Preparation of siloxane-silsesquioxane hybrid thin films for large-scale-integration interlayer dielectrics with excellent mechanical properties and low dielectric constants

2003 ◽  
Vol 90 (3) ◽  
pp. 626-634 ◽  
Author(s):  
Jin-Heong Yim ◽  
Yi-Yeol Lyu ◽  
Hyun-Dam Jeong ◽  
Sang Kook Mah ◽  
Jingyu Hyeon-Lee ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Large Scale ◽  
Dielectric Constants ◽  
Interlayer Dielectrics ◽  
Low Dielectric ◽  
Large Scale Integration ◽  
Hybrid Thin Films ◽  
Scale Integration

Porous low dielectric constant materials for microelectronics

2005 ◽  
Vol 364 (1838) ◽  
pp. 201-215 ◽  
Author(s):  
Mikhail R Baklanov ◽  
Karen Maex
Keyword(s):  
Dielectric Constant ◽  
High Speed ◽  
Large Scale ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Large Scale Integration ◽  
The Subject ◽  
On Chip ◽  
Scale Integration ◽  
Selection Of

Materials with a low dielectric constant are required as interlayer dielectrics for the on-chip interconnection of ultra-large-scale integration devices to provide high speed, low dynamic power dissipation and low cross-talk noise. The selection of chemical compounds with low polarizability and the introduction of porosity result in a reduced dielectric constant. Integration of such materials into microelectronic circuits, however, poses a number of challenges, as the materials must meet strict requirements in terms of properties and reliability. These issues are the subject of the present paper.

Microstructure and Mechanical Properties of Thin Al-Si-Ge Films

1996 ◽  
Vol 436 ◽  
Author(s):  
S. Kirchner ◽  
O. Kraft ◽  
S. P. Baker ◽  
E. Arzt
Keyword(s):  
Mechanical Properties ◽  
Large Scale ◽  
X Ray Diffraction ◽  
Film Properties ◽  
Transmission Electron ◽  
First Results ◽  
Large Scale Integration ◽  
Scale Integration ◽  
Kinetics Of ◽  
Precipitate Structure

AbstractThe mechanical properties are thought to play an important role in the performance of metallization materials for very large scale integration (VLSI) applications. From recent investigations on bulk materials it is known that Al-Si-Ge alloys can be very efficiently strengthened with only a small amount of the alloying elements. These alloys are potential candidates for future metallizations both because Si and Ge are compatible with the existing semiconductor technology, and because the resistivity is expected to be low.We present the first results of detailed characterizations of Al-Si-Ge thin films as a function of sputter conditions and heat treatments. The microstructure was characterized using x-ray diffraction and transmission electron microscopy. The kinetics of precipitation were studied using resistance measurements. Room temperature hardness was investigated using nanoindentation, and the mechanical properties at temperatures up to 240°C were examined using a substrate curvature method. The correlation between precipitate structure and film properties is discussed.

Comparative Study of Low Dielectric Constant Material Deposited Using Different Precursors

2011 ◽  
Vol 233-235 ◽  
pp. 2480-2485
Author(s):  
Yi Lung Cheng ◽  
Yi Shiung Lu ◽  
Tai Jung Chiu
Keyword(s):  
Thermal Stability ◽  
Vapor Deposition ◽  
Large Scale ◽  
Dielectric Material ◽  
Chemical Vapor ◽  
Electrical Performance ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Large Scale Integration ◽  
Scale Integration

Two kinds of organosilicate precursors, trimethylsilane (3MS) and diethoxymethylsilane (DEMS), were used to produce low-k films by plasma-enhanced chemical vapor deposition (PECVD) in this work. The experimental results indicate that DEMS-based low-k films have superior electrical performance and better thermal stability as compared to 3MS-based low-k films. Therefore, DEMS-based films are the promising low-k materials which can be integrated in very large scale integration circuit as an inter-layer dielectric material.

An Interesting Result of Dielectric Property for Novel Polyimides with Fluorene Groups

2010 ◽  
Vol 663-665 ◽  
pp. 511-514 ◽  
Author(s):  
Yuan Yuan ◽  
Bing Xie ◽  
Yu Wang
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Dielectric Property ◽  
Dielectric Constants ◽  
The Other ◽  
Polyimide Films ◽  
Low Dielectric ◽  
High Dielectric ◽  
Biphenyltetracarboxylic Dianhydride

A series of polyimide thin films were prepared successfully based on bis[3,5-dimethyl-4- (4-aminophenoxy)phenyl]methane （BDAPM）, 9,9-bis（4-（4-aminophenoxy）phenyl）fluorene (BAOFL) and different dianhydrides. And an interesting result of dielectric property for polyimide thin films was found that the polyimide thin film prepared with 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) exhibited high dielectric constants of 5.7 at 1MHz. Conversely, the other polyimides possessing fluorene groups showed low dielectric constants. The structures and the mechanical properties of polyimide films also proved the reason for results of dielectric properties.

Simulation of Electroless Deposition of Cu Thin Films for Very Large Scale Integration Metallization

1997 ◽  
Vol 144 (6) ◽  
pp. 2115-2122 ◽  
Author(s):  
T. Smy ◽  
L. Tan ◽  
S. K. Dew ◽  
M. J. Brett ◽  
Y. Shacham‐Diamand ◽  
...  
Keyword(s):  
Thin Films ◽  
Large Scale ◽  
Electroless Deposition ◽  
Very Large Scale Integration ◽  
Large Scale Integration ◽  
Scale Integration

Plant hormones, plant growth regulators

2014 ◽  
Vol 155 (26) ◽  
pp. 1011-1018 ◽  
Author(s):  
György Végvári ◽  
Edina Vidéki
Keyword(s):  
Nervous System ◽  
Growth And Development ◽  
Large Scale ◽  
Essential Role ◽  
Higher Plants ◽  
Structure And Function ◽  
Wide Sense ◽  
Large Scale Integration ◽  
Scale Integration ◽  
And Function

Plants seem to be rather defenceless, they are unable to do motion, have no nervous system or immune system unlike animals. Besides this, plants do have hormones, though these substances are produced not in glands. In view of their complexity they lagged behind animals, however, plant organisms show large scale integration in their structure and function. In higher plants, such as in animals, the intercellular communication is fulfilled through chemical messengers. These specific compounds in plants are called phytohormones, or in a wide sense, bioregulators. Even a small quantity of these endogenous organic compounds are able to regulate the operation, growth and development of higher plants, and keep the connection between cells, tissues and synergy beween organs. Since they do not have nervous and immume systems, phytohormones play essential role in plants’ life. Orv. Hetil., 2014, 155(26), 1011–1018.

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