3D Printed Integrated Microfluidic Cooling for High Power RF Applications
Abstract This paper presents the design and fabrication of microfluidic channel integration in a plastic substrate using 3D printing. The microfluidic channels are integrated along with a copper plate which the coolant is in direct contact with. To demonstrate the design, a diode intended for switched power supplies is integrated onto the copper plate and its performance characterized. 3D printing or additive manufacturing (AM) allows for fast prototyping of such package designs and can be readily adopted in the fabrication of RF circuits. This paper, to the best of our knowledge, for the first time will demonstrate a 3D printed integrated microfluidic channel for the cooling of electronic circuits. Details of design, fabrication and characterization are presented.