Detailed Analysis of How Power Stage and Power Clip Products Achieve Optimized Power Density
2013 ◽
Vol 2013
(1)
◽
pp. 000782-000789
The power stage and power clip packages are designed to increase the power density, in a synchronous rectifier (SR) buck application, while using a significantly smaller PCB land pattern area than a conventional discrete pair of MOSFETs. This paper presents a detailed analysis of how these new Fairchild dual-die designs achieve this performance.
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2011 ◽
Vol 317-319
◽
pp. 2138-2143
2015 ◽
Vol 821-823
◽
pp. 884-888
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2009 ◽
Vol 19
(3)
◽
pp. 97-102
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2002 ◽
Vol 18
(3)
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pp. 181-188
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1983 ◽
Vol 44
(C3)
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pp. C3-543-C3-550
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