Applications of 3D X-Ray Microscopy for Advanced Package Development

2011 ◽  
Vol 2011 (1) ◽  
pp. 001078-001083 ◽  
Author(s):  
K. Fahey ◽  
R. Estrada ◽  
L. Mirkarimi ◽  
R. Katkar ◽  
D. Buckminster ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Development Stage ◽  
Development Effort ◽  
X Ray ◽  
Structural Details ◽  
Volumetric Images ◽  
Advanced Packaging ◽  
Solder Fatigue ◽  
Non Destructive

This paper describes the utilization of non-destructive imaging using 3D x-ray microscopy for package development and failure analysis. Four case studies are discussed to explain our methodology and its impact on our advanced packaging development effort. Identifying and locating failures embedded deep inside the package, such as a solder fatigue failure within a flip chip package, without the need for physical cross-sectioning is of substantial benefit because it preserves the package for further analysis. Also of utility is the ability to reveal the structural details of the package while producing superior quality 2D and volumetric images. The technique could be used not only for analysis of defects and failures, but also to characterize geometries and morphologies during the process and package development stage.

Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials

2007 ◽  
Author(s):  
Margaret Stern ◽  
Bob Melanson ◽  
Vadim Gektin ◽  
Paul Hundt ◽  
Carlos Arroyo ◽  
...  
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Technology Development ◽  
Acoustic Microscopy ◽  
Thermal Interface Material ◽  
Development Effort ◽  
Plating Bath ◽  
X Ray ◽  
Dark Ring ◽  
Advanced Packaging

We have evaluated a new Ag-filled silicone thermal interface material (TIM) for its sensitivity to lid finish and impact on imaging discontinuities in the die/lid (TIM1) layer, in conjunction with two high performance lid materials, as a part of our advanced packaging technology development effort. Thermal and mechanical (shear stress and lid pull) measurements have been carried out on a number of different lid finishes to optimize thermal performance and adhesion at the TIM1/lid interface. This silicone TIM1 is found to be sensitive to the type of Ni-plating and plating bath chemistry. Nondestructive and destructive metrology has been carried out on flip chip (FC) packages using Ag-filled silicone TIM1 and either Cu or AlSiC lids. A number of silicone formulations have been investigated to assess their impact on surface acoustic microscopy (SAM) and X-ray imaging. Nondestructive evaluation (NDE) by real time X-ray and SAM has identified artifacts that make it difficult to unambiguously detect voids and delamination in the TIM1 layer. A “dark ring” or “picture frame” artifact is observed at the die perimeter in acoustic microscope images of packages with the Ag-filled TIM1. Detailed SEM cross-section and thermal mapping analyses on a number of specially constructed FC packages have been correlated with TIM1/lid delamination and voiding observed in SAM and X-ray images. Results of these studies point to changes in the TIM1 modulus during cure and post cure thermal excursions as the cause of the “dark ring” observed in the transmission SAM images rather than delamination at the TIM1/lid or TIM1/die interfaces. However, in the event that delamination is present at the edges it cannot be unambiguously deconvoluted from the “dark ring” artifact in the SAM images.

Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy

1996 ◽  
Author(s):  
O. Diaz de Leon ◽  
M. Nassirian ◽  
C. Todd ◽  
R. Chowdhury
Keyword(s):  
Failure Analysis ◽  
Large Scale ◽  
Flip Chip ◽  
Ultrasonic Waves ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Chip Technology ◽  
Ball Joints ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

Abstract Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Integration (ULSI) applications [1]. The flip-chip technology is based on the direct attach principle of die to substrate interconnection.. The absence of bondwires clearly enables packages to become more slim and compact, and also provides higher pin counts and higher-speeds [2]. However, due to its construction, with inherent hidden structures the Flip-Chip technology presents a challenge for non-destructive Failure Analysis (F/A). The scanning acoustic microscope (SAM) has recently emerged as a valuable evaluation tool for this purpose [3]. C-mode scanning acoustic microscope (C-SAM), has the ability to demonstrate non-destructive package analysis while imaging the internal features of this package. Ultrasonic waves are very sensitive, particularly when they encounter density variations at surfaces, e.g. variations such as voids or delaminations similar to air gaps. These two anomalies are common to flip-chips. The primary issue with this package technology is the non-uniformity of the die attach through solder ball joints and epoxy underfill. The ball joints also present defects as open contacts, voids or cracks. In our acoustic microscopy study packages with known defects are considered. It includes C-SCAN analysis giving top views at a particular package interface and a B-SCAN analysis that provides cross-sectional views at a desired point of interest. The cross-section analysis capability gives confidence to the failure analyst in obtaining information from a failing area without physically sectioning the sample and destroying its electrical integrity. Our results presented here prove that appropriate selection of acoustic scanning modes and frequency parameters leads to good reliable correlation between the physical defects in the devices and the information given by the acoustic microscope.

Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications

2010 ◽  
Author(s):  
Sebastian Brand ◽  
Matthias Petzold ◽  
Peter Czurratis ◽  
Peter Hoffrogge
Keyword(s):  
Image Processing ◽  
Failure Analysis ◽  
Signal Analysis ◽  
Flip Chip ◽  
Fault Isolation ◽  
Acoustic Microscopy ◽  
Specific Information ◽  
Full Potential ◽  
Time Frequency ◽  
Non Destructive

Abstract In industrial manufacturing of microelectronic components, non-destructive failure analysis methods are required for either quality control or for providing a rapid fault isolation and defect localization prior to detailed investigations requiring target preparation. Scanning acoustic microscopy (SAM) is a powerful tool enabling the inspection of internal structures in optically opaque materials non-destructively. In addition, depth specific information can be employed for two- and three-dimensional internal imaging without the need of time consuming tomographic scan procedures. The resolution achievable by acoustic microscopy is depending on parameters of both the test equipment and the sample under investigation. However, if applying acoustic microscopy for pure intensity imaging most of its potential remains unused. The aim of the current work was the development of a comprehensive analysis toolbox for extending the application of SAM by employing its full potential. Thus, typical case examples representing different fields of application were considered ranging from high density interconnect flip-chip devices over wafer-bonded components to solder tape connectors of a photovoltaic (PV) solar panel. The progress achieved during this work can be split into three categories: Signal Analysis and Parametric Imaging (SA-PI), Signal Analysis and Defect Evaluation (SA-DE) and Image Processing and Resolution Enhancement (IP-RE). Data acquisition was performed using a commercially available scanning acoustic microscope equipped with several ultrasonic transducers covering the frequency range from 15 MHz to 175 MHz. The acoustic data recorded were subjected to sophisticated algorithms operating in time-, frequency- and spatial domain for performing signal- and image analysis. In all three of the presented applications acoustic microscopy combined with signal- and image processing algorithms proved to be a powerful tool for non-destructive inspection.

Advanced Acoustic Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and Reflections

2004 ◽  
Author(s):  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Daniel J. D. Sullivan ◽  
Quang Nguyen ◽  
Lisa Logan-Willams
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
New Technologies ◽  
Electronic Packages ◽  
Advanced Packaging ◽  
Ic Package ◽  
Non Destructive

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.

Infra-Red Reflectance Microscopy (IRRM) for Daisy Chain Flip Chip Device Failure Analysis

2004 ◽  
Author(s):  
Carlo Grilletto ◽  
Steve Hsiung ◽  
Andrew Komrowski ◽  
John Soopikian ◽  
Daniel J.D. Sullivan ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
State Of The Art ◽  
Failure Mechanisms ◽  
Simple Metal ◽  
X Ray ◽  
Infra Red ◽  
Cause Of Failure ◽  
Reflectance Microscopy ◽  
Ir Emission

Abstract This paper describes a method to "non-destructively" inspect the bump side of an assembled flip-chip test die. The method is used in conjunction with a simple metal-connecting "modified daisy chain" die and makes use of the fact that polished silicon is transparent to infra-red (IR) light. The paper describes the technique, scope of detection and examples of failure mechanisms successfully identified. It includes an example of a shorting anomaly that was not detectable with the state of the art X-ray equipment, but was detected by an IR emission microscope. The anomalies, in many cases, have shown to be the cause of failure. Once this has been accomplished, then a reasonable deprocessing plan can be instituted to proceed with the failure analysis.

X-ray Advances in Support of Advanced Packaging – Today and Tomorrow

2018 ◽  
Vol 2018 (1) ◽  
pp. 000409-000414
Author(s):  
David Bernard
Keyword(s):  
Heat Dissipation ◽  
X Ray ◽  
Destructive Test ◽  
Heat Transfer Efficiency ◽  
Advanced Packaging ◽  
History Of ◽  
Production Output ◽  
2D And 3D ◽  
Non Destructive

Abstract As advanced packaging continues to develop to support novel and emerging technologies, the need for, ideally non-destructive, test and inspection continues to be vital to ensure the quality and assurance of functionality, wherever the package may go. This is made ever more difficult as the package complexity increases, whilst the feature sizes within continue to decrease. X-ray technology has long been an important part of the non-destructive inspection protocol over the history of advanced packaging and will continue to need to play a more important part in the future. This paper will review the advances made in both 2D and 3D X-ray inspection over recent years and the new opportunities that are now starting to be available, especially in 3D, or CT, inspection, that will enable this 120-year-old technology to remain relevant to and supportive of the needs of advanced packaging. To highlight the above, a case study will be presented on the faults that 2D and CT X-ray analysis can find in LEDs during their manufacture. LEDs are a good example of the remarkable developments in packaging and technology over the last 20 years, where the use of higher powers, smaller sized features and increased reliability requirements intensify the need for higher quality, more consistent production output. Flaws cannot be accepted, especially as higher usage powers mean higher operating temperatures which, in turn, then requires very good thermal conductivity in the package to move heat away from key areas. Without good heat dissipation then heat stresses at the interfaces can cause delamination or die fractures, so reducing LED lifetimes. The presence of voids, particularly at the die to package interface, creates air gaps that reduces heat transfer efficiency. As many LEDs are potted, or encapsulated, the only non-destructive test option to check for voiding and other faults is by using 2D and CT X-ray analysis.

Failure analysis of epoxy molded IC packages

2016 ◽  
Vol 33 (2) ◽  
pp. 94-101
Author(s):  
Kamil Janeczek ◽  
Aneta Arazna ◽  
Konrad Futera ◽  
Grazyna Koziol
Keyword(s):  
Failure Analysis ◽  
Sulphuric Acid ◽  
Electronic Devices ◽  
Mechanical Grinding ◽  
Content Type ◽  
Power Mosfets ◽  
X Ray ◽  
Non Destructive ◽  
Practical Implications ◽  
Graphic Software

Purpose The aim of this paper is to present non-destructive and destructive methods of failure analysis of epoxy moulded IC packages on the example of power MOSFETs in SOT-227 package. Design/methodology/approach A power MOSFET in SOT-227 package was examined twice using X-ray inspection, at first as the whole component to check if it is damaged and then after removing the upper part of package by mechanical grinding. The purpose of the second X-ray inspection was to prepare images for estimation of the total number and approximate location of voids in soft solder layers. Finally, power MOSFETs were subjected to decapsulation process using a concentrated sulphuric acid to verify existence of damage areas noticed during X-ray analysis and to observe other possible failures such as cracks in aluminium metallization or wires deformation. Findings X-ray analysis was revealed to be adequate technique to detect damage (e.g. meltings) in power MOSFETs in SOT-227 package, but only when tested components were analysed in the side view. This type of analysis combined with a graphic software is also suitable for voids estimation in soft solder layers. Moreover, it was found that a single acid (concentrated sulphuric acid) at elevated temperature can be successfully used for decapsulation of power MOSFETs in SOT-227 package without damage of aluminium metallization and aluminium wires. Such decapsulation process enables analysis of defects in wire, die and package materials. Research limitations/implications Further investigations are required to examine if the presented methods of failures analysis can be used for other types of components (e.g. high power resistors) in similar packages. Practical/implications The described methods of failure analysis can find application in electronic industry to select components which are free of damage and in effect which allow to produce high reliable devices. Apart from it, the presented method is applicable to evaluate reasons of improper work of tested electronic devices and to identify faked components. Originality/value This paper contains valuable information for research and technical staff involved in the assessment of electronic devices who needs practical methods of failure analysis of epoxy moulded IC packages.

Failure Analysis of a Qualification Unit Injector for a Satellite Thruster

1998 ◽  
Author(s):  
M. Lipschutz ◽  
R. Brannam ◽  
T. Nguyentat
Keyword(s):  
Failure Analysis ◽  
Cross Section ◽  
Combustion Products ◽  
Design Parameters ◽  
Cross Sectional ◽  
X Ray ◽  
Root Cause ◽  
Qualification Testing ◽  
Non Destructive ◽  
Unit Injector

Abstract This article details the results of a failure analysis performed on a Qualification Unit injector for a military satellite thrusters and explains that the failure was initially detected due to a shift in performance during qualification testing. Failure analysis involved non-destructive evaluation on the injector using micro-focus X-ray and scanning electron microscopy. Serial cross-sectional metallography was then performed, with each cross-section documented by optical microscopy and SEM. The failure analysis resulted in three main conclusions: (1) the root cause of the failure was attributed to multiple detonations in or around the damaged orifice; these detonations were likely caused by fuel and/or combustion products condensing in the orifice between pulses and then igniting during a subsequent pulse; (2) multiple damage mechanisms were identified in addition to the ZOT detonations; and (3) the material and platelet manufacturing process met all design parameters.

Application to Non Destructive Physical Analysis Method Using X-ray CT Imaging

2010 ◽  
Author(s):  
Akira Mizoguchi ◽  
Minoru Sugawara ◽  
Masahide Nakamura ◽  
Koichiro Takeuchi
Keyword(s):  
Failure Analysis ◽  
Three Dimensional ◽  
Ct Imaging ◽  
Temperature Cycling ◽  
Physical Analysis ◽  
Printed Wiring Boards ◽  
X Ray ◽  
X Ray Imaging ◽  
X Ray Computed ◽  
Non Destructive

Abstract We have been paying attention to the development of the nondestructive physical analysis (NDPA) technology. We think that NDPA is a technology which doesn't depend on the worker's capability or experience. There are many NDPA techniques, and analysis using X-ray imaging is one of the principal techniques. Due to the progress of the image analysis using computers in recent years, X-ray imaging have been evolving from two dimensional images to three dimensional imaging. We have been applying X-ray CT imaging to actual failure analysis and reliability evaluation since 2008. At ISTFA 2009, we reported on the effectiveness of X-ray Computed Tomography (CT) images in the failure analysis. [1] We confirmed that the X-ray CT image had various applications, for example, screening for counterfeit parts, the detection of the defect of the multi-layers printed wiring boards (multi-layers PWB), the structure confirmation of caulking contacts, and the detection of cracks or voids of the solder joint. This paper discusses the effectiveness of X-ray CT imaging in failure analysis and discusses the effectiveness of applying X-ray CT imaging to the propagation of cracks occurring at solder joints during temperature cycling test.

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