Understanding Whisker Growth: Effect of Substrate and Underlayer

2016 ◽  
Vol 2016 (1) ◽  
pp. 000512-000515 ◽  
Author(s):  
Piyush Jagtap ◽  
Praveen Kumar
Keyword(s):  
Whisker Growth ◽  
Electron Backscatter Diffraction ◽  
Growth Effect ◽  
X Rays ◽  
Ion Imaging ◽  
Electron Backscatter ◽  
Texture Characterization ◽  
Backscatter Diffraction ◽  
Pure Cu ◽  
Pure Sn

Abstract The fundamentals of whiskering in pure Sn coatings electrodeposited on pure Cu and brass (65 wt. % Cu: 35 wt. % Zn) substrates with and without electrodeposited Ni underlayer was studied. These coatings were subjected to isothermal aging at 50 °C to accelerate the whisker growth, and whisker growth was studied using scanning electron microscope (SEM) equipped with focused ion imaging. Texture characterization was conducted using X-rays and electron backscatter diffraction (EBSD). It was observed that whisker growth was more accelerated in case of brass substrate compared to pure Cu substrate. No whisker growth was observed in coatings with Ni underlayer. It was observed that diffusion of substrate atoms along Sn grain boundaries plays major role in whiskering. Ni underlayer inhibited diffusion of Cu and Zn atoms into Sn coating and hence was very effective in mitigating whisker growth.

scholarly journals Effect of Secondary Cold Reduction Rates on Microstructure, Texture and Earing Behavior of Double Reduction Tinplate

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 4040
Author(s):  
Peng Tian ◽  
Luhai Liao ◽  
Guoming Zhu ◽  
Yonglin Kang
Keyword(s):  
Electron Backscatter Diffraction ◽  
Reduction Rate ◽  
Microstructural Characterization ◽  
Cold Reduction ◽  
Double Reduction ◽  
X Ray ◽  
Dissolved Carbon ◽  
Electron Backscatter ◽  
Texture Characterization ◽  
Backscatter Diffraction

In order to evaluate the effect of secondary cold reduction rate on the drawing performance of double reduction tinplate and explain the mechanism, a detailed investigation into the microstructural characterization, dissolved carbon atoms, texture characterization by an X-ray powder diffractometer (XRD) and electron backscatter diffraction (EBSD), and earing behavior were carried out with different secondary cold reduction rates of 15%, 20% and 25% for double reduction tinplate. The experimental results indicate that 15% secondary cold reduction rate could obtain a better drawing performance because there are no holes and cracks at the microstructure, and the content of dissolved carbon atom is relatively low; at the same time, it has a better texture distribution and low earing coefficient.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

scholarly journals Analysis of Strain Partitioning in Intercritically Deformed Microstructures via Interrupted Tensile Tests

Metals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 112
Author(s):  
Unai Mayo ◽  
Nerea Isasti ◽  
José M. Rodríguez-Ibabe ◽  
Pello Uranga
Keyword(s):  
Electron Backscatter Diffraction ◽  
Tensile Tests ◽  
Correlation Technique ◽  
Strain Partitioning ◽  
High Angle ◽  
Electron Backscatter ◽  
Different Types ◽  
Final Deformation ◽  
Micro Alloyed Steel ◽  
Backscatter Diffraction

Intercritically deformed steels present combinations of different types of ferrite, such as deformed ferrite (DF) and non-deformed ferrite (NDF) grains, which are transformed during the final deformation passes and final cooling step. Recently, a grain identification and correlation technique based on EBSD has been employed together with a discretization methodology, enabling a distinction to be drawn between different ferrite populations (NDF and DF grains). This paper presents a combination of interrupted tensile tests with crystallographic characterization performed by means of Electron Backscatter Diffraction (EBSD), by analyzing the evolution of an intercritically deformed micro-alloyed steel. In addition to this, and using the nanoindentation technique, both ferrite families were characterized micromechanically and the nanohardness was quantified for each population. NDF grains are softer than DF ones, which is related to the presence of a lower fraction of low-angle grain boundaries. The interrupted tensile tests show the different behavior of low- and high-angle grain boundary evolution as well as the strain partitioning in each ferrite family. NDF population accommodates most of the deformation at initial strain intervals, since strain reaches 10%. For higher strains, NDF and DF grains behave similarly to the strain applied.

Sign in / Sign up

Export Citation Format

Share Document