Development of 2IN1 Hybrid Measuring Device Using EO/IR Camera

2019 ◽  
Vol 12 (2) ◽  
pp. 33-36
Author(s):  
Ju-Yeong Jung ◽  
Hyuk-Jin Yoon ◽  
Dae-Hyun Kim
Keyword(s):  
Ir Camera ◽  
Measuring Device

Instrument for measuring and recording Electrical load profiles

2018 ◽  
pp. 111-115
Author(s):  
Yuri Kolev ◽  
Атanas Atanasov ◽  
Таnia Pehlivanova
Keyword(s):  
Power Consumption ◽  
Simultaneous Recording ◽  
Active Power ◽  
Power Lines ◽  
Electrical Load ◽  
Current Transformers ◽  
Measuring Device ◽  
Load Profile

A load profile measuring device takes information about the power consumption without modification of the power lines. Using current transformers, the current is measured in each of the phases and the active power consumed by the user is determined. The developed software for it allows for simultaneous recording at different user selectable timing intervals. The device is designed and tested in two facilities - a School and a Farm.

Thermal Imaging Product Power-up: Metrology for Capturing Thermal Defects on Live Units Not Visible on Any Other Technique

2005 ◽  
Author(s):  
Nova T. Zamora ◽  
Kam Meng Chong ◽  
Ashish Gupta
Keyword(s):  
Thermal Imaging ◽  
Thermal Response ◽  
Recent Application ◽  
Ir Camera ◽  
Thermal Failure ◽  
Response Data ◽  
Startup Process ◽  
Customer Returns ◽  
Actual Computer ◽  
Detection Of Defects

Abstract This paper presented the recent application of die powerup in Thermal Imaging as applied to the detection of defects causing thermal failure on revenue products or units not being captured using other available techniques. Simulating the condition on an actual computer setup, the infrared (IR) camera should capture images simultaneously as the entire bootup process is being executed by the processor, thus revealing a series of images and thermal information on each and every step of the startup process. This metrology gives the failure analyst a better approach to acquire a set of information that substantiate in the conduct of rootcause analysis of thermal-related failure in revenue units, especially on customer returns. Defective units were intentionally engineered in order to collect the thermal response data and eventually come up with a plot of all known thermal-related defects.

Evaluation of Package Defects by Thermal Imaging Techniques

2002 ◽  
Author(s):  
Yongmei Liu ◽  
Rajen Dias
Keyword(s):  
Infrared Thermography ◽  
Thermal Imaging ◽  
High Speed ◽  
Imaging Techniques ◽  
Thermal Response ◽  
Analysis Tool ◽  
Nondestructive Analysis ◽  
Ir Camera ◽  
External Heating

Abstract Study presented here has shown that Infrared thermography has the potential to be a nondestructive analysis tool for evaluating package sublayer defects. Thermal imaging is achieved by applying pulsed external heating to the package surface and monitoring the surface thermal response as a function of time with a high-speed IR camera. Since the thermal response of the surface is affected by the defects such as voids and delamination below the package surface, the technique can be used to assist package defects detection and analysis.

Fault Localization and Functional Testing of ICs by Lock-in Thermography

2002 ◽  
Author(s):  
O. Breitenstein ◽  
J.P. Rakotoniaina ◽  
F. Altmann ◽  
J. Schulz ◽  
G. Linse
Keyword(s):  
Spatial Resolution ◽  
Electronic Device ◽  
Imaging Techniques ◽  
Heat Diffusion ◽  
Acquisition Time ◽  
Temperature Modulation ◽  
Heat Sources ◽  
Ir Camera ◽  
Free Running ◽  
Lock In

Abstract In this paper new thermographic techniques with significant improved temperature and/or spatial resolution are presented and compared with existing techniques. In infrared (IR) lock-in thermography heat sources in an electronic device are periodically activated electrically, and the surface is imaged by a free-running IR camera. By computer processing and averaging the images over a certain acquisition time, a surface temperature modulation below 100 µK can be resolved. Moreover, the effective spatial resolution is considerably improved compared to stead-state thermal imaging techniques, since the lateral heat diffusion is suppressed in this a.c. technique. However, a serious limitation is that the spatial resolution is limited to about 5 microns due to the IR wavelength range of 3 -5 µm used by the IR camera. Nevertheless, we demonstrate that lock-in thermography reliably allows the detection of defects in ICs if their power exceeds some 10 µW. The imaging can be performed also through the silicon substrate from the backside of the chip. Also the well-known fluorescent microthermal imaging (FMI) technique can be be used in lock-in mode, leading to a temperature resolution in the mK range, but a spatial resolution below 1 micron.

An Infrared Microscope for Use on a Focused Ion Beam for Circuit Edit and Backside Edit Applications

2015 ◽  
Author(s):  
Alexander Richards ◽  
Matthew Weschler ◽  
Michael Durller
Keyword(s):  
Focused Ion Beam ◽  
Near Infrared ◽  
Ion Beam ◽  
Visible Spectrum ◽  
Camera System ◽  
Buried Structures ◽  
Ir Camera ◽  
Area Of Interest ◽  
Near Ultraviolet ◽  
Infrared Microscope

Abstract To help solve the navigational problem, i.e., being able to successfully locate a circuit for probing or editing without destroying chip functionality, a near-infrared (NIR), near-ultraviolet (NUV), and visible spectrum camera system was developed that attaches to most focused ion beam (FIB) or scanning electron microscope vacuum chambers. This paper reviews the details of the design and implementation of the NIR/NUV camera system, as instantiated upon the FEI FIB 200, with a particular focus on its use for the visualization of buried structures, and also for non-destructive real time area of interest location and end point detection. It specifically considers the use of the micro-optical camera system for its benefit in assisting with frontside and backside circuit edit, as well as other typical FIB milling activities. The quality of the image obtained by the IR camera rivals or exceeds traditional optical based imaging microscopy techniques.

DESIGN OF THE VIRTUAL DEVICE FOR THE SIGNAL SPECTRUM CALCULATION IN THE LABVIEW ENVIRONMENT

2019 ◽  
Author(s):  
Tossenko O.M.
Keyword(s):  
Virtual Instrument ◽  
Spectral Characteristics ◽  
Spectral Composition ◽  
Automated System ◽  
Signal Spectrum ◽  
Measuring Instruments ◽  
Specific Information ◽  
Measuring Device ◽  
Virtual Device ◽  
Graphical Tool

The development of measuring instruments requires a specialist to know the principles of operation of advanced measuring systems. This article describes guidelines for creating a virtual appliance in LabVIEW. LabVIEW (Laboratory Virtual Instrument Engineering Workbench) is a graphical application programming environment used as a standard tool for measuring, analyzing their data, further ma­ naging devices and objects under study. LabVIEW language is not like other programming languages. It does not create a program, but a virtual tool, designed not only for the simulation of certain processes, but also for the management of hardware and the study of real physical objects. The article deals with the task of designing application software for a specific information-measuring device, analyzes the capabilities of the LabVIEW environment for spectral analysis of various signals, outlines the basic principles and techniques of programming within the framework of the LabVIEW graphical environment during the basic stages of development. The procedure for creating a virtual device is described, which allows to evaluate the spectral composition of the signals, presents a graphical code of execution (diagram) to the program and a graphical tool interface of the virtual device. A number of basic elements used to develop the program are described. The simplicity of the graphic designs, the ease of installation on the field of the program, the clarity and readability of the program — all of which makes LabVIEW preferred over other languages of programming. In most cases, the experiment is the only source of reliable information. And the result is achieved much faster than the methods of "pure" theory. The article substantiates the effectiveness of using a development tool that allows to obtain a software product and ensure the fulfillment of all the basic functions of an automated system. Developing a software algorithm for calculating statistical parameters will help engineering students understand the order of determining spectral characteristics and their place in the structure of experimental research.

Sign in / Sign up

Export Citation Format

Share Document