Wetting Properties of Sn–Pb, Sn–Zn and Sn–Zn–Bi Lead–Free Solders

2012 ◽  
Author(s):  
Ramani May Appan ◽  
Ahmad Badri Ismail ◽  
Zainal Arifin Ahmad ◽  
Tadashi Ariga ◽  
Luay Bakir Hussain
Keyword(s):  
Surface Tension ◽  
Surface Roughness ◽  
Contact Angle ◽  
Wetting Properties ◽  
Different Temperatures ◽  
Wetting Time ◽  
Free Solder ◽  
Increasing Temperature ◽  
Lead Free Solders ◽  
Wetting Force

Tiga kajian terhadap Sn–40Pb, Sn–9Zn dan Sn–8Zn–3Bi pateri tanpa plumbum telah dijalankan. Penyebaran pateri–pateri ini dikaji terhadap substrat Cu yang mempunyai kekasaran 0.13 μm pada suhu 250°C. Sn–40Pb mempunyai sudut sentuhan bernilai °6, iaitu tujuh kali lebih baik berbanding pateri–pateri Sn–Zn dan Sn–8Zn–3Bi. Tetimbang basahan digunakan untuk mengkaji tempoh dan daya basahan serta ketegangan permukaan pada suhu yang berlainan menggunakan dua fluks yang berbeza. Untuk pateri Sn–8Zn–3Bi, fluks MHS (nama komersial) memberi daya dan tempoh basahan yang lebih tinggi berbanding dengan fluks HCl untuk suhu yang meningkat. Ketegangan permukaan untuk pateri Sn–40Pb berkurangan apabila suhu meningkat tetapi suhu tidak mempengaruhi ketegangan permukaan untuk pateri Sn–9Pb dan Sn–8Zn–3Bi. Walau bagaimanapun, tambahan 3% Bi mengurangkan ketegangan permukaan sistem Sn–Zn–Bi. Satu kajian dilakukan mengenai penyebaran pateri aloi Sn-9Pb ke atas permukaan Cu bagi kekasaran permukaan antara 0.33 dengan 1.53 μm. Didapati bahawa kekasaran permukaan di bawah 0.62 μm tidak membantu dalam peningkatan basahan, tetapi kekerasan melebihi 0.62 μm meningkatkan sudut basahan dan luas penyebaran. Kata kunci: Pateri tanpa plumbum, penyebaran, kekasaran, sifat–sifat basahan, ketegangan permukaan Three studies on Sn–40Pb, Sn–9Zn and Sn–8Zn–3Bi Pb–free solders were conductwd. Spreading of the solders was investigated on 0.13 μm roughness Cu subrate at 250°C. Sn–40Pb has a contact angle of 6°, which is seven times better than Sn–9Zn and Sn–8Zn–3Bi solders. Wetting balance was uesd to study the wetting time, wetting force and surface tension at different temperatures using two different fluxes. For Sn–8Zn–3Bi solder, MHS (commercial name) flux gives higher wetting force and wetting time compared to HCl flux for increasing temperatures. The surface tension of Sn–40Pb solder decreased with increasing temperature whereas the surface tension of Sn–9Zn and Sn–8Zn–3Bi solders is not influenced by the temperature. However, the addition of 3% Bi reduces the surface tension of the Sn–Zn–Bi system. A study on the spreading of Sn–9Zn solder alloy on Cu with surface roughness between 0.33 and 1.53 μm was also conducted. Surface roughness below 0.62 μm, there was an improvemenet in the contact angle and spreading area. Key words: Pb–free solder, spreading, rougness, wetting properties, surface tension

Determination of reactive wetting properties of Sn, Sn–Cu, Sn–Ag, and Sn–Pb alloys using a wetting balance technique

2003 ◽  
Vol 18 (6) ◽  
pp. 1420-1428 ◽  
Author(s):  
Hsiu-yu Chang ◽  
Sinn-wen Chen ◽  
David Shan-hill Wong ◽  
Hsiu-Feng Hsu
Keyword(s):  
Interfacial Reactions ◽  
Force Measurements ◽  
Surface Tensions ◽  
Wetting Properties ◽  
Balance Technique ◽  
Wetting Time ◽  
Lead Free Solders ◽  
Pure Sn ◽  
Wetting Force

Wetting properties of lead-free solders, Sn–0.7 wt.% Cu and Sn–3.5 wt.% Ag, pure Sn, and conventional Sn–40 w.t% Pb on Ni, Cu, and Ag substrates at 250 and 240 °C were determined by using a wetting balance technique. Wetting times and wetting forces were determined directly from the wetting curves, and surface tensions of molten solders were calculated from the wetting force measurements. A statistic tool, analysis of variance (ANOVA), was used to analyze the experimental results. By using the wetting time as an indication, it was found that Sn–Pb exhibited the best wetting followed by Sn–Ag, Sn–Cu, and Sn, in that order. A very significant but frequently ignored issue is that most solders react with substrates, and the molten solders are not in contact with the original substrates but rather with intermetallic compounds. On the basis of theoretical analysis and experimental observations, it was concluded that the withdrawing forces and the surface tensions of the molten solders determined by the present technique are not significantly affected by the interfacial reactions if the interfacial reactions are not too excessive. However, wetting times are strong functions of both solders and substrates and the interfacial reactions between them.

scholarly journals Modifications of the SURDAT database of the physicochemical properties of metals and alloys

2012 ◽  
Vol 48 (3) ◽  
pp. 427-431 ◽  
Author(s):  
W. Gasior ◽  
A. Debski
Keyword(s):  
Surface Tension ◽  
Contact Angle ◽  
Electrical Properties ◽  
Experimental Studies ◽  
Viscosity Data ◽  
Pressure Method ◽  
Mechanical And Electrical Properties ◽  
Study Results ◽  
Wetting Time ◽  
Wetting Force

Experimental studies of the surface tension and the density were carried out by means of the maximum bubble pressure method and the dilatometric technique and next, they were compiled with the results of over 12 years of research of the liquid pure components, binary and multicomponent alloys, with the aim to create the SURDAT database of the Pb-free soldering materials. In the last years, a modification of SURDAT has been conducted. The new version, beside the earlier data of the physical properties, also contains such data as: the viscosity data, selected data of the mechanical and electrical properties, the DTA data and the meniscographic study results (contact angle, wetting time, wetting force and interfacial tension). Additionally, the data base of the heat properties, worked out at NIST (National Institute of Standard and Technology from Boulder in Colorado) has been implemented.

Comparison of Wettability for Sn-Based Solders on Copper and Aluminum Substrates

2011 ◽  
Vol 687 ◽  
pp. 15-20
Author(s):  
Li Meng Yin ◽  
Jian Wei Xian ◽  
Zong Xiang Yao
Keyword(s):  
Surface Tension ◽  
Solder Alloy ◽  
Active Element ◽  
Cu Substrate ◽  
Soldering Temperature ◽  
Wetting Properties ◽  
Wetting Time ◽  
Aluminum Substrates ◽  
Wetting Force ◽  
Better Than

The wetting properties of four typical Sn-based solders, i.e., Sn-37Pb, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-9Zn, on copper (Cu) and aluminum (Al) substrates at 250 °C, 260 °C and 270 °C were evaluated and compared by wetting balance method. The experimental results show that the wetting time of all solders on Cu substrate is shorter than that on Al substrate, but the wetting force of the solders with Cu substrate is bigger than that with Al substrate except Sn-9Zn solder. In addition, the wettability of the solders on Al substrate increases with increasing soldering temperature, and the wetting force of Sn-9Zn increases most obviously among four solders and reach 3.68 mN at 270 °C. The results also show that the wettability of the solders on Cu substrate mainly depends on surface tension of solder alloy, however, it depends on both surface tension and interaction with Al on Al substrate. Due to the active element Zn riches on the surface of Sn-9Zn solder, and Zn solid solutes into Al more easily, the wettability of Sn-9Zn solder on Al substrate is better than other three solders.

scholarly journals Surface, Volumetric, and Wetting Properties of Oleic, Linoleic, and Linolenic Acids with Regards to Application of Canola Oil in Diesel Engines

2019 ◽  
Vol 9 (17) ◽  
pp. 3445 ◽  
Author(s):  
Anna Zdziennicka ◽  
Katarzyna Szymczyk ◽  
Bronisław Jańczuk ◽  
Rafał Longwic ◽  
Przemysław Sander
Keyword(s):  
Surface Tension ◽  
Contact Angle ◽  
Diesel Engines ◽  
Canola Oil ◽  
Contact Angles ◽  
Physiochemical Properties ◽  
Engine Valve ◽  
Wetting Properties ◽  
Main Components ◽  
Adhesion Work

Oleic, linoleic, and linolenic acids are the main components of canola oil and their physiochemical properties decide on the use of canola oil as fuel for diesel engines. Therefore, the measurements of the surface tension of oleic, linoleic, and linolenic acids being the components of the canola oil, as well as their contact angles on the polytetrafluoroethylene (PTFE), poly(methyl methacrylate) (PMMA), and engine valve, were made. Additionally, the surface tension and contact angle on PTFE, PMMA, and the engine valve of the oleic acid and n-hexane mixtures were measured. On the basis of the obtained results, the components and parameters of oleic, linoleic, and linolenic acids’ surface tension were determined and compared to those of the canola oil. Next, applying the components and parameters of these acids, their adhesion work to PTFE, PMMA, and the engine valve was calculated by means of various methods.

Experimental Study of Surface Tension Coefficient for Magnetic Fluid

2011 ◽  
Vol 492 ◽  
pp. 277-282
Author(s):  
Qing Lei Wang ◽  
De Cai Li ◽  
Fan Wang
Keyword(s):  
Surface Tension ◽  
Magnetic Fluid ◽  
Liquid Surface ◽  
Surface Tension Coefficient ◽  
Fluid Surface ◽  
Liquid Surface Tension ◽  
Experimental Apparatus ◽  
Different Temperatures ◽  
Increasing Temperature ◽  
The Relationship

The author measured surface tension coefficient for liquid with a new experimental apparatus, measured magnetic fluid surface tension coefficient at different temperatures and with different volume of surfactant. By the analysis of experimental data, we obtained that magnetic fluid surface tension coefficient decreases with the increasing temperature and increases with the addition of surfactant volume and reaches a certain stability value. We also obtained the expression of magnetic fluid surface tension coefficient and the temperature or surfactant. This paper discussed the relationship between the liquid surface tension coefficient and the temperature and surfactant from the view of thermodynamics.

A review: lead free solder and its wettability properties

2016 ◽  
Vol 28 (3) ◽  
pp. 125-132 ◽  
Author(s):  
Ervina Efzan Mhd Noor ◽  
Nur Faziera Mhd Nasir ◽  
Siti Rabiatul Aisya Idris
Keyword(s):  
Surface Tension ◽  
Contact Angle ◽  
Electronic Packaging ◽  
Design Methodology ◽  
Lead Free ◽  
Lead Free Solder ◽  
Research Papers ◽  
Basic Principles ◽  
Content Type ◽  
Free Solder

Purpose The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability. Design/methodology/approach This paper approach on the review of the solder wettability on the surface. It reviews on the solder especially on the contact angle and surface tension that is covered under the wettability of the solder. Findings This paper also reviews on the lead free solder characteristics that focused on its wettability. Originality/value This paper summarized finding from other researchers. The authors collect and summarize the useful data from other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings.

Pb-free solders: Predicting of some physicochemical properties of Ag–Cu–Sn material at different temperatures

2016 ◽  
Vol 15 (07) ◽  
pp. 1650062 ◽  
Author(s):  
Rachida M’chaar ◽  
Mouloud El Moudane ◽  
Abdelaziz Sabbar ◽  
Ahmed Ghanimi
Keyword(s):  
Surface Tension ◽  
Physicochemical Properties ◽  
Molar Volume ◽  
The Other ◽  
Ternary Alloys ◽  
Other Hand ◽  
Different Temperatures ◽  
Experimental Values ◽  
Increasing Temperature ◽  
Good Agreement

In this paper, the surface tension, molar volume and density of liquid Ag–Cu–Sn alloys have been calculated using Kohler, Muggianu, Toop, and Hillert models. In addition, the surface tension and viscosity of the Ag–Cu–Sn ternary alloys at different temperatures have been predicted on the basis of Guggenheim and Seetharaman–Sichen equations, respectively. The results show that density and viscosity decrease with increasing tin and increasing temperature for the all studied models. While the surface tension shows a different tendency, especially for the Kohler and Muggianu symmetric models. On the other hand, the molar volume increases with increase of temperature and tin compositions. The calculated values of surface tension and density of Ag–Cu–Sn alloys are compared with the available experimental values and a good agreement was observed.

The Wetting of Insect Cuticles by Water

1955 ◽  
Vol 32 (3) ◽  
pp. 591-617 ◽  
Author(s):  
M. W. HOLDGATE
Keyword(s):  
Surface Roughness ◽  
Contact Angle ◽  
Surface Properties ◽  
Surface Composition ◽  
Contact Angles ◽  
Aquatic Species ◽  
Water Contact ◽  
Calliphora Erythrocephala ◽  
Wetting Properties ◽  
Wide Range

1. The water contact angles of insects show a wide range of variation, which is broadly correlated with surface roughness and with habitat. 2. The contact angles of species inhabiting stored products or carrion are greatly modified by contamination. This produces large variations between apparently similar individuals. 3. In terrestrial insects surface roughness increases the contact angles to very large apparent values. Detailed analyses of its effect have been made in the pupa of Tenebrio molitor and the adult Calliphora erythrocephala. In some aquatic insects surface roughness leads to a reduction in the contact angles; this has been studied in the nymph of Anax imperator. 4. Prolonged immersion in water causes a lowering of the contact angles of all the insects examined, and the low angles of many aquatic species may therefore be the direct effect of their environment. In some aquatic species there is evidence of the active maintenance of a large contact angle during life. 5. Changes in contact angle accompany processes of cuticle secretion and will occur at any moult if changes in roughness or habitat take place. 6. The observed variations of surface properties can be explained without assuming any variation in the chemical composition of the cuticle surface. Wetting properties are of little value as indicators of cuticle surface composition. 7. The biological aspects of insect surface properties are briefly discussed.

Effect of Pr on Wettability and Mechanical Property of Sn-0.3Ag-0.7Cu Lead-Free Solder

2015 ◽  
Vol 1120-1121 ◽  
pp. 456-461
Author(s):  
Xiao Le Feng ◽  
Jie Yang
Keyword(s):  
Mechanical Properties ◽  
Mechanical Property ◽  
Shear Stress ◽  
Mass Fraction ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snagcu Solder ◽  
Wetting Time ◽  
Free Solder ◽  
Wetting Force

The wettability of Sn-0.3Ag-0.7Cu-xPr solders on Cu substrate was determined by the wetting balance method， and the mechanical properties of Sn-0.3Ag-0.7Cu-xPr joints were investigated. The result showed that the wetting force of Sn-0.3Ag-0.7Cu-xPr is increased and the wetting time is decreased with the Pr content addition. Good wettability of Sn-Ag-Cu-Pr is obtained with around 0·05%-0·1% (mass fraction) Pr. When measured at 260°C， the wetting force of of SnAgCu solder was increased by 5.0% with 0.1%Pr and the wetting time of SnAgCu solder was descreased by 16.9%.The mechanical properties of soldered joints are enhanced with the addition of Pr， and the soldered joints possess the peak values of shear stress when the Pr addition is about 0.05% in Sn-Ag-Cu-Pr solder joint.

scholarly journals Preparation of Superhydrophobic Teflon® AF 1600 Sub-Micron Fibers and Yarns Using the Forcespinningtm Technique

2013 ◽  
Vol 8 (4) ◽  
pp. 155892501300800 ◽  
Author(s):  
Yatinkumar Rane ◽  
Aleksey Altecor ◽  
Nelson S. Bell ◽  
Karen Lozano
Keyword(s):  
Surface Roughness ◽  
Contact Angle ◽  
Average Diameter ◽  
Contact Angle Measurement ◽  
Contact Angles ◽  
Angle Measurement ◽  
Sem Analysis ◽  
Fiber Formation ◽  
Excellent Thermal Stability ◽  
Wetting Properties

Superhydrophobic materials combined with manufacturing processes that can increase surface roughness of the material, offer an opportunity to effectively control wetting properties. Rapid formation of Teflon® AF (TAF) fibrous mats with sub-micron fiber diameter using the Forcespinning™ technique is presented. The fiber formation technique is based on the use of centrifugal forces. SEM analysis shows uniform formation of TAF 1600 fibers with average diameter of 362±58nm. Contact angle measurement confirms the superhydrophobic nature of the mats with contact angles as high as 169° ± 3° and rolling angles of 2°. TAF 1600 mats were forcespun at a rate of 1gr/min. The relationship between the contact angle and hierarchical surface roughness of the TAF mat is also discussed. TAF yarns were also manufactured and characterized. Yarns with diameters of 156 microns withstood 17.5 MPa of engineering stress with a Young's modulus of 348 MPa in the elastic region and excellent thermal stability.

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