The Future of Sputtering in the Electron Microscope Laboratory
In such fields as electronics and optics, the sputtering process is rapidly displacing the conventional evaporation process. Its major advantage is the ability to deposit a variety of refractory metals and dielectric materials with good control and reproducibility. This advantage and numerous others are valid reasons why sputtering may eventually displace thermal evaporation in the typical electron microscope laboratory. Sputtering is readily adapted to the procedures utilized in TEM, however, the following discussion highlights the advantages of sputtering for applying coatings to specimens for SEM.Sputtering is not a new concept. Numerous papers and books had been published before 1900 concerning the use of sputtering for depositing thin films.