On the Influence of Internal Void Size on the Fracture Stress of Constrained Solder Joints
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The fracture strengths of thin solder joints were investigated experimentally and with Finite Element Analysis. Due to a constraining effect, thin solder joints can carry loads which are much higher than the ultimate tensile strength of bulk solder material. On the other hand, thin solder joints show a tendency of being brittle. In fact, the tensile properties show a dependence on the quality of the intermetallic compound at the interface to the base material. Consequently, the size of microscopic defects in the intermetallic compound has a dominant influence on the fracture stress. This behavior could nicely be explained with Finite Element simulations based on strain gradient elasticity.
2019 ◽
Vol 0
(5)
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pp. 37-40
2001 ◽
Vol 42
(5)
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pp. 809-813
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2013 ◽
Vol 419
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pp. 203-208
2014 ◽
Vol 1061-1062
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pp. 421-426
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