Rubber-tip Design Improvement for Die Crack Elimination at Diebond Process
Keyword(s):
The paper focused on the elimination of die crack occurrence at the diebond process. Design of experiment (DOE) was done on the pick and place rubber-tip design and an improved design was finalized. The improved rubber-tip configuration with smaller vacuum design and full contact surface eventually resolved the die crack issues, improving the manufacturability of thin silicon die during diebond process. For future works, the configuration could be applied for packages with similar requirement.
2017 ◽
Vol 27
(8)
◽
pp. 707-722
◽
Keyword(s):
2007 ◽
Vol 16
(2)
◽
pp. 144-149
◽
Keyword(s):
2013 ◽
Vol 3
(4)
◽
pp. 337-345
◽
2014 ◽
Vol 695
◽
pp. 787-791
◽
Keyword(s):
2015 ◽
Vol 766-767
◽
pp. 1183-1189
Keyword(s):
Keyword(s):
Keyword(s):