Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method

2008 ◽  
Vol 580-582 ◽  
pp. 173-176
Author(s):  
Hee Seon Bang ◽  
Hong Jun Ji ◽  
Ming Yu Li ◽  
Chun Qing Wang ◽  
Han Sur Bang
Keyword(s):  
Copper Substrate ◽  
Bonding Mechanism ◽  
Aluminum Wire ◽  
X Ray ◽  
Interfacial Composition ◽  
Bond Center ◽  
Bond Interface ◽  
Fracture Study ◽  
Wedge Bonding ◽  
Peeling Off

In this paper, the characteristics of bond interface and bonding mechanism were investigated with peeling-off method. The fracture was observed and interfacial composition was certified by map scanning of EDX (Energy dispersive X-ray analysis). Based on the features of interfacial characters, the actual joining area mainly distributed at bond periphery; non-bonded at bond center. When the bonding time was lower, the ratio of the bond length to its width was larger and elemental aluminum distributed discontinuously on the bond fracture, primarily at the periphery. After aging, the fractures were also analyzed and Cu2Al3 intermetallic compound (IMC) was identified. The phenomena of bond interfacial tracings were analyzed, and the bonding mechanism was ascribed to plastic flow analyzed by finite element method based on the contact issues.

Morphology and Intermetallic Study of (Sn-8Zn-3Bi)-1Ni Solder under Liquid State Aging

2015 ◽  
Vol 1087 ◽  
pp. 162-166
Author(s):  
Nor Aishah Jasli ◽  
Hamidi Abd Hamid ◽  
Ramani Mayappan
Keyword(s):  
Liquid State ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Time ◽  
Intermetallic Formation ◽  
X Ray ◽  
Ni Addition ◽  
Free Solder ◽  
Scanning Electron

This study investigated the effect of Ni addition on intermetallic formation in the Sn-8Zn-3Bi solder under liquid state aging. The intermetallic compounds were formed by reacting the solder alloy with copper substrate. Different reflow time was used at temperature 220°C. Morphology of the phases formed was observed using scanning electron microscope (SEM) and in order to determine elemental compositions of the phases, energy dispersive x-ray (EDX) was used. The formation of the reaction layer led by Cu5Zn8 intermetallic and then followed by Cu6Sn5 and Cu3Sn when reflow time increases. Keywords: lead free solder, intermetallic, Cu5Zn8, Cu6Sn5, liquid state aging.

Numerical Investigation on the X-Ray Production of Aluminum-Wire-Array $Z$-Pinch Implosion

2011 ◽  
Vol 39 (2) ◽  
pp. 686-694 ◽  
Author(s):  
Xiao Delong ◽  
Ding Ning ◽  
Ning Cheng ◽  
Sun Shunkai ◽  
Zhang Yang ◽  
...  
Keyword(s):  
Numerical Investigation ◽  
Wire Array ◽  
Aluminum Wire ◽  
X Ray ◽  
Z Pinch

Role of the implosion kinetic energy in determining the kilovolt x-ray emission from aluminum-wire-array implosions

1991 ◽  
Vol 44 (10) ◽  
pp. 6762-6775 ◽  
Author(s):  
C. Deeney ◽  
T. Nash ◽  
R. R. Prasad ◽  
L. Warren ◽  
K. G. Whitney ◽  
...  
Keyword(s):  
Kinetic Energy ◽  
Wire Array ◽  
Aluminum Wire ◽  
X Ray

ELECTROCATALYTIC ACTIVITY OF Ni–Mn–Sn ALLOY FOAMS FOR OXYGEN EVOLUTION REACTION (OER)

2019 ◽  
Vol 27 (03) ◽  
pp. 1950122
Author(s):  
NILOOFAR TAHERIAN ◽  
SOHRAB SANJABI
Keyword(s):  
Oxygen Evolution ◽  
Oxygen Evolution Reaction ◽  
Electrocatalytic Activity ◽  
Copper Substrate ◽  
Grazing Incidence ◽  
Alkaline Media ◽  
Chemical Compositions ◽  
X Ray ◽  
Sulfate Bath ◽  
Surface Morphologies

This study carried out to examine electrocatalytic activity of Ni–Mn–Sn alloy foams for oxygen evolution reaction (OER) in alkaline media. As the first step, Ni–Mn–Sn alloy foams were prepared of sulfate bath on copper substrate. Next, after optimization of electrodeposition condition by cyclic voltammetry (CV) test, foams were electrodeposited at different current densities 100, 120, 140 and 180[Formula: see text]mA[Formula: see text]⋅[Formula: see text]cm[Formula: see text]. Then, they were characterized by field emission scanning electron microscopy (FE-SEM) along with energy disperse x-ray spectroscopy (EDS) to investigate surface morphologies and chemical compositions. According to FE-SEM results, it was revealed that formation of foam like structures were due to the presence of dynamic hydrogen bubbles template (DHBT). To survey their structure, grazing incidence X-ray diffractometer (GIXRD) analysis was performed. The resulted diffraction pattern determined not only FCC nickel structure of foams, but also mixed phases composed. Following this, Ni–Mn–Sn alloy foams were placed in 0.1 M KOH and related CV tests were applied to measure their electrocatalytic activity for OER. This study demonstrated good electrocatalytic activity for Ni–Mn–Sn alloy foams by showing favorable oxygen evolution overpotenitals and Tafel slopes.

Interfacial Composition and Structure in Pt/Ni and Pt/Nb Multilayer Films

1990 ◽  
Vol 187 ◽  
Author(s):  
J.A. Bain ◽  
B.M. Clemens ◽  
S. Brennan
Keyword(s):  
Lattice Spacing ◽  
Grazing Incidence ◽  
Multilayer Films ◽  
Interfacial Structure ◽  
X Ray Diffraction ◽  
X Ray ◽  
Composition And Structure ◽  
Interfacial Composition ◽  
Alloying Effects ◽  
Coherent Interfaces

AbstractThe interfacial structure of Pt/Nb and Pt/Ni sputtered multilayer films was studied using x-ray diffraction in symmetric, asymmetric, and grazing incidence modes. The grazing incidence and asymmetric diffraction were used to distinguish alloying effects on the lattice spacing from strain in the films. This strain was shown to be consistent with semi-coherent interfaces in the Pt/Ni but not in the Pt/Nb in which another strain generating mechanism dominates.

Microstructure and Properties of Laser Cladding Cu-TiB2 Composite Coating on Copper

2012 ◽  
Vol 512-515 ◽  
pp. 639-642 ◽  
Author(s):  
Xiao Qin Guo ◽  
Jing Bo Chen ◽  
Xin Fang Zhang ◽  
Yong Kai Wang ◽  
Rui Zhang
Keyword(s):  
Laser Cladding ◽  
Coating Layer ◽  
Composite Coatings ◽  
Copper Substrate ◽  
Bonding Interface ◽  
X Ray ◽  
Cladding Layer ◽  
Metallurgical Bonding ◽  
Tib2 Particles

Cu-TiB2 composite coatings were in-situ synthesized on the copper substrate by using a Nd: YAG laser. The microstructure of the coating and the bonding interface between the laser cladding layer and the substrate were studied by X-ray and SEM. The microhardness and the wear resisting property were tested. The results show that the TiB2 particles were well-proportioned and spherical existing in the coating layer, the bonding interface between the layer and substrate was metallurgical bonding. The microhardness reaches HV450 and the wear resistance is about 10 times as much as that of Cu substate.

scholarly journals Robust Nanogenerator Based on Vertically Aligned ZnO Nanorods Using Copper Substrate

2013 ◽  
Vol 2013 ◽  
pp. 1-8 ◽  
Author(s):  
Naveed Sheikh ◽  
Nitin Afzulpurkar ◽  
Muhammad Waseem Ashraf
Keyword(s):  
Contact Area ◽  
Incident Light ◽  
Zno Nanorods ◽  
Copper Substrate ◽  
Electrical Energy ◽  
Energy Harvest ◽  
Maximum Output ◽  
Large Area ◽  
Cu Substrate ◽  
X Ray

We report the growth of well-aligned ZnO nanorods that were successfully synthesized on copper (Cu) substrate by using a simple hydrothermal method at low temperature leading to a robust large area nanogenerator (NG) based on cost effective Cu electrode which could enable energy harvest from the walking motions. First, the seed layer of gold (Au) has been deposited by plasma sputtering. Then, the growth process of nanorods was carried out in a sealed chemical bath. The lengths of nanorods 5-6 μm were achieved. The longer and bigger nanorods produced a surface with larger contact area and higher roughness. The larger contact area improves the absorption rate of incident light and the rougher surface strengthens the scattering effect. The surfaces were characterized by X-ray diffraction (XRD), scanning electron microscope (SEM), and energy dispersive X-ray spectroscopy (EDX). Then, Cu substrate was used for the development of high-output NG. Twenty-seven NGs were developed with maximum output voltage that exceeded to 1.8 V and maximum output current that exceeded to 148 nA. The structural simulation of nanorod has also been performed in ANSYS. The Cu substrate-based NG provides a feasible technique for effectively converting mechanical energies to electrical energy from external force.

MgB2 Superconducting Films Fabricated on Copper Substrate by Hybrid Physical-Chemical Vapor Deposition

2007 ◽  
Vol 546-549 ◽  
pp. 1919-1922
Author(s):  
Fen Li ◽  
Tao Guo ◽  
Kai Cheng Zhang ◽  
Chin Ping Chen ◽  
Qing Rong Feng
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Copper Substrate ◽  
Upper Critical Field ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Sharp Transition ◽  
Cu Substrate ◽  
X Ray ◽  
Physical Chemical

The thick MgB2 films have been successfully grown on the Cu substrate by the technique of hybrid physical-chemical vapor deposition (HPCVD). The films are about 2 ~ 3 μm and quite dense. They possess the Tc (onset), as high as 37-38 K, and sharp transition ~ 0.8 K. X-ray diffraction (XRD) indicates their polycrystalline character. The upper critical field at T=0K, HC2(0), is extrapolated as 15.3T. The controlled growth of MgB2 film on Cu substrate opens a new route in the preparation of MgB2 tape materials.

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