The Alloying and Aging Effects on the Wettability and Intermetallic Bonding of the Sn-Zn-Cu-Bi Soldering Alloy on a Cu Substrate

2016 ◽  
Vol 857 ◽  
pp. 26-30
Author(s):  
Surakan Sunyadeth ◽  
Pun Wirot ◽  
Boonrat Lohwongwatana ◽  
Ratchatee Techapiesancharoenkij
Keyword(s):  
Intermetallic Compound ◽  
Melting Temperature ◽  
Aging Effects ◽  
Cu Substrate ◽  
Cu Alloys ◽  
Cu Substrates ◽  
Alloying Compositions

The soldered bonding between the Sn-Zn-Cu-Bi system and a Cu substrate was studied and reported herein. The alloying compositions were varied to investigate the effects of Zn, Cu, Bi contents on the solders’ melting temperature (Tm), microstructures, wettability and the intermetallic-compound (IMC) bonding with a Cu substrate. The Sn-7Zn and Sn-9Zn exhibited low Tm (198 °C), but poor wettability on the Cu substrates. Both Cu and Bi additions significantly improved the solder wettability. However, the Tm of the Sn-Zn-Cu series increased sharply to about 225 °C by the addition of 4-wt% Cu. The addition of 3-wt% Bi lowered Tm of the Sn-Zn-Cu alloys by 5 °C. The thickness of the IMC layers between solder and substrate was maximum for Sn-9Zn and significantly decreased with the Cu addition. With the addition of Bi to Sn-Zn-Cu, the IMC thickness increased. The aging of 150 °C for 150 hours minimally affected the IMC-bonding thicknesses of most samples; however, micro crack could be observed along the aged IMC layers.

Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates

2019 ◽  
Vol 33 (01) ◽  
pp. 1850425 ◽  
Author(s):  
Hongming Cai ◽  
Yang Liu ◽  
Shengli Li ◽  
Hao Zhang ◽  
Fenglian Sun ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Diffusion Barrier ◽  
Graphene Layer ◽  
Solder Joints ◽  
Cu Substrate ◽  
Ni Content ◽  
Increasing Trend ◽  
Cu Substrates ◽  
Interfacial Intermetallic Compound ◽  
Positive Effect

In this paper, solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu (G-Cu) substrates were studied. As Ni content increases in the solder, the solderability improves gradually on both the Cu and G-Cu substrates. The solderability of SAC0705-xNi is better on G-Cu substrate than that on Cu substrate. The increasing Ni content in the solder has a positive effect on the microstructure refinement of both the kinds of substrates. Such effect is more significant on G-Cu substrate than that on Cu substrate. With the increase of Ni content, the thickness of the interfacial intermetallic compound (IMC) shows an increasing trend first and then decreasing trend on the two kinds of substrates. Since the graphene layer works as a diffusion barrier, the IMC on G-Cu is thinner than that on Cu substrate. The addition of Ni leads to the strengthening of the microstructure and thus increases the hardness of the solder bulks.

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

2015 ◽  
Vol 830-831 ◽  
pp. 265-269
Author(s):  
Satyanarayan ◽  
K.N. Prabhu
Keyword(s):  
Solder Joint ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Cu Substrate ◽  
Cu Substrates ◽  
Free Solder ◽  
Substrate Surfaces ◽  
Lead Free Solders

In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces revealed the occurrence of ductile mode of failure on smooth Cu surfaces and a transition ridge on rough Cu surfaces. Though rough Cu substrate improved the wettability of solder alloys, solder bonds were sheared at a lower force leading to decreased shear energy density compared to the smooth Cu surface. A smooth surface finish and the presence of minor amounts of Ag in the alloy improved the integrity of the solder joint. Smoother surface is preferable as it favors failure in the solder matrix.

scholarly journals Effect of Mixed Rare Earths on the Wetting Behavior and Interfacial Reaction between Sn-0.70Cu-0.05Ni Solder and Amorphous Fe84.3Si0.3B5.4 Alloy

2018 ◽  
Vol 206 ◽  
pp. 03005
Author(s):  
Bin Hou ◽  
Fengmei Liu ◽  
Hongqin Wang ◽  
Yupeng Zhang ◽  
Jianglong Yi ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Melting Temperature ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Rare Earths ◽  
Wetting Behavior ◽  
Amorphous Substrate ◽  
Continuous State ◽  
Amorphous Substrates ◽  
Limited Change

In order to explore the effect of addition of mixed rare earths (MRE) on the wetting behavior and interfacial reaction between Sn-0.70Cu-0.05Ni solder and amorphous Fe84.3Si10.3B5.4 alloy, 0.25 wt.% percentage of the MRE, which are mainly elements La and Ce, were added into the solder. Results show it can refine the microstructure of the solder alloy, and there is limited change of melting temperature with the addition of MRE in the solder. The wettability of the solder on amorphous substrate is improved by adding 0.25 wt.% percentage of the MRE into Sn-0.70Cu-0.05Ni solder. Moreover, research results indicate that, with the increase of wetting temperature, the final equilibrium wetting angles of Sn-0.70Cu-0.05Ni and Sn-0.70Cu-0.05Ni-0.25MRE on amorphous substrate decrease gradually, indicating the better wettability at the higher wetting temperature. In addition, with the increase of temperature, the distribution of intermetallic compound (IMC) FeSn2 formed at the interface between the two solders and amorphous substrate is changed from discontinuous state to continuous state. The thickness of the interfacial IMC layer between solder and amorphous substrates reduced with the addition of MRE, indicating that the presence of 0.25 wt.% percentage of the MRE is effective in suppressing the growth of IMC layer.

Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field

2010 ◽  
Vol 25 (2) ◽  
pp. 359-367 ◽  
Author(s):  
Cong-qian Cheng ◽  
Jie Zhao ◽  
Yang Xu
Keyword(s):  
Magnetic Field ◽  
Intermetallic Compound ◽  
Lorentz Force ◽  
High Magnetic Field ◽  
Solubility Limit ◽  
Layer Growth ◽  
Ripening Process ◽  
Cu Substrate ◽  
Cu Dissolution ◽  
Kinetics Of

The kinetics of intermetallic compound (IMC) layer and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field was experimentally examined. It is found that the IMC layer growth is controlled by flux-driven ripening process. The high magnetic field promotes the growth of IMC layer, retards the dissolution of Cu substrate, and decreases the content of Cu solute at the liquid–IMC interface front. Based on the experimental results, it is considered that the magnetization induced by magnetic field promotes the ripening process for IMC layer growth. The Lorentz force dampening the convection and magnetization decreasing the Cu solubility limit can retard the Cu dissolution and change the solute distribution at the liquid–IMC interface front.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

2009 ◽  
Vol 24 (11) ◽  
pp. 3407-3411 ◽  
Author(s):  
M.H. Tsai ◽  
Y.W. Lin ◽  
H.Y. Chuang ◽  
C.R. Kao
Keyword(s):  
Phase Diagram ◽  
Cu Substrate ◽  
Sequence Of Events ◽  
Cu Substrates ◽  
Soldering Reaction

The massive spalling of Cu3Sn in the soldering reaction between high-Pb solders and Cu substrates was studied to identify the mechanism behind this rather interesting and frequently observed phenomenon. Four different alloys (99.5 Pb 0.5 Sn, 99 Pb 1S n, 97 Pb 3 Sn, and 95 Pb 5 Sn, in wt%) were soldered at 350 °C for durations ranging from 10 s to 600 min. At low Sn concentration (0.5 or 1 Sn), massive spalling occurred as early as 20 min. However, at high Sn concentration (3 or 5 Sn), massive spalling was not completed even after 600 min. To the best of our knowledge, these results are the most detailed observations ever reported on the sequence of events that occur during massive spalling. The Pb–Sn–Cu phase diagram is used to rationalize the phenomenon.

Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate

2015 ◽  
Vol 815 ◽  
pp. 129-134 ◽  
Author(s):  
Xiao Chen Xie ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
Jing Wei Cheng ◽  
Bing Zheng ◽  
...  
Keyword(s):  
Growth Rate ◽  
Intermetallic Compound ◽  
Rate Constant ◽  
Growth Rate Constant ◽  
Solder Joint Reliability ◽  
Ag Addition ◽  
Cu Substrate ◽  
Joint Reliability ◽  
Aging Properties ◽  
Interfacial Intermetallic Compounds

The effect of Ag content on the morphology of the intermetallic compound (IMC) layer at the interface between Sn-xAg-0.7Cu (x=0.0 wt.%, 0.3 wt.%, 0.8 wt.%, 3.0 wt.%) and Cu substrate has been investigated. After reflow, the slight addition of Ag element can suppress the growth of IMC. However, as the Ag content increases, the thickness of IMC is enhanced. After aging at 150°C, the IMC growth rate constant decreases with the addition of Ag. The IMC growth rate constant of Sn-3.0Ag-0.7Cu is 0.94864×10-5μm2/s, which is the lowest among these solders. As the Ag addition is 0.8wt% and 3.0wt%, the Cu3Sn growth rate constant is 0.16641×10-5μm2/s and 0.18496×10-5μm2/s, compared to the Sn-0.7Cu solder decreased 54% and 49%, respectively. As a result, the addition of Ag element improves the anti-aging properties and suppresses the growth of Cu3Sn layer, which leads to the improvement of solder joint reliability.

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