Investigation of Aluminum Incorporation in 4H-SiC Epitaxial Layers

2014 ◽  
Vol 806 ◽  
pp. 45-50 ◽  
Author(s):  
Roxana Arvinte ◽  
Marcin Zielinski ◽  
Thierry Chassagne ◽  
Marc Portail ◽  
Adrien Michon ◽  
...  

In the present contribution, the trends in voluntary incorporation of aluminum in 4H-SiC homoepitaxial films are investigated. The films were grown on Si-and C-face 4H-SiC 8°off substrates by chemical vapor deposition (CVD) in a horizontal, hot wall CVD reactor. Secondary Ion Mass Spectrometry (SIMS) and capacitance-voltage (C-V) measurements were used to determine the Al incorporation in the samples. The influence of Trimethylaluminum (TMA) flow rate, growth temperature, growth pressure and C/Si ratio on the dopant incorporation was studied.

1988 ◽  
Vol 126 ◽  
Author(s):  
P. Mel ◽  
S. A. Schwarz ◽  
T. Venkatesan ◽  
C. L. Schwartz ◽  
E. Colas

ABSTRACTTe enhanced mixing of AlAs/GaAs superlattice has been observed by secondary ion mass spectrometry. The superlattice sample was grown by organometallic chemical vapor deposition and doped with Te at concentrations of 2×1017 to 5×1018 cm−.3 In the temperature range from 700 to 1000 C, a single activation energy for the Al diffusion of 2.9 eV was observed. Furthermore, it has been found that the relationship between the Al diffusion coefficient and Te concentration is linear. Comparisons have been made between Si and Te induced superlattice mixing.


2006 ◽  
Vol 527-529 ◽  
pp. 625-628
Author(s):  
Hun Jae Chung ◽  
Sung Wook Huh ◽  
A.Y. Polyakov ◽  
Saurav Nigam ◽  
Qiang Li ◽  
...  

Undoped 6H- and 4H-SiC crystals were grown by Halide Chemical Vapor Deposition (HCVD). Concentrations of impurities were measured by various methods including secondary-ion-mass spectrometry (SIMS). With increasing C/Si ratio, nitrogen concentration decreased and boron concentration increased as expected for the site-competition effect. Hall-effect measurements on 6H-SiC crystals showed that with the increase of C/Si ratio from 0.06 to 0.7, the Fermi level was shifted from Ec-0.14 eV (nitrogen donors) to Ev+0.6 eV (B-related deep centers). Crystals grown with C/Si > 0.36 showed high resistivities between 1053 and 1010 4cm at room temperature. The high resistivities are attributed to close values of the nitrogen and boron concentrations and compensation by deep defects present in low densities.


1997 ◽  
Vol 500 ◽  
Author(s):  
Ilya Karpov ◽  
Catherine Hartford ◽  
Greg Moran ◽  
Subramania Krishnakumar ◽  
Ron Choma ◽  
...  

ABSTRACTIn this paper, we examine the dopant distributions in 1.8 to 4 micron-thick boron- and phosphorus-doped epitaxial silicon layers. These layers were grown by chemical vapor deposition (CVD) on arsenic-, antimony-, or boron-doped (100)- and (111)-oriented substrates. We performed doping profile studies by means of local resistivity measurements using a spreading resistance probe (SRP). Chemical profiles of the dopants were also obtained using secondary ion mass spectrometry (SIMS).


2009 ◽  
Vol 1203 ◽  
Author(s):  
Hideyuki Watanabe ◽  
S. Shikata

AbstractDiamond superlattices were fabricated by producing multilayer structures of isotopically pure carbon-12 (12C) and carbon-13 (13C), which confine electrons by a difference in band-gap energy. Secondary ion mass spectrometry (SIMS) measurements were employed to characterize the isotopic composition of the diamond superlattices. Layers between 2 nm and 350 nm in thickness can be designed and fabricated using a microwave plasma-assisted chemical vapor deposition technique.


1986 ◽  
Vol 74 ◽  
Author(s):  
K. T. Short ◽  
U. K. Chakrabarti ◽  
S. J. Pearton

AbstractThe formation of shallow (0.05–0.2 μm) p+ layers in GaAs by pulse diffusion of Zn from a doped oxide source, thermal diffusion of Cd by vapor transport, or by low energy implantation of Cd, Mg, Be, Zn or Hg ions was investigated by electrochemical capacitance-voltage profiling, Secondary Ion Mass Spectrometry, Rutherford backscattering and Hall measurements. Hole densities in excess of 1019 cm−3 are obtainable by either Zn diffusion or acceptor implantation, though the high temperature cycle must be kept to ≤3 sec at (≤1000°C to prevent excessive redistribution of the acceptor dopants. Pulse diffusion at temperature °C leads to shallow regions with atomic concentrations above 1019 cm−3, but electrically active concentrations orders of magnitude less. These results are explained in terms of the unavailability of a sufficient density of vacancies at low temperatures.


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