scholarly journals Optimalisasi Variabel Pick and Place untuk Meningkatkan Output Proses Die Attach pada Fabrikasi Chip RFID

2021 ◽  
Vol 5 (1) ◽  
pp. 9-12
Author(s):  
Daniel Aturman Sinaga ◽  
Aditya Gautama Darmoyono ◽  
Dwi Imam Mulyono
Keyword(s):  
Design Of Experiment ◽  
Cycle Time ◽  
Die Attach ◽  
Pick And Place ◽  
Set Up

Pengaplikasian teknologi dapat mempermudah manusia dalam kehidupan sehari-hari. Salah satu tekonologi ini adalah RFID. Pada pembuatan chip RFID, timbul masalah pada proses pick and place yaitu terdapat beberapa variabel  set up mesin yang kurang optimal,  kendala tersebut membuat mesin kurang  efisien dalam waktu dan kualitas, sehingga dilakukan optimalisasi variabel-variabel tersebut. Proses optimalisasi pada penelitian ini tidak hanya mempertimbangkan cycle time yang minimum tetapi juga kualitas produk yang dihasilkan. Oleh karena itu pada tahap awal percobaan dicari selang nilai dari variabel-variabel yang akan dioptimalisasi. Pada selang ini produk yang dihasilkan masih masuk ke dalam spesifikasi kualitas yang telah ditentukan. Langkah selanjutnya adalah proses optimalisasi cycle time menggunakan Design of Experiment dengan metode RSM. Tujuannya meminimalisasikan cycle time sehingga produk dapat lebih banyak diproduksi tanpa mengorbankan kualitas. Hasil dari metoda ini adalah cycle time selama 3.188 detik dari yang sebelumnya 4.9 detik. Diketahui  pada satu leadframe terdapat 36 chip. Sehingga total waktu pick and place menurun menjadi 1.91 menit per leadframe (3.188x 36). Untuk perhitungan waktu die attach ditambah pick and place per leadframe adalah = 1.91 menit + 1.30 menit (epoxy application) + 1 menit (handling) + 0.35 menit (inspection) = 4.56 menit. Dari hasil perhitungan ini akan diperoleh UPH 13 leadframe, meningkat sebanyak 2 leadframe dari sebelumnya.

scholarly journals Die Attach Pre-bond Inspection Innovation for Roughened Leadframe

2020 ◽  
pp. 40-47
Author(s):  
Michael D. Capili
Keyword(s):  
Design Of Experiment ◽  
Yield Loss ◽  
Bright Light ◽  
Statistical Tools ◽  
Die Attach ◽  
Epoxy Material ◽  
To Come ◽  
Set Up ◽  
Manufacturing Yield ◽  
And Behavior

This paper studies the challenges and behavior of epoxy material between the roughened Leadframe during the Die Attach process. Die bond on the roughened die-attach paddle (DAP) of epoxy has been a challenge for its manufacturability in terms of maintaining the target epoxy volume. The study on the roughened Leadframe utilizing the Pre-bond inspection parameter causing machine inspection cannot fully detect the epoxy pattern. The uneven contrast of pad’s, causing pre-bond inspection problem. Hard to teach / set-up epoxy inspection due to the contrast between leadframe die pad vs. epoxy. The roughened leadframe property has different surface contrast causing Frequent “Bond Align” and epoxy inspection error on the Roughen leadframe. This occurrence leads to risks of insufficient epoxy which is detrimental to product reliability (delamination on die bottom) and can cause manufacturing yield loss due to insufficient epoxy coverage. Using the Design of Experiment (DOE) methodology and its applicable statistical tools, the author to come up with error-proofing solutions to resolve and reduce the Insufficient Epoxy. The innovative and breakthrough solutions implemented were the installation of ultra-bright light with double sidelights in pre-bond inspection which is the key in reducing defects rate.

Design of spline surface vacuum gripper for pick and place robotic arms

2020 ◽  
Vol 4 (2) ◽  
pp. 48-55
Author(s):  
A. S. Jamaludin ◽  
M. N. M. Razali ◽  
N. Jasman ◽  
A. N. A. Ghafar ◽  
M. A. Hadi
Keyword(s):  
Cycle Time ◽  
Industrial Robot ◽  
Annealing Process ◽  
Vacuum Suction ◽  
Robotic Arms ◽  
Custom Made ◽  
Pick And Place ◽  
Manufacturing Procedure ◽  
Production Flexibility ◽  
The Impact

The gripper is the most important part in an industrial robot. It is related with the environment around the robot. Today, the industrial robot grippers have to be tuned and custom made for each application by engineers, by searching to get the desired repeatability and behaviour. Vacuum suction is one of the grippers in Watch Case Press Production (WCPP) and a mechanism to improve the efficiency of the manufacturing procedure. Pick and place are the important process for the annealing process. Thus, by implementing vacuum suction gripper, the process of pick and place can be improved. The purpose of vacuum gripper other than design vacuum suction mechanism is to compare the effectiveness of vacuum suction gripper with the conventional pick and place gripper. Vacuum suction gripper is a mechanism to transport part and which later sequencing, eliminating and reducing the activities required to complete the process. Throughout this study, the process pick and place became more effective, the impact on the production of annealing process is faster. The vacuum suction gripper can pick all part at the production which will lower the loss of the productivity. In conclusion, vacuum suction gripper reduces the cycle time about 20%. Vacuum suction gripper can help lower the cycle time of a machine and allow more frequent process in order to increase the production flexibility.

scholarly journals Purwarupa Alat Kalibrasi Kerataan Bidang Kerja menggunakan Laser Sensor

2018 ◽  
Vol 6 (2) ◽  
pp. 274
Author(s):  
BUDI SUGANDI ◽  
SURADI WIYONO
Keyword(s):  
Prototype System ◽  
Laser Sensor ◽  
Important Process ◽  
Manual Measurement ◽  
Industrial Manufacturing ◽  
Die Attach ◽  
Pick And Place ◽  
Component Assembly ◽  
Keywords Laser

ABSTRAKSalah satu elemen teknologi pendukung dari industri manufaktur elektronika adalah mesin Die Attach. Mesin ini digunakan pada proses assembly komponen dengan metode pick and place komponen pada material. Sebagai proses yang penting dalam industri manufaktur, mesin ini memerlukan kalibrasi secara reguler dan tepat yang akan menjadi kunci sukses dari kualitas suatu produksi. Penelitian ini bertujuan membuat suatu purwarupa alat yang digunakan sebagai pengontrol kalibrasi dengan menggunakan laser sensor. Proses kalibrasi dilakukan dengan cara mengukur kerataan titip sisi work holder menggunakan laser sensor. Kerataan didapatkan dengan membandingkan jarak yang terukur oleh laser sensor pada tiap titik uji. Jarak yang sama pada tiap titik uji menunjukkan kerataan dari work holder. Pergerakan laser sensor dikontrol oleh dua buah motor yang bergerak ke arah sumbu X dan Y. Alat ini telah diuji dengan mengkalibrasi pada empat sisi work holder. Hasil pengujian kemudian dibandingkan dengan pengukuran manual dan didapatkan error rata-rata pengukuran sekitar 4%.Kata kunci: Laser sensor, kerataan, kalibrasi, die attach machine ABSTRACTOne of the element technology supporting an industrial manufacturing is Die Attach machine. This machine is used at component assembly using component pick and place. As an important process, this machine requires regular and precise calibration to support quality of the product. This research aims to build a prototype system using laser sensor which can be used as calibration instrument. The callibration proses was done by measuring the flatness of each side of work holder using laser sensor. The flatness was obtained by comparing the distance of each testing point. The same distance on each testing point represented the flatness of the wrok holder. The movement of laser sensor was controlled by two motors which moved to X and Y axis. The system has been tested to calibrate each side of work holder. The experimental results were then compare with manual measurement and showed the measurement error about 4%.Keywords: Laser sensor, flatness, callibration, die attach machine.

Optimization of pick-and-place in die attach process using a genetic algorithm

2018 ◽  
Vol 68 ◽  
pp. 856-865 ◽  
Author(s):  
You-Jin Park ◽  
Gilseung Ahn ◽  
Sun Hur
Keyword(s):  
Genetic Algorithm ◽  
Die Attach ◽  
Pick And Place

Implementation of Cloud Connected Smart Robot for Environmental and Industrial Platform

2017 ◽  
Vol 8 (3) ◽  
pp. 645
Author(s):  
Senthil Kumar M. ◽  
V. Mathivanan
Keyword(s):  
Environmental Changes ◽  
Mobile App ◽  
Environmental Data ◽  
Shared Services ◽  
Computing Environment ◽  
Cloud Computing Environment ◽  
Cloud Robotics ◽  
Cloud Server ◽  
Pick And Place ◽  
Set Up

<p>Cloud robotics is an emerging field that is centred on the benefits of converged infrastructure and shared services of a cloud computing environment. In this paper, a system is designed with an autonomous Pick and Place robot to sense environmental data such as temperature and Motion, along with GPS coordinates and sends them on the cloud. The mobile robot is controlled using an LPC1764 microcontroller and communicates with the cloud via a CC3200 Launchpad. A private cloud is set up using Open Stack that provides Infrastructure as a Service. The collected data are stored in a cloud server which could be viewed through a mobile app and can be used to create awareness about the environmental changes of the location under study. A proof-of-concept prototype has been developed to illustrate the effectiveness of the proposed system.</p>

Automated Assembly and Hermetic Packaging of MOEMS for Applications Requiring Extended Shelf-Lives

2005 ◽  
Author(s):  
Dan O. Popa ◽  
Michael Deeds ◽  
Abiodun Fasoro ◽  
Heather Beardsley ◽  
Jeongsik Sin ◽  
...  
Keyword(s):  
Machine Vision ◽  
Shelf Life ◽  
Cost Effective ◽  
Wire Bonding ◽  
Automated Assembly ◽  
Hermetic Packaging ◽  
Die Attach ◽  
Pick And Place ◽  
Solder Reflow ◽  
Seam Sealing

In this paper we describe two modular automated microassembly systems, along with a several packaging processes that have been integrated to produce reliable and cost-effective MOEMS devices. The automated and packaging systems consists of robotics such as pick and place, insertion and fastening, machine vision and controls, and processes such as die attach, solder reflow by laser, wire bonding and seam sealing. The target MOEMS devices are intended for applications requiring a minimum twenty year shelf-life.

scholarly journals Optimisation by Design of Experiment of Benzimidazol-2-One Synthesis under Flow Conditions

Molecules ◽  
2019 ◽  
Vol 24 (13) ◽  
pp. 2447 ◽  
Author(s):  
Serena Mostarda ◽  
Tugçe Gür Maz ◽  
Alessandro Piccinno ◽  
Bruno Cerra ◽  
Erden Banoglu
Keyword(s):  
Drug Discovery ◽  
Design Of Experiment ◽  
Model Reaction ◽  
High Yield ◽  
Flow Conditions ◽  
Inflammatory Drug ◽  
Drug Discovery Program ◽  
Scale Preparation ◽  
Privileged Scaffold ◽  
Set Up

A novel flow-based approach for the preparation of benzimidazol-2-one (1) scaffold by the 1,1′-carbonyldiimidazole (CDI)-promoted cyclocarbonylation of o-phenylenediamine (2) is reported. Starting from a preliminary batch screening, the model reaction was successfully translated under flow conditions and optimised by means of design of experiment (DoE). The method allowed the efficient preparation of this privileged scaffold and to set up a general protocol for the multigram-scale preparation in high yield, purity, and productivity, and was successfully applied for the multigram flow synthesis of N-(2-chlorobenzyl)-5-cyano-benzimidazol-2-one, which is a key synthon for hit-to-lead explorations in our anti-inflammatory drug discovery program.

Managing Epoxy Tailing in Die Attach thru Design of Experiment

2020 ◽  
pp. 44-50
Author(s):  
Michael D. Capili
Keyword(s):  
Production Process ◽  
Design Of Experiment ◽  
Conductive Adhesive ◽  
Fluid State ◽  
Die Attach ◽  
Epoxy Dispensing ◽  
Common Problems ◽  
Adhesive Epoxy

Die attach epoxy dispensing is an automated factory environment that creates some special challenges. A robust production process begins with an understanding of the adhesives in their fluid state and which important parameters must be controlled. One of the most common problems encountered with adhesives in Die attach process is epoxy tailing. Tailing in this sense means the peak of the dispensed material falls away from the center of the dot when the nozzle finishes dispensing. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality is given. In this research, epoxy-associated defects are eliminated by optimizing the Break tail parameter using the Design of Experiment (DOE) methodology. The DOE prediction profile result shows that the tailing parameters recommended is Broken tail delay: 200 ms and Break tail offset is 350 counts. This study is applicable for silver filled conductive adhesive epoxy with greater than 9K Viscosity and greater than 4 Thixotropic Index.

scholarly journals Automation of Pick and Place Operation in Contact Lens Manufacturing

2018 ◽  
Vol 17 (2) ◽  
pp. 25-29
Author(s):  
Norhaliza Abdul Wahab ◽  
Jeevaniswaran Thangaraj
Keyword(s):  
High Precision ◽  
Contact Lens ◽  
Cycle Time ◽  
Contact Lenses ◽  
Development Environment ◽  
Integrated Development ◽  
C Programming ◽  
Pick And Place ◽  
Stepper Motors ◽  
Pick And Place Operation

The paper describes the design of an automation of pick and place operation in contact lens manufacturing. The contact lens pick and place robot is designed so that it replaces operators to pick and place contact lenses from cassette to PS-48 tray automatically. The microcontroller used in this project is Arduino Uno. Solidworks is a software used to create the design before fabrication. Actuators used in this projects are stepper motors due to their high precision in calculating steps to move by the overall system. C programming is used along with Arduino Integrated Development Environment, IDE in programming the movement of the robot.  For this project, the robot is controlled by pressing start and stop button. The automated lens pick and place robot is way better compare to humans since it is capable of reducing cycle time to complete the process by picking 7 lenses simultaneously. Moreover, the lens pick and place robot tend to reduce number of labours and improve the hygiene in contact lenses production. The lens pick and place robot has successfully helped to automate the process in contact lenses manufacturing. The goal of the design have been achieved whereby the robot manage to transfer the lenses from cassette to tray.

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