scholarly journals A Self-Consistent Scheme for Understanding Particle Impact and Adhesion in the Aerosol Deposition Process

2021 ◽  
Vol 30 (3) ◽  
pp. 523-541
Author(s):  
Robert Saunders ◽  
Scooter D. Johnson ◽  
Douglas Schwer ◽  
Eric A. Patterson ◽  
Heonjune Ryou ◽  
...  
Keyword(s):  
Process Parameters ◽  
Aerosol Deposition ◽  
Deposition Process ◽  
Deposition Efficiency ◽  
Film Deposition ◽  
Particle Impact ◽  
Fe Modeling ◽  
Sem Images ◽  
Self Consistent ◽  
Particle Parameters

AbstractAerosol deposition (AD) is a thick-film deposition process that can produce films tens to hundreds of micrometers thick with densities greater than 95% of the bulk at room temperature. However, the precise mechanisms of bonding and densification are still under debate. To better understand and predict deposition, a self-consistent approach is employed that combines computational fluid dynamics (CFD), finite element (FE) modeling, and experimental observation of particle impact to improve the understanding of particle flight, impact, and adhesion in the AD process. First, deposition is performed with a trial material to form a film. The process parameters are fed into a CFD model that refines the particle flow and impact velocity for a range of sizes. These values are in turn used to inform the FE parameters to model the fracture and adhesion of the particle on the substrate. The results of FE modeling are compared to SEM images of fractured particles to complete a self-consistent numerical and experimental understanding of the AD process. Additional FE and CFD simulations are used to study how process parameters, materials, and particle parameters affect the deposition process and how the developed tools can be used to optimize deposition efficiency.

scholarly journals Plasma and BIAS Modeling: Self-Consistent Electrostatic Particle-in-Cell with Low-Density Argon Plasma for TiC

2011 ◽  
Vol 2011 ◽  
pp. 1-13
Author(s):  
Jürgen Geiser ◽  
Sven Blankenburg
Keyword(s):  
Physical Vapor Deposition ◽  
Cell Model ◽  
Finite Size ◽  
Argon Plasma ◽  
Thin Film Deposition ◽  
Deposition Process ◽  
Film Deposition ◽  
Low Density ◽  
Particle In Cell ◽  
Self Consistent

We motivate our study by simulating the particle transport of a thin film deposition process done by PVD (physical vapor deposition) processes. In this paper we present a new model taken into account a self-consistent electrostatic-particle in cell model with low density Argon plasma. The collision model are based of Monte Carlo simulations is discussed for DC sputtering in lower pressure regimes. In order to simulate transport phenomena within sputtering processes realistically, a spatial and temporal knowledge of the plasma density and electrostatic field configuration is needed. Due to relatively low plasma densities, continuum fluid equations are not applicable. We propose instead a Particle-in-cell (PIC) method, which allows the study of plasma behavior by computing the trajectories of finite-size particles under the action of an external and self-consistent electric field defined in a grid of points.

The Study on Preparation Process Optimization of Ceramic Membrane Layer

2012 ◽  
Vol 217-219 ◽  
pp. 1230-1234
Author(s):  
Long Lu ◽  
Guang Guang Feng
Keyword(s):  
Thin Film ◽  
Process Optimization ◽  
Process Parameters ◽  
Thin Film Deposition ◽  
Deposition Process ◽  
Film Deposition ◽  
Orthogonal Experimental Design ◽  
Arc Ion Plating ◽  
Membrane Layer ◽  
Ion Plating

The process of ion nitriding and multi-arc ion plating compound preparation Ti0.33Al0.67N membrane layer, it is the hot research spot of coating technology at present. Under the premise of this process, how to get better performance of thin-film coatings is the focus of research. Based on thin film deposition process parameters by orthogonal experimental design, an appropriate test process has been developed. Micro-hardness instrument is applied to test the surface hardness of the film and the droplet, By using scratch method to test the adhesion of coatings, analyzing the effect of a negative bias of substrate and nitrogen partial pressure, alloy target current process parameters on surface morphology of films, film thickness, adhesion and hardness has concluded the optimal process parameters. The results show, the thickness of the (Ti, Al) N super hard film that deposited by multi-arc ion plating technology is about 2.7 microns, through the deposition process optimization can achieve a high level of hardness (HV > 2600) and strong adhesion strength (>35 N).

Hybrid Aerosol Deposition Process for Ceramic Coatings

2018 ◽  
Vol 87 (2) ◽  
pp. 136-143 ◽  
Author(s):  
Kentaro SHINODA ◽  
Takanori SAEKI ◽  
Jun AKEDO
Keyword(s):  
Aerosol Deposition ◽  
Deposition Process ◽  
Ceramic Coatings

scholarly journals Piezoelectric Thick Film Deposition via Powder/Granule Spray in Vacuum: A Review

Actuators ◽  
2020 ◽  
Vol 9 (3) ◽  
pp. 59
Author(s):  
Deepak Rajaram Patil ◽  
Venkateswarlu Annapureddy ◽  
J. Kaarthik ◽  
Atul Thakre ◽  
Jun Akedo ◽  
...  
Keyword(s):  
Thick Film ◽  
Thick Films ◽  
Cost Effective ◽  
Aerosol Deposition ◽  
Ceramic Coatings ◽  
Film Deposition ◽  
Energy Harvesters ◽  
Ceramic Films ◽  
Dense Ceramic ◽  
Processing Techniques

Conventional thin-film processing techniques remain inadequate for obtaining superior dense ceramic thick films. The incompatibility of ceramic films prepared via other methods, such as screen printing, spin coating, and sputtering, is a major obstacle in the fabrication of thick film-based ceramic electronic components. The granule spray in vacuum (GSV) processes and aerosol deposition (AD) are important coating approaches for forming dense ceramic thick films featuring nanoscale crystallite structures at room temperature, which offer excellent material properties and facilitate cost-effective production. AD ceramic coatings require the acceleration of solid-state submicron ceramic particles via gas streams with a velocity of a few hundred meters per second, which are then wedged onto a substrate. This process is economical and particularly useful for the fabrication of piezoelectric thick film-based microactuators, energy harvesters, sensors, and optoelectronic devices. More recently, the GSV technique was improved to achieve more uniform and homogeneous film deposition after AD. This review article presents a detailed overview of the AD and GSV processes for piezoelectric thick films in terms of recent scientific and technological applications.

scholarly journals Analysis of the Process Parameter Influence in Laser Cladding of 316L Stainless Steel

2018 ◽  
Vol 2 (3) ◽  
pp. 55 ◽  
Author(s):  
Piera Alvarez ◽  
M. Montealegre ◽  
Jose Pulido-Jiménez ◽  
Jon Arrizubieta
Keyword(s):  
Stainless Steel ◽  
Laser Cladding ◽  
Process Parameters ◽  
Cross Sections ◽  
316L Stainless Steel ◽  
Deposition Process ◽  
Process Parameter ◽  
Optimum Process ◽  
Processing Times ◽  
Manufacturing Technologies

Laser Cladding is one of the leading processes within Additive Manufacturing technologies, which has concentrated a considerable amount of effort on its development. In regard to the latter, the current study aims to summarize the influence of the most relevant process parameters in the laser cladding processing of single and compound volumes (solid forms) made from AISI 316L stainless steel powders and using a coaxial nozzle for their deposition. Process speed, applied laser power and powder flow are considered to be the main variables affecting the laser cladding in single clads, whereas overlap percentage and overlapping strategy also become relevant when dealing with multiple clads. By setting appropriate values for each process parameter, the main goal of this paper is to develop a processing window in which a good metallurgical bond between the delivered powder and the substrate is obtained, trying simultaneously to maintain processing times at their lowest value possible. Conventional metallography techniques were performed on the cross sections of the laser tracks to measure the effective dimensions of clads, height and width, as well as the resulting dilution value. Besides the influence of the overlap between contiguous clads and layers, physical defects such as porosity and cracks were also evaluated. Optimum process parameters to maximize productivity were defined as 13 mm/s, 2500 W, 30% of overlap and a 25 g/min powder feed rate.

Development of Thin Metal Film Deposition Process for the Intravascular Catheter

1999 ◽  
Author(s):  
Seok Chung ◽  
Jun Keun Chang ◽  
Dong Chul Han
Keyword(s):  
Metal Film ◽  
Three Dimensional ◽  
Deposition Process ◽  
Medical Application ◽  
Thin Metal Film ◽  
Film Deposition ◽  
Thin Metal ◽  
Mems Devices ◽  
Sensors And Actuators ◽  
Custom Made

Abstract To make some MF.MS devices such as sensors and actuators be useful in the medical application, it is required to integrate this devices with power or sensor lines and to keep the hole devices biocompatible. Integrating micro machined sensors and actuators with conventional copper lines is incompatible because the thin copper lines are not easy to handle in the mass production. To achieve the compatibility of wiring method between MEMS devices, we developed the thin metal film deposition process that coats micropattered thin copper films on the non silicon-wafer substrate. The process was developed with the custom-made three-dimensional thin film sputter/evaporation system. The system consists of process chamber, two branch chambers, substrate holder unit and linear/rotary motion feedthrough. Thin metal film was deposited on the biocompatible polymer, polyurethane (PellethaneR) and silicone, catheter that is 2 mm in diameter and 1,000 mm in length. We deposited Cr/Cu and Ti/Cu layer and made a comparative study of the deposition processes, sputtering and evaporation. The temperature of both the processes were maintained below 100°C, for the catheter not melting during the processes. To use the films as signal lines connect the signal source to the actuator on the catheter tip, we machined the films into desired patterns with the eximer laser. In this paper, we developed the thin metal film deposition system and processes for the biopolymeric substrate used in the medical MEMS devices.

MODELLING COMPACTION BEHAVIOR OF TOUGHENED PREPREG DURING AUTOMATED FIBRE PLACEMENT

2021 ◽  
Author(s):  
SARTHAK MAHAPATRA SARTHAK MAHAPATRA ◽  
JONATHAN BELNOUE ◽  
JAMES KRATZ ◽  
DMITRY S. IVANOV ◽  
STEPHEN R. HALLETT
Keyword(s):  
Process Parameters ◽  
Mechanical Model ◽  
Numerical Models ◽  
Deposition Process ◽  
Roller Compaction ◽  
Manufacturing Processes ◽  
Automated Manufacturing ◽  
Trial And Error ◽  
Compaction Behavior ◽  
Statistical Relationships

One of the most widely used automated manufacturing processes for composite parts is automated fibre placement (AFP). The deposition process involves the simultaneous warming, lay-up and consolidation of prepreg consisting of multitude of process parameters. Currently, AFP process parameters that ensure part conformance are derived by expensive and time-consuming trial-and-error approaches. The aim of this study is to demonstrate how physics-based finite element simulations that can predict the as manufactured geometry of a preform deposited by AFP can help reduce some of the empiricism associated with current industry practices. Here we particularly focus on the consolidation behaviour of toughened prepregs during the deposition process. An isothermal roller compaction model with thermal properties derived from an independent simplified thermo-mechanical model of the AFP head is used. Additionally, a fully characterised viscoelastic material definition is used for the prepreg tape along with a hyperelastic material for the compaction roller to accurately represent the physical parts. Various lay-up speeds, heater powers and compaction forces are simulated. To reduce the empiricism present in the manufacturing process, the viability of incorporating the numerical models into existing statistical relationships between process parameters and manufactured geometry is examined.

Research on Deposition of Micro-Nano Aerosols in Rising Bubble Under Pool Scrubbing Condition

2018 ◽  
Author(s):  
Yanmin Zhou ◽  
Haifeng Gu ◽  
Qiunan Sun ◽  
Zhongning Sun ◽  
Jiqiang Su ◽  
...  
Keyword(s):  
Flow Rate ◽  
Gas Flow ◽  
Bubbly Flow ◽  
Aerosol Deposition ◽  
Deposition Efficiency ◽  
Filtration Efficiency ◽  
Liquid Level ◽  
Gas Flow Rate ◽  
Reactor Accident ◽  
Rising Bubble

Aerosols as the main component of radioactive products in migration performance, which is an important factor that a unclear reactor accident present strong diffusion and affects the distributions of source and dose level in reactor containment, and they are therefore expected to be deposited in liquid phase such as in suspension pool and filtered containment venting device. In this paper, the deposition characteristics of micro-nano aerosols in rising bubble under pool scrubbing condition is studied with experiment, the aerosols size in the research range from 20 nm to 600 nm, and the bubble morphology mainly concern homogeneous bubbly flow. The results show that the deposition efficiency and mechanism of aerosol closely relate to gas flow rate, liquid level, particle size and bubbles size and so on. The aerosol deposition near 85nm is proved most difficult because of the convert of deposition mechanisms. In a high liquid level condition, micro-nano aerosol filtration efficiency is enhanced but gradually gradual. Under different gas flow rate, air bubble residence time and the bubble size distributions affect the filtration efficiency of aerosols.

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