Recrystallization Microstructure and Texture of Highly Strained Commercial Purity Aluminium Alloy

2014 ◽  
Vol 783-786 ◽  
pp. 282-287
Author(s):  
Gui Lin Wu
Keyword(s):  
Electron Backscatter Diffraction ◽  
Cube Texture ◽  
Commercial Purity ◽  
Texture Change ◽  
Purity Aluminium ◽  
Electron Backscatter ◽  
Commercial Purity Aluminium ◽  
Complete Recrystallization ◽  
Highly Strained ◽  
Backscatter Diffraction

The microstructural and textural evolutions during annealing of a highly strained (ε=4.0) commercial purity aluminium (AA1200) were followed by electron backscatter diffraction (EBSD). Boundary spacings were analyzed for crystallites of different crystallographic orientations. It was found that initially during the annealing the microstructural evolution is dominated by recovery of the highly strained microstructure, while later the microstructure consists of identifiable grains nucleating and growing at the expense of deformed and recovered matrix. No much texture change occursduring early stages of annealing, whereas a cube texture evolves and dominates after complete recrystallization.

scholarly journals Orientation Independent and Dependent Subgrain Growth During Iso-Thermal Annealing of High-Purity and Commercial Purity Aluminium

Metals ◽  
2019 ◽  
Vol 9 (10) ◽  
pp. 1032
Author(s):  
Bunkholt ◽  
Nes ◽  
Marthinsen
Keyword(s):  
High Purity ◽  
Electron Backscatter Diffraction ◽  
Subgrain Size ◽  
Alloy System ◽  
Commercial Purity ◽  
Boundary Misorientation ◽  
Subgrain Growth ◽  
Purity Aluminium ◽  
Commercial Purity Aluminium ◽  
High Purity Aluminium

The orientation dependence on recovery has been studied in cold-rolled and annealed polycrystalline high-purity aluminium (99.99 wt%), binary Al-0.25Mn and commercial purity aluminium. The growth mechanisms were found to be independent of the alloy system and the microchemistry only influences the coarsening kinetics. Orientation-dependent subgrain growth, mainly studied in high-purity aluminium and measured in lamellar bands of uniform orientation, occurs in three distinct ways, depending of the size of the local orientation gradients. Following the evolution in average subgrain size and boundary misorientation by detailed electron backscatter diffraction (EBSD) characterization during annealing, it was found that the rate of subgrain growth in Cube- and Goss-oriented grains were faster than in the typical deformation texture components, particularly after an incubation time when discontinuous subgrain growth occurs. In commercial purity aluminium, general orientation-independent subgrain growth is faster than the orientation-dependent growth because more growth occurs in regions near high-angle grain boundaries separating differently oriented lamellar bands. It appears as if subgrains misoriented by more than 3.5° have a growth advantage over less misoriented subgrains, typically in the interior of lamellar bands. While the average boundary misorientations are decreasing, the individual boundary misorientations are increasing.

scholarly journals Effects of Widening during Rolling on the Subsequent Recrystallization Kinetics of Copper

2013 ◽  
Vol 753 ◽  
pp. 285-288
Author(s):  
Feng Xiang Lin ◽  
Torben Leffers ◽  
Wolfgang Pantleon ◽  
Dorte Juul Jensen
Keyword(s):  
Recrystallization Texture ◽  
Electron Backscatter Diffraction ◽  
Cube Texture ◽  
Recrystallization Process ◽  
Recrystallization Kinetics ◽  
Two Samples ◽  
Electron Backscatter ◽  
Cold Rolled ◽  
Backscatter Diffraction ◽  
Kinetics Of

Recrystallization kinetics in copper cold-rolled to 90% reduction with and without significant widening was investigated by electron backscatter diffraction. It was found that the recrystallization process was slightly retarded and the development of cube recrystallization texture was largely inhibited in the widening sample. Cube grains were observed to have a growth advantage by a factor of 2 in the non-widening sample, while this growth advantage was not observed in the widening sample. The recrystallization kinetics and the development of cube texture in the two samples are discussed.

YBCO Coated Conductor Applications - A Texture Problem

2005 ◽  
Vol 495-497 ◽  
pp. 1353-1358 ◽  
Author(s):  
B. Obst ◽  
Rainer Nast ◽  
G. Kotzyba ◽  
Wilfried Goldacker
Keyword(s):  
Electron Backscatter Diffraction ◽  
Cube Texture ◽  
Coated Conductor ◽  
Ceramic Superconductor ◽  
Biaxial Texture ◽  
Ybco Coated Conductor ◽  
Electron Backscatter ◽  
Backscatter Diffraction ◽  
Lattice Matched ◽  
Proper Orientation

YBa2Cu3O7-δ ("YBCO") is a high-temperature ceramic superconductor. Due to its complex layered structure, a strong biaxial texture of the YBCO grains is necessary to achieve technically relevant currents. In this paper, we describe the development of flexible metallic tapes with strong cube texture, providing a lattice-matched template for buffer and YBCO coatings in proper orientation. Texture analysis was performed using electron backscatter diffraction (EBSD).

Three-Dimensional Microstructure of Thin Copper Foils Revealed by Ion Beam Cutting and Electron Backscatter Diffraction (EBSD)

2005 ◽  
Vol 105 ◽  
pp. 465-0 ◽  
Author(s):  
G. Simons ◽  
Karsten Kunze ◽  
W. Hauffe ◽  
Jürg Dual
Keyword(s):  
Solid Mechanics ◽  
Fracture Strain ◽  
Electron Backscatter Diffraction ◽  
Ion Beam ◽  
Three Dimensional ◽  
Cube Texture ◽  
Rolling Texture ◽  
Copper Foils ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Tensile testing of thin rolled copper foils with thickness ranging from 10 to 250 µm shows a dependence of the fracture strain with respect to the thickness of the foils [G. Simons et al., in Solid Mechanics and its Applications, Vol. 114 (2004), pp. 89-96]. To understand the influence of the microstructure in the foils on this phenomenon the microtexture is investigated by orientation mapping through electron backscatter diffraction (EBSD). As the samples are rather small standard preparation techniques do not apply. Two methods are described which allow the investigation of different section cuts of the samples: Cross sections of the samples were produced by ion beam cutting with a wide beam of 7 keV Kr ions. Internal planes parallel to the specimen surface were made accessible by wet etching. The as-received material possesses a very strong texture consisting mostly of the cube component and some remnants of a previous rolling texture. Specimens tested in a tensile test do not show major microstructural changes compared to virgin samples. After a heat treatment at 300°C the cube texture has significantly weakened in favour of revived rolling components, and the fracture strain increased about ten times relative to the as-is material.

Recovery Kinetics in High Purity and Commercial Purity Aluminium Alloys

2013 ◽  
Vol 753 ◽  
pp. 235-238 ◽  
Author(s):  
Sindre Bunkholt ◽  
Knut Marthinsen ◽  
Erik Nes
Keyword(s):  
Solid Solution ◽  
High Purity ◽  
Aluminium Alloys ◽  
Electron Backscatter Diffraction ◽  
Commercial Purity ◽  
Boundary Misorientation ◽  
Purity Aluminium ◽  
Recovery Mechanisms ◽  
Commercial Purity Aluminium ◽  
Ebsd Technique

Motivated by improving current softening models for recycle friendly alloys, softening was investigated in high purity and commercial purity aluminium alloys. Utilizing the electron backscatter diffraction (EBSD) technique, orientation dependent sub-grain growth was characterized with respect to grain size and average boundary misorientation. In the high purity alloys, small additions of Mn in solid solution slowed down the recovery kinetics. The recovery mechanisms were however not altered, but recovery kinetics were found to be orientation dependent. The presence of high angle grain boundaries or transition bands, i.e. large and sharp orientation gradients, seemed to change the growth from slow and continuous to a faster and discontinuous process. This was typical for Cube and Goss, while weak, short and long range orientations gradients observed in Copper, S and Brass, did not alter growth which was slow and continuous. Before detailed studies of recovery of the commercial purity alloy were initiated, a rather slow recovery was observed and further investigated. Preliminary results indicate that iron in solid solution is dramatically slowing down the kinetics but can form clusters by an intermediate annealing in order to speed up recovery.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

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