficient (2.8 × 10−5 K−1) of silver nanoparticles is about 30% larger than that of bulk silver. To our knowledge, the temperature-driven directional coalescence of silver nanocrystals is reported for the first time. Two possible mechanisms of directional coalescence have been proposed. This study is of importance not only in terms of its fundamental academic interest but also in terms of the thermal stability of silver nanoparticles.

A Simulation Analysis Research on the Material Performance of Resin Concrete

2013 ◽  
Vol 721 ◽  
pp. 135-138
Author(s):  
Bo Wang ◽  
Bin Lin ◽  
Kun Zhao
Keyword(s):  
Thermal Stability ◽  
Thermal Expansion ◽  
Numerical Analysis ◽  
Thermal Expansion Coefficient ◽  
Cross Section ◽  
Expansion Coefficient ◽  
Simulation Analysis ◽  
Analysis Method ◽  
Accumulation Model ◽  
Thermal Stability Of

A numerical analysis method of the thermal stability of the resin concrete is proposed in this paper. A 3D aggregate accumulation model based on the predecessors theory is established and a 2D cross section is directly captured from it. In order to simplify the analysis, a kind of conversion program is developed. The thermal expansion coefficient of established model is close to previous research results. It confirms the analysis method is correct. By the results, a reliable formula is found to calculate the thermal expansion coefficient and a method to reduce the thermal expansion coefficient of resin concrete is proposed.

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

scholarly journals Strengthening Thermal Stability in V2O5-ZnO-BaO-B2O3-M(PO3)n Glass System (M = Al, Mg) for Laser Sealing Applications

2021 ◽  
Vol 11 (10) ◽  
pp. 4603
Author(s):  
Soyoung Kim ◽  
Karam Han ◽  
Seonhoon Kim ◽  
Linganna Kadathala ◽  
Jinhyeok Kim ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Thermal Expansion ◽  
Bond Strength ◽  
Coefficient Of Thermal Expansion ◽  
Glass Frit ◽  
Glass System ◽  
Fiber Types ◽  
Hermetic Sealing ◽  
Doped Glasses ◽  
Glass Panels

Today, the most common way of laser sealing is using a glass frit paste and screen printer. Laser sealing using glass frit paste has some problems, such as pores, nonuniform height, imperfect hermetic sealing, etc. In order to overcome these problems, sealing using fiber types of sealant is attractive for packaging devices. In this work, (70-x)V2O5-5ZnO-22BaO-3B2O3-xM(PO3)n glasses (mol%) incorporated with xM(PO3)n concentration (where M = Mg, Al, n = 2, 3, respectively) were fabricated and their thermal, thermomechanical, and structural properties were investigated. Most importantly, for this type of sealing, the glass should have a thermal stability (ΔT) of ≥80 °C and the coefficient of thermal expansion (CTE) between the glass and panel should be 1.0 ppm/°C. The highest thermal stability ΔT of the order of 93.2 °C and 112.9 °C was obtained for the 15 mol% of Mg(PO3)2 and Al(PO3)3 doped glasses, respectively. This reveals that the bond strength and connectivity is more strongly improved by trivalent Al(PO3)3. The CTE of a (70-x)V2O5-5ZnO-22BaO-3B2O3-xAl(PO3)3 glass system (mol%) (where x = 5–15, mol%) is in the range of 9.5–15.5 (×10−6/K), which is comparable with the CTE (9–10 (×10−6/K)) of commercial DSSC glass panels. Based on the results, the studied glass systems are considered to be suitable for laser sealing using fiber types of sealant.

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