Evolution of Threading Edge Dislocations at Earlier Stages of PVT Growth for 4H-SiC Single Crystals

2016 ◽  
Vol 858 ◽  
pp. 73-76 ◽  
Author(s):  
Komomo Tani ◽  
Tatsuo Fujimoto ◽  
Kazuhito Kamei ◽  
Kazuhiko Kusunoki ◽  
Kazuaki Seki ◽  
...  

Dislocation structures at the seed/grown-crystal interface in PVT-grown 4H-SiC crystals are investigated. The dislocation density is found to show a sharp increase at the interface and its main contribution is probably ascribable to TEDs which stem from BPDs generating at the interface through the structural transformation. Intense TEM observations reveal an intriguing in-plane distribution structure of the interface BPDs; the BPDs form a two-dimensional dislocation network comprising of {-1100} partial dislocations associated with expanded areas of stacking faults at the nodes of the network.

2000 ◽  
Vol 659 ◽  
Author(s):  
Felip Sandiumenge ◽  
Jérôme Plain ◽  
Teresa Puig ◽  
Xavier Obradors ◽  
Jacques Rabier ◽  
...  

ABSTRACTMelt textured YBa2Cu3O/Y2BaCuO5 were post processed by high oxygen pressure for different periods and temperatures. This process permits the control of the microstructure, in particular the growth and shape of the stacking faults and thereby the partial dislocation density. Analysis of the Jc(H,T) behavior allow to separate the contribution of Y2BaCuO5 interface from that of dislocations. It is shown that the in-plane partial dislocations act as point-like pinning centers increasing Jc up to 180% but this enhancement factor is counterbalanced by the effect of the stacking faults associated to the partial dislocations.


1990 ◽  
Vol 183 ◽  
Author(s):  
M. J. Kramer ◽  
E. P. Kvam ◽  
L. S. Chumbley

AbstractMechanial deformation of the YBa2Cu3O7−δ high temperature superconductor under a number of different processing conditions resulted in the formation of <100> and <110> edge dislocations, both having a (001) slip plane. Subsequent high temperature annealing at 900°C resulted in the formation of extrinsic stacking faults with a large separation of the partial dislocations, up to 0.35 μm, suggesting a very low minimum stacking fault energy of 1.2 × 10−2 J/m2. High resolution transmission electron microscopy (HRTEM) in conjunction with image simulations revealed that the stacking faults were comprised of an extra CuO plane between the Ba layers with an offset of b/2. The stacking fault vector of 1/6[031] requires some separation of the <010> Burgers vectors into the c-axis direction. A model in which [010] separates into 1/6[031] + 1/[031] is consistent with the observed stacking faults.


Author(s):  
Raja Subramanian ◽  
Kenneth S. Vecchio

The structure of stacking faults and partial dislocations in iron pyrite (FeS2) have been studied using transmission electron microscopy. Pyrite has the NaCl structure in which the sodium ions are replaced by iron and chlorine ions by covalently-bonded pairs of sulfur ions. These sulfur pairs are oriented along the <111> direction. This covalent bond between sulfur atoms is the strongest bond in pyrite with Pa3 space group symmetry. These sulfur pairs are believed to move as a whole during dislocation glide. The lattice structure across these stacking faults is of interest as the presence of these stacking faults has been preliminarily linked to a higher sulfur reactivity in pyrite. Conventional TEM contrast analysis and high resolution lattice imaging of the faulted area in the TEM specimen has been carried out.


2003 ◽  
Vol 798 ◽  
Author(s):  
Angelika Vennemann ◽  
Jens Dennemarck ◽  
Roland Kröger ◽  
Tim Böttcher ◽  
Detlef Hommel ◽  
...  

ABSTRACTGaN samples of this study were chemically wet etched to gain easier access to the dislocation sturcture. The scanning electron microscopy and transmission electron microscopy investigations revealed four different types of etch pits. After brief etching, several dislocations with screw component showed large etch pits, which may be correlated with the core of the screw dislocation. By means of SiNx micromasking the dislocation density could be reduced by more than one order of magnitude. The reduction of threading dislocations in the SiNx region in GaN grown on 〈0001〉 sapphire is due to bending of the threading dislocations into the {0001} plane, such that they form dislocation loops if they meet dislocations with opposite Burgers vectors. Accordingly, the achievable reduction of the dislocation density is limited by the probability that these dislocations interact. Edge dislocations bend more easily on account of their low line tension. This results in a preferential bending and reduction of dislocations with edge character.


2015 ◽  
Vol 82 (7) ◽  
Author(s):  
H. Song ◽  
R. J. Dikken ◽  
L. Nicola ◽  
E. Van der Giessen

Part of the friction between two rough surfaces is due to the interlocking between asperities on opposite surfaces. In order for the surfaces to slide relative to each other, these interlocking asperities have to deform plastically. Here, we study the unit process of plastic ploughing of a single micrometer-scale asperity by means of two-dimensional dislocation dynamics simulations. Plastic deformation is described through the generation, motion, and annihilation of edge dislocations inside the asperity as well as in the subsurface. We find that the force required to plough an asperity at different ploughing depths follows a Gaussian distribution. For self-similar asperities, the friction stress is found to increase with the inverse of size. Comparison of the friction stress is made with other two contact models to show that interlocking asperities that are larger than ∼2 μm are easier to shear off plastically than asperities with a flat contact.


2014 ◽  
Vol 1651 ◽  
Author(s):  
Thomas Hochrainer

ABSTRACTIn the current paper we present a continuum theory of dislocations based on the second-order alignment tensor in conjunction with the classical dislocation density tensor (Kröner-Nye-tensor) and a scalar dislocation curvature measure. The second-order alignment tensor is a symmetric second order tensor characterizing the orientation distribution of dislocations in elliptic form. It is closely connected to total densities of screw and edge dislocations introduced in the literature. The scalar dislocation curvature density is a conserved quantity the integral of which represents the total number of dislocations in the system. The presented evolution equations of these dislocation density measures partly parallel earlier developed theories based on screw-edge decompositions but handle line length changes and segment reorientation consistently. We demonstrate that the presented equations allow predicting the evolution of a single dislocation loop in a non-trivial velocity field.


Author(s):  
L. I. Hurski

The deformed and stressed states during rolling of a three-layer stack from various materials with a nickel foil inner layer are considered. The technique of determining the density of dislocations is described. The data about the influence of deformation conditions on the distribution and density of dislocations during rolling of nickel foil in various stacks are presented, including the registration or determination of the dislocation structure of nickel foil before deformation and at various degrees of deformation. It is shown that the mechanical scheme of deformation of the inner layer of the stack, namely, the deformation of the nickel foil by non-uniform compression with shear, has a decisive influence on the development of the dislocation structure and properties. It is established that the dislocation density is determined not only by the degree of deformation, but also by a scheme of the deformed and stressed state of matter, and for the case of shear deformation with increasing degree of deformation the dislocation density increases more rapidly than in the case of tensile strain or compression without shear; the result of shear deformation is a significant refinement of the structure of materials: with increasing degree of plastic deformation of the material a three-dimensional cellular network of dislocation is formed, wherein the borders of cells are formed by tangles of dislocations. With increasing degree of deformation, the density of dislocations at the cell boundaries increases, and the size of the cells decreases; in this case, the areas inside the cells of the dislocation network are always free of dislocations. The obtained results allow recommending the schemes with shear deformation for new promising processes of production of materials with unique properties.


Author(s):  
michael kassner

This paper discusses recent developments in creep, over a wide range of temperature, that mqy change our understanding of creep. The five-power law creep exponent (3.5 to 7) has never been explained in fundamental terms. The best the scientific community has done is to develop a natural three power-law creep equation that falls short of rationalizing the higher stress exponents that are typically five. This inability has persisted for many decades. Computational work examining the stress-dependence of the climb rate of edge dislocations we may rationalize the phenomenological creep equations. Harper-Dorn creep, “discovered” over 60 years ago has been immersed in controversy. Some investigators have insisted that a stress exponent of one is reasonable. Others believe that the observation of a stress exponent of one is a consequence of dislocation network frustration. Others believe the stress exponent is artificial due to the inclusion of restoration mechanisms such as dynamic recrystallization or grain growth that is not of any consequence in the five power-law regime. Also, the experiments in the Harper-Dorn regime, which accumulate strain very slowly (sometimes over a year) may not have attained a true steady state. New theories suggest that absence or presence of Harper-Dorn may be a consequence of the initial dislocation density. Novel experimental work suggests that power-law breakdown may be a consequence of a supersaturation of vacancies which increase self-diffusion.


1999 ◽  
Vol 572 ◽  
Author(s):  
W. L. Samey ◽  
L. Salamanca-Riba ◽  
P. Zhou ◽  
M. G. Spencer ◽  
C. Taylor ◽  
...  

ABSTRACTSiC/Si films generally contain stacking faults and amorphous regions near the interface. High quality SiC/Si films are especially difficult to obtain since the temperatures usually required to grow high quality SiC are above the Si melting point. We added Ge in the form of GeH2 to the reactant gases to promote two-dimensional CVD growth of SiC films on (111) Si substrates at 1000°C. The films grown with no Ge are essentially amorphous with very small crystalline regions, whereas those films grown with GeH2 flow rates of 10 and 15 sccm are polycrystalline with the 3C structure. Increasing the flow rate to 20 sccm improves the crystallinity and induces growth of 6H SiC over an initial 3C layer. This study presents the first observation of spontaneous polytype transformation in SiC grown on Si by MOCVD.


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