Channeled Implantations of p-Type Dopants into 4H-SiC at Different Temperatures

2019 ◽  
Vol 963 ◽  
pp. 382-385 ◽  
Author(s):  
Margareta K. Linnarsson ◽  
Anders Hallén ◽  
Lasse Vines ◽  
Bengt G. Svensson
Keyword(s):  
Room Temperature ◽  
Depth Distribution ◽  
Elevated Temperatures ◽  
Secondary Ion Mass Spectrometry ◽  
Lattice Vibrations ◽  
Simulation Code ◽  
Different Temperatures ◽  
P Type ◽  
Secondary Ion ◽  
Collision Approximation

Channeling of B and Al ions in 4H-SiC(0001), has been investigated by secondary ion mass spectrometry (SIMS). Ion implantations have been performed between room temperature (RT) and 600 °C at various fluences. Before implantation, the major crystal axes were determined and the sample was aligned using the blocking pattern of backscattered protons. As expected, the depth distribution of the implanted ions along a crystal direction penetrates much deeper compared to non-channeling directions. At elevated temperatures, the channeling depth for 100 keV Al-ions is decreased due to lattice vibrations. For 50 keV B-ions, the temperature effect is minor, indicating a smaller interaction between target atoms and B. Simulations has been performed using SIIMPL, a Monte Carlo simulation code based on the binary collision approximation, to predict experimental data and get a deeper insight in the channeling process.

Manganese in 4H-SiC

2010 ◽  
Vol 645-648 ◽  
pp. 701-704
Author(s):  
Margareta K. Linnarsson ◽  
Aurégane Audren ◽  
Anders Hallén
Keyword(s):  
Mass Spectrometry ◽  
Heat Treatment ◽  
Ion Implantation ◽  
Depth Distribution ◽  
Secondary Ion Mass Spectrometry ◽  
Rutherford Backscattering Spectrometry ◽  
Rutherford Backscattering ◽  
P Type ◽  
Secondary Ion

Manganese diffusion in 4H-SiC for possible spintronic applications is investigated. Ion implantation is used to introduce manganese in n-type and p-type 4H-SiC and subsequent heat treatment is performed in the temperature range of 1400 to 1800 °C. The depth distribution of manganese is recorded by secondary ion mass spectrometry and Rutherford backscattering spectrometry in the channeling direction is employed for characterization of crystal disorder. After the heat treatment, the crystal order is improved and a substantial rearrangement of manganese is revealed in the implanted region. However, no pronounced manganese diffusion deeper into the sample is recorded.

Plasma-Assisted MBE of GaN and AlGaN on 6H SiC(0001)

1995 ◽  
Vol 395 ◽  
Author(s):  
S. Sinharoy ◽  
A. K. Agarwal ◽  
G. Augustine ◽  
L. B. Rowland ◽  
R. L. Messham ◽  
...  
Keyword(s):  
Room Temperature ◽  
Molecular Beam ◽  
Reverse Bias ◽  
Secondary Ion Mass Spectrometry ◽  
Operating Temperature ◽  
Leakage Currents ◽  
Activation Rate ◽  
P Type ◽  
A1n Buffer Layer ◽  
Secondary Ion

ABSTRACTThe growth of undoped and doped GaN and AlGaN films on off-axis 6H SiC substrates was investigated using plasma-assisted molecular beam epitaxy (MBE). Smooth and crack-free GaN and AlGaN films were obtained; the best results occurred at the highest growth temperature studied (800°C) and with a 40 to 50 nm A1N buffer layer grown at the same temperature. Carrier concentrations of up to n = 4 × 1020 cm−3 were accomplished with silicon, with a 40 to 50% activation rate as determined by secondary ion mass spectrometry (SIMS). Unintentionally doped AlxGa,.xN (x≈0.1) was n-type with a carrier concentration of 7 × 1018 cm−3. N-type AlGaN (x≈0.1)/p-type 6H SiC (0001) heterostructures showed excellent junction characteristics with leakage currents of less than 0.1 nA at 5 V reverse bias at room temperature and 0.5 nA at 200°C operating temperature.

Determination of the Distribution of Ion Implantation Boron in Silicon

2000 ◽  
Vol 650 ◽  
Author(s):  
Te-Sheng Wang ◽  
A.G. Cullis ◽  
E.J.H. Collart ◽  
A.J. Murrell ◽  
M.A. Foad
Keyword(s):  
Electron Microscopy ◽  
Secondary Ion Mass Spectrometry ◽  
Low Energy ◽  
Concentration Profiles ◽  
Impurity Profile ◽  
Transmission Electron ◽  
Device Applications ◽  
P Type ◽  
Secondary Ion

ABSTRACTBoron is the most important p-type dopant in Si and it is essential that, especially for low energy implantation, both as-implanted B distributions and those produced by annealing should be characterized in very great detail to obtain the required process control for advanced device applications. While secondary ion mass spectrometry (SIMS) is ordinarily employed for this purpose, in the present studies implant concentration profiles have been determined by direct B imaging with approximately nanometer depth and lateral resolution using energy-filtered imaging in the transmission electron microscopy. The as-implanted B impurity profile is correlated with theoretical expectations: differences with respect to the results of SIMS measurements are discussed. Changes in the B distribution and clustering that occur after annealing of the implanted layers are also described.

Recent Advances in the Doping of 4H-SiC by Channeled Ion Implantation

2019 ◽  
Vol 963 ◽  
pp. 375-381 ◽  
Author(s):  
Anders Hallén ◽  
Margareta K. Linnarsson ◽  
Lasse Vines
Keyword(s):  
Ion Implantation ◽  
Room Temperature ◽  
Depth Distribution ◽  
Lattice Vibrations ◽  
Recent Advances ◽  
Thermal Vibrations ◽  
Further Development ◽  
Technological Interest

The effect of lattice thermal vibrations on the channeling of 100 keV Al ions in 4H-SiC is investigated. By implanting at room temperature in the direction, the depth distribution of the incident ions is shown to be about 7 times deeper than for random implantations. At higher implantation temperatures, the channeling is reduced by the lattice vibrations and, for instance, at 600 °C implantation the distribution is about 3-4 times deeper than for a RT random implantation. The results are of technological interest for further development of implantation technology for 4H-SiC device manufacturing.

Impurity Profiles in InP from Ion Implantation at Elevated Temperatures

1991 ◽  
Vol 240 ◽  
Author(s):  
P. Kringhoj ◽  
B. G. Svensson
Keyword(s):  
Mass Spectrometry ◽  
Ion Implantation ◽  
Elevated Temperatures ◽  
Secondary Ion Mass Spectrometry ◽  
Implantation Damage ◽  
Ion Mass Spectrometry ◽  
Chemical Profiles ◽  
Impurity Profiles ◽  
Secondary Ion

ABSTRACTThe chemical profiles of Zn, Ge, and Se implanted into InP at elevated temperatures have been measured with secondary ion mass spectrometry and correlated to the implantation damage as deduced from RBS/channeling measurements. An asymmetric broadening of the chemical profiles towards the bulk was found for implantation temperatures above 150°C. This effect is concluded to be due to impurity channeling during implantation.

Influence of dynamic annealing on the depth distribution of germanium implanted in (100) silicon at elevated temperatures

1997 ◽  
Vol 469 ◽  
Author(s):  
A Nejim ◽  
C Jeynes ◽  
R P Webb ◽  
Neb Cowern ◽  
C J Patel
Keyword(s):  
Room Temperature ◽  
Depth Distribution ◽  
Elevated Temperatures ◽  
Silicon Wafers ◽  
Apparent Mass ◽  
Excess Loss ◽  
Rule Out

Abstract(100) silicon wafers were implanted at elevated temperatures up to 600°C with l×lO15-5×1015 Ge+/cm2 using 120 keV. The wafers were tilted by 5–7° and rotated by 5–15°. The implanted germanium profile was monitored as a function of implant temperature using RBS-channelling. Considerable profile broadening was seen together with apparent mass germanium migration away from the surface in samples implanted at 300°C and above. Control implants into hot and cold samples simultaneously rule out excess loss of germanium from the heated wafers. Channelling data indicate that while room temperature implants lead to amorphisation, with hot implants good quality layers are obtained in which the germanium atoms occupy substitutional sites. Hot implants into a sample previously implanted with germanium at room temperature does not lead to any redistribution in the original germanium profile. This result indicates that the apparent enhanced indiffusion of germanium is not a radiation assisted phenomenon and could be explained by a considerable channelling of the implanted germaniumatoms along the <100> direction.

A Comparison of Magnesium and Beryllium Acceptors in GaN Grown by rf-Plasma Assisted Molecular Beam Epitaxy

2000 ◽  
Vol 639 ◽  
Author(s):  
A.J. Ptak ◽  
T.H. Myers ◽  
Lijun Wang ◽  
N.C. Giles ◽  
M. Moldovan ◽  
...  
Keyword(s):  
Atomic Hydrogen ◽  
Molecular Beam ◽  
Surface Segregation ◽  
Secondary Ion Mass Spectrometry ◽  
Rf Plasma ◽  
Dopant Incorporation ◽  
Optical Activation ◽  
P Type ◽  
Kinetics Of ◽  
Secondary Ion

ABSTRACTStep-doped structures of both magnesium and beryllium were grown in GaN and analyzed using secondary ion mass spectrometry. Dopant incorporation was studied as a function of substrate temperature and dopant flux for Ga-polarity and N-polarity GaN. Incorporation is different for each polarity, with Mg incorporating by up to a factor of 20 times more (30 times more with atomic hydrogen) on the Ga-face, while Be incorporates more readily on the N-face. The effect of atomic hydrogen on the incorporation kinetics of both Mg and Be is also discussed. Mg and Be both undergo surface segregation during growth. Photoluminescence measurements suggest that Be is a p-type dopant with an optical activation energy of approximately 100 meV.

Deuterium Diffusion, Trapping and Stability in Buried Silicon Dioxide Layers

1998 ◽  
Vol 513 ◽  
Author(s):  
A. Boutry-Forveille ◽  
A. Nazarov ◽  
D. Ballutaud
Keyword(s):  
Mass Spectrometry ◽  
Silicon Dioxide ◽  
Isothermal Annealing ◽  
Secondary Ion Mass Spectrometry ◽  
Oxide Layers ◽  
Buried Oxide ◽  
Different Temperatures ◽  
Hydrogen Deuterium ◽  
Secondary Ion ◽  
Diffusion Profiles

ABSTRACTThe interaction of hydrogen (deuterium used as tracer) with Si-Si02-Si buried oxide layers (BOX) prepared by thermal oxidation or by oxygen implantation (SIMOX) are investigated using Secondary Ion Mass Spectrometry (SIMS) measurements combined with effusion experiments. The sample deuteration is performed at different temperatures between 150 and 300°C using a radiofrequency plasma. In SIMOX samples, the deuterium diffusion profiles analysed by SIMS show deuterium trapping on implantation defects, and deuterium diffusion in the silicon substrate by permeation through the oxide layer for temperatures higher than 250°C. The deuterium is still detected in the buried oxide layers after isothermal annealing at 600°C during 2 hours. The deuterium trapping at the siliconsilicon dioxide interfaces is analysed.

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