AbstractWe have studied predicted thickness uniformity of thin films deposited by the pulsed laser ablation technique. Unlike a conventional evaporation process, the spatial thickness characteristics of laser-deposited films is controlled by a number of laser and other deposition variables including laser wavelength, pulse energy density, substrate-target distance, area and shape of the laser irradiated spot, etc. The effect of these parameters on the spatial thickness variations have been analyzed by using a model proposed by Singh et. al. [1]. This model is based on the anisotropic expansion of the laser-generated high-temperature and high-pressure plasma, which is initially confined to small dimensions and then expands anisotropically in vacuum. The results show that spatial film uniformity can be improved by decreasing plasma temperature and specific heat capacity ratio of the plasma gas. For large laser irradiated spot diameters (> 8 mm), the film uniformity was found to decrease with decreasing spot diameters, but this trend reversed at smaller: irradiated spot sizes. Depending on the laser irradiated conditions and substrate-target geometry, the thickness variations have been found to vary from (cos θ)2.5 to (cos θ)12. Optimization of various parameters to decrease the spatial-thickness inhomogeneities across the film are also discussed.
Preparation of High Ga Content Cu(In,Ga)Se<sub>2</sub> Thin Films by Sequential Evaporation Process Added In<sub>2</sub>S<sub>3</sub>
