Area Selective Flash Lamp Post-Deposition Annealing of High-k Film Using Si Photo Absorber for Metal Gate MISFETs with NiSi Source/Drain

2005 ◽  
Author(s):  
Takeo Matsuki ◽  
Isamu Nishimura ◽  
Yasushi Akasaka ◽  
Kiyoshi Hayashi ◽  
Masataka Noguchi ◽  
...  
Keyword(s):  
Flash Lamp ◽  
Metal Gate ◽  
Post Deposition Annealing ◽  
High K ◽  
Post Deposition

Reduction of CV Hysteresis in Metal/High-k MISFETs Using Flash Lamp Post Deposition Annealing

2004 ◽  
Vol 811 ◽  
Author(s):  
Takeo Matsuki ◽  
Yasushi Akasaka ◽  
Kiyoshi Hayashi ◽  
Masataka Noguchi ◽  
Koji Yamashita ◽  
...  
Keyword(s):  
Charge Trapping ◽  
Gate Insulator ◽  
Flash Lamp ◽  
Gate Electrode ◽  
Post Deposition Annealing ◽  
Hysteresis Width ◽  
High K ◽  
Mis Capacitors ◽  
Hysteresis Characteristics ◽  
Post Deposition

ABSTRACTA Xe flash lamp (FL) heating technique was applied to the post deposition annealing process (PDA) for HfAlOx/SiO2 gate insulator with poly-Si or W/TiN gate electrode in a gate last based process. In the case of W/TiN/HfAlOx/SiO2, CV hysteresis with less than 10mV was achieved using the FL-PDA. However, the FL-PDA increased hysteresis width up to over 100 mV when poly-Si was used as a gate electrode. That occurred also with low temperature (700 °C) rapid thermal PDA process. The lower thermal budget achieved by the flash lamp annealing and the metal gate is effective to suppress the interfacial reaction which causes the traps responsible for the hysteresis. Charge trapping in the W/TiN/HfAlOx/SiO2 was evaluated using CV hysteresis characteristics in the MISFETs and the MIS capacitors. Electron was major trapped charge of the HfAlOx.

Improvement of TDDB reliability, characteristics of HfO2 high-k/metal gate MOSFET device with oxygen post deposition annealing

2010 ◽  
Vol 50 (5) ◽  
pp. 618-621 ◽  
Author(s):  
Chia-Wei Hsu ◽  
Yean-Kuen Fang ◽  
Wen-Kuan Yeh ◽  
Chun-Yu Chen ◽  
Yen-Ting Chiang ◽  
...  
Keyword(s):  
Metal Gate ◽  
Post Deposition Annealing ◽  
Reliability Characteristics ◽  
High K ◽  
Post Deposition

Electrical characterization of high-k gate dielectrics fabricated using plasma oxidation and post-deposition annealing of a Hf/SiO2/Si structure

2006 ◽  
Vol 9 (6) ◽  
pp. 1031-1036 ◽  
Author(s):  
Youhei Sugimoto ◽  
Hideto Adachi ◽  
Keisuke Yamamoto ◽  
Dong Wang ◽  
Hideharu Nakashima ◽  
...  
Keyword(s):  
Gate Dielectrics ◽  
Electrical Characterization ◽  
Plasma Oxidation ◽  
Post Deposition Annealing ◽  
High K ◽  
Post Deposition

Stabilization of a very high-k crystalline ZrO2 phase by post deposition annealing of atomic layer deposited ZrO2/La2O3 dielectrics on germanium

2010 ◽  
Vol 256 (16) ◽  
pp. 5031-5034 ◽  
Author(s):  
S. Abermann ◽  
C. Henkel ◽  
O. Bethge ◽  
G. Pozzovivo ◽  
P. Klang ◽  
...  
Keyword(s):  
Atomic Layer ◽  
Post Deposition Annealing ◽  
Zro2 Phase ◽  
High K ◽  
Very High ◽  
Post Deposition

Electrical Characteristics of Crystalline Gd2O3 Film on Si (111): Impacts of Growth Temperature and Post Deposition Annealing

2010 ◽  
Vol 1252 ◽  
Author(s):  
Gang Niu ◽  
Bertrand Vilquin ◽  
Nicolas Baboux ◽  
Guillaume Saint-Girons ◽  
Carole Plossu ◽  
...  
Keyword(s):  
Molecular Beam ◽  
Defect Density ◽  
Oxide Thickness ◽  
Electrical Characteristics ◽  
Equivalent Oxide Thickness ◽  
Optimal Temperature ◽  
Post Deposition Annealing ◽  
High K ◽  
Electrical Characterizations ◽  
Post Deposition

AbstractThis work reports on the epitaxial growth of crystalline high-k Gd2O3 on Si (111) by Molecular Beam Epitaxy (MBE) for CMOS gate application. Epitaxial Gd2O3 films of different thicknesses have been deposited on Si (111) between 650°C~750°C. Electrical characterizations reveal that the sample grown at the optimal temperature (700°C) presents an equivalent oxide thickness (EOT) of 0.73nm with a leakage current density of 3.6×10-2 A/cm2 at |Vg-VFB|=1V. Different Post deposition Annealing (PDA) treatments have been performed for the samples grown under optimal condition. The Gd2O3 films exhibit good stability and the PDA process can effectively reduce the defect density in the oxide layer, which results in higher performances of the Gd2O3/Si (111) capacitor.

Electrical Breakdown and Reliability of Metal Gate - La2O3 Thin Films after Post Deposition Annealing in N2

2019 ◽  
Vol 1 (5) ◽  
pp. 757-765 ◽  
Author(s):  
Joel Molina ◽  
Kazuo Tsutsui ◽  
H. Iwai ◽  
Kuniyuki Kakushima ◽  
Nobuyuki Sugii ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Breakdown ◽  
Metal Gate ◽  
Post Deposition Annealing ◽  
Post Deposition

Effect of Al-content and Post Deposition Annealing on the Electrical Properties of Ultra-thin HfAlxOy Layers

2002 ◽  
Vol 745 ◽  
Author(s):  
R. J. Carter ◽  
W. Tsai ◽  
E. Young ◽  
M. Caymax ◽  
J. W. Maes ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Electrical Properties ◽  
Fixed Charge ◽  
Post Deposition Annealing ◽  
Al Content ◽  
Partial Pressures ◽  
High K ◽  
Flatband Voltage ◽  
High Al Content ◽  
Post Deposition

ABSTRACTScaled HfAlxOy/SiO2 stacks down to 1.5 nm EOT have been achieved. Although the addition of Al to the HfO2 matrix can be beneficial, it is observed that the benefit of using a Hf-aluminate is compromised if the film has a high Al-content. This is observed in terms of a dielectric constant close to that of pure Al2O3 (∼ 9) and a large amount of negative fixed charge in the film (∼ 1012 cm-2). Using oxygen post deposition anneals we have been able to reduce flatband voltage shifts associated with fixed charge as well as CV hysteresis. In terms of scaling, the benefit of using a high-k material is compromised if a SiO2 layer is also present in the gate stack. Therefore, it is necessary to perform an O2 PDA at moderate temperatures or in low O2 partial pressures in order to control the thickness of the interfacial oxide layer.

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