Comparison of Wettability for Sn-Based Solders on Copper and Aluminum Substrates

2011 ◽  
Vol 687 ◽  
pp. 15-20
Author(s):  
Li Meng Yin ◽  
Jian Wei Xian ◽  
Zong Xiang Yao
Keyword(s):  
Surface Tension ◽  
Solder Alloy ◽  
Active Element ◽  
Cu Substrate ◽  
Soldering Temperature ◽  
Wetting Properties ◽  
Wetting Time ◽  
Aluminum Substrates ◽  
Wetting Force ◽  
Better Than

The wetting properties of four typical Sn-based solders, i.e., Sn-37Pb, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-9Zn, on copper (Cu) and aluminum (Al) substrates at 250 °C, 260 °C and 270 °C were evaluated and compared by wetting balance method. The experimental results show that the wetting time of all solders on Cu substrate is shorter than that on Al substrate, but the wetting force of the solders with Cu substrate is bigger than that with Al substrate except Sn-9Zn solder. In addition, the wettability of the solders on Al substrate increases with increasing soldering temperature, and the wetting force of Sn-9Zn increases most obviously among four solders and reach 3.68 mN at 270 °C. The results also show that the wettability of the solders on Cu substrate mainly depends on surface tension of solder alloy, however, it depends on both surface tension and interaction with Al on Al substrate. Due to the active element Zn riches on the surface of Sn-9Zn solder, and Zn solid solutes into Al more easily, the wettability of Sn-9Zn solder on Al substrate is better than other three solders.

Wetting Properties of Sn–Pb, Sn–Zn and Sn–Zn–Bi Lead–Free Solders

2012 ◽  
Author(s):  
Ramani May Appan ◽  
Ahmad Badri Ismail ◽  
Zainal Arifin Ahmad ◽  
Tadashi Ariga ◽  
Luay Bakir Hussain
Keyword(s):  
Surface Tension ◽  
Surface Roughness ◽  
Contact Angle ◽  
Wetting Properties ◽  
Different Temperatures ◽  
Wetting Time ◽  
Free Solder ◽  
Increasing Temperature ◽  
Lead Free Solders ◽  
Wetting Force

Tiga kajian terhadap Sn–40Pb, Sn–9Zn dan Sn–8Zn–3Bi pateri tanpa plumbum telah dijalankan. Penyebaran pateri–pateri ini dikaji terhadap substrat Cu yang mempunyai kekasaran 0.13 μm pada suhu 250°C. Sn–40Pb mempunyai sudut sentuhan bernilai °6, iaitu tujuh kali lebih baik berbanding pateri–pateri Sn–Zn dan Sn–8Zn–3Bi. Tetimbang basahan digunakan untuk mengkaji tempoh dan daya basahan serta ketegangan permukaan pada suhu yang berlainan menggunakan dua fluks yang berbeza. Untuk pateri Sn–8Zn–3Bi, fluks MHS (nama komersial) memberi daya dan tempoh basahan yang lebih tinggi berbanding dengan fluks HCl untuk suhu yang meningkat. Ketegangan permukaan untuk pateri Sn–40Pb berkurangan apabila suhu meningkat tetapi suhu tidak mempengaruhi ketegangan permukaan untuk pateri Sn–9Pb dan Sn–8Zn–3Bi. Walau bagaimanapun, tambahan 3% Bi mengurangkan ketegangan permukaan sistem Sn–Zn–Bi. Satu kajian dilakukan mengenai penyebaran pateri aloi Sn-9Pb ke atas permukaan Cu bagi kekasaran permukaan antara 0.33 dengan 1.53 μm. Didapati bahawa kekasaran permukaan di bawah 0.62 μm tidak membantu dalam peningkatan basahan, tetapi kekerasan melebihi 0.62 μm meningkatkan sudut basahan dan luas penyebaran. Kata kunci: Pateri tanpa plumbum, penyebaran, kekasaran, sifat–sifat basahan, ketegangan permukaan Three studies on Sn–40Pb, Sn–9Zn and Sn–8Zn–3Bi Pb–free solders were conductwd. Spreading of the solders was investigated on 0.13 μm roughness Cu subrate at 250°C. Sn–40Pb has a contact angle of 6°, which is seven times better than Sn–9Zn and Sn–8Zn–3Bi solders. Wetting balance was uesd to study the wetting time, wetting force and surface tension at different temperatures using two different fluxes. For Sn–8Zn–3Bi solder, MHS (commercial name) flux gives higher wetting force and wetting time compared to HCl flux for increasing temperatures. The surface tension of Sn–40Pb solder decreased with increasing temperature whereas the surface tension of Sn–9Zn and Sn–8Zn–3Bi solders is not influenced by the temperature. However, the addition of 3% Bi reduces the surface tension of the Sn–Zn–Bi system. A study on the spreading of Sn–9Zn solder alloy on Cu with surface roughness between 0.33 and 1.53 μm was also conducted. Surface roughness below 0.62 μm, there was an improvemenet in the contact angle and spreading area. Key words: Pb–free solder, spreading, rougness, wetting properties, surface tension

Determination of reactive wetting properties of Sn, Sn–Cu, Sn–Ag, and Sn–Pb alloys using a wetting balance technique

2003 ◽  
Vol 18 (6) ◽  
pp. 1420-1428 ◽  
Author(s):  
Hsiu-yu Chang ◽  
Sinn-wen Chen ◽  
David Shan-hill Wong ◽  
Hsiu-Feng Hsu
Keyword(s):  
Interfacial Reactions ◽  
Force Measurements ◽  
Surface Tensions ◽  
Wetting Properties ◽  
Balance Technique ◽  
Wetting Time ◽  
Lead Free Solders ◽  
Pure Sn ◽  
Wetting Force

Wetting properties of lead-free solders, Sn–0.7 wt.% Cu and Sn–3.5 wt.% Ag, pure Sn, and conventional Sn–40 w.t% Pb on Ni, Cu, and Ag substrates at 250 and 240 °C were determined by using a wetting balance technique. Wetting times and wetting forces were determined directly from the wetting curves, and surface tensions of molten solders were calculated from the wetting force measurements. A statistic tool, analysis of variance (ANOVA), was used to analyze the experimental results. By using the wetting time as an indication, it was found that Sn–Pb exhibited the best wetting followed by Sn–Ag, Sn–Cu, and Sn, in that order. A very significant but frequently ignored issue is that most solders react with substrates, and the molten solders are not in contact with the original substrates but rather with intermetallic compounds. On the basis of theoretical analysis and experimental observations, it was concluded that the withdrawing forces and the surface tensions of the molten solders determined by the present technique are not significantly affected by the interfacial reactions if the interfacial reactions are not too excessive. However, wetting times are strong functions of both solders and substrates and the interfacial reactions between them.

scholarly journals Modifications of the SURDAT database of the physicochemical properties of metals and alloys

2012 ◽  
Vol 48 (3) ◽  
pp. 427-431 ◽  
Author(s):  
W. Gasior ◽  
A. Debski
Keyword(s):  
Surface Tension ◽  
Contact Angle ◽  
Electrical Properties ◽  
Experimental Studies ◽  
Viscosity Data ◽  
Pressure Method ◽  
Mechanical And Electrical Properties ◽  
Study Results ◽  
Wetting Time ◽  
Wetting Force

Experimental studies of the surface tension and the density were carried out by means of the maximum bubble pressure method and the dilatometric technique and next, they were compiled with the results of over 12 years of research of the liquid pure components, binary and multicomponent alloys, with the aim to create the SURDAT database of the Pb-free soldering materials. In the last years, a modification of SURDAT has been conducted. The new version, beside the earlier data of the physical properties, also contains such data as: the viscosity data, selected data of the mechanical and electrical properties, the DTA data and the meniscographic study results (contact angle, wetting time, wetting force and interfacial tension). Additionally, the data base of the heat properties, worked out at NIST (National Institute of Standard and Technology from Boulder in Colorado) has been implemented.

Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

2019 ◽  
Vol 32 (1) ◽  
pp. 19-23 ◽  
Author(s):  
Ahmet Mustafa Erer ◽  
Serkan Oguz
Keyword(s):  
Solder Alloy ◽  
Sessile Drop ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Cu Substrate ◽  
Wetting Properties ◽  
Free Solder ◽  
Drop Technique

Purpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.

Automation of selected brazes' dynamic properties in high-temperatures' measurement process

2013 ◽  
Vol 18 (2-3) ◽  
pp. 33-41
Author(s):  
Dominik Sankowski ◽  
Marcin Bakala ◽  
Rafał Wojciechowski
Keyword(s):  
Surface Tension ◽  
High Temperatures ◽  
Dynamic Properties ◽  
Automatic Measurement ◽  
Measurement Methodology ◽  
Joining Process ◽  
Wetting Force ◽  
Research Grant

Abstract The good quality of several manufactured components frequently depends on solidliquid interactions existing during processing. Nowadays, the research in material engineering focuses also on modern, automatic measurement methods of joining process properties, i.a. wetting force and surface tension, which allows for quantitative determination of above mentioned parameters. In the paper, the brazes’ dynamic properties in high-temperatures’ measurement methodology and the stand for automatic determination of braze’s properties, constructed and implmented within the research grant nr KBN N N519 441 839 - An integrated platform for automatic measurement of wettability and surface tension of solders at high temperatures, are widely described

scholarly journals Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods

2015 ◽  
Vol 20 ◽  
pp. 9-14 ◽  
Author(s):  
Mohd Faizul Mohd Sabri ◽  
Suhana Binti Mohd Said ◽  
Dhafer Abdulameer Shnawah
Keyword(s):  
Solder Alloy ◽  
Cu Substrate ◽  
Spread Area

scholarly journals Surface, Volumetric, and Wetting Properties of Oleic, Linoleic, and Linolenic Acids with Regards to Application of Canola Oil in Diesel Engines

2019 ◽  
Vol 9 (17) ◽  
pp. 3445 ◽  
Author(s):  
Anna Zdziennicka ◽  
Katarzyna Szymczyk ◽  
Bronisław Jańczuk ◽  
Rafał Longwic ◽  
Przemysław Sander
Keyword(s):  
Surface Tension ◽  
Contact Angle ◽  
Diesel Engines ◽  
Canola Oil ◽  
Contact Angles ◽  
Physiochemical Properties ◽  
Engine Valve ◽  
Wetting Properties ◽  
Main Components ◽  
Adhesion Work

Oleic, linoleic, and linolenic acids are the main components of canola oil and their physiochemical properties decide on the use of canola oil as fuel for diesel engines. Therefore, the measurements of the surface tension of oleic, linoleic, and linolenic acids being the components of the canola oil, as well as their contact angles on the polytetrafluoroethylene (PTFE), poly(methyl methacrylate) (PMMA), and engine valve, were made. Additionally, the surface tension and contact angle on PTFE, PMMA, and the engine valve of the oleic acid and n-hexane mixtures were measured. On the basis of the obtained results, the components and parameters of oleic, linoleic, and linolenic acids’ surface tension were determined and compared to those of the canola oil. Next, applying the components and parameters of these acids, their adhesion work to PTFE, PMMA, and the engine valve was calculated by means of various methods.

scholarly journals Rheological and Wetting Properties of Environmentally Acceptable Lubricants (EALs) for Application in Stern Tube Seals

Lubricants ◽  
2018 ◽  
Vol 6 (4) ◽  
pp. 100 ◽  
Author(s):  
F. Borras ◽  
Matthijn de Rooij ◽  
Dik Schipper
Keyword(s):  
Surface Tension ◽  
Shear Thinning ◽  
Mineral Oil ◽  
Experimental Techniques ◽  
High Shear ◽  
Shear Rates ◽  
Wetting Properties ◽  
High Shear Rates ◽  
Significant Difference ◽  
Newtonian Behavior

The use of Environmentally Acceptable Lubricants (EALs) for stern tube lubrication is increasing. Although the machine components of a sailing vessel are designed to operate together with mineral oil-based lubricants, these are being replaced by the less environmentally harmful EALs. Little is known about the rheological performance of EALs in particular at the high shear rates that occur in stern tube seals. In this study, the viscosity and wetting properties of a set of different EALs is analysed and compared to traditional mineral oil-based lubricants using a set of experimental techniques. Some of the EALs present Newtonian behavior whereas other show shear thinning. No significant difference in surface tension was observed between the different lubricants.

Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate

2020 ◽  
Vol 31 (09) ◽  
pp. 2050119
Author(s):  
Ahmet Mustafa Erer ◽  
Mukaddes Ökten Turacı
Keyword(s):  
Numerical Model ◽  
Numerical Computation ◽  
Solder Alloy ◽  
Empirical Model ◽  
Sessile Drop ◽  
Sessile Drop Method ◽  
Experimental Results ◽  
Cu Substrate ◽  
Free Solder ◽  
Alloy Systems

This paper was aimed to study of the wetting angle ([Formula: see text]) of Sn–Ag–Cu, Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])Bi and Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])In ([Formula: see text], 1 and 2 in wt.%) Pb-free solder alloy systems at various temperatures (250, 280 and 310∘C) on Cu substrate in Ar atmosphere. The new Sn–([Formula: see text])Ag–0.5Cu–xBi and Sn–([Formula: see text])Ag–0.5Cu[Formula: see text]([Formula: see text]) In systems, low Ag content quaternary Pb-free solder alloys, were produced by adding 0.5%, 1% and 2% Bi and In separately to the near-eutectic Sn-3[Formula: see text]wt.%Ag–0.5[Formula: see text]wt.%Cu (SAC305) alloy. The wetting angles of new alloys, Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%Bi (SAC-0.5Bi), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%Bi(SAC-1Bi), Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]2[Formula: see text]wt.%Bi(SAC-2Bi), Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%In (SAC-0.5In), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%In (SAC-1In) and Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt%.Cu[Formula: see text]2[Formula: see text]wt.%In (SAC-2In) were measured by sessile drop method. Experimental results showed that additions of Bi and In separately to SAC305 resulted in a continuous decrease in the [Formula: see text] up to 1[Formula: see text]wt.% above which the [Formula: see text] value was increased and it is appeared that a correlation among the [Formula: see text], alloys compositions and the test temperatures exists which recommended an empirical model to estimate the [Formula: see text] at a given Bi and In content and temperature for a given alloy systems. The numerical model estimates the [Formula: see text] understandably well with the present work.

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