Physical Evidence of Airbag Performance in a High-Speed Frontal Crash

2021 ◽  
Vol 22 (4) ◽  
pp. 1109-1118
Author(s):  
Sung-Woo Koh ◽  
Jingwen Hu
Keyword(s):  
High Speed ◽  
Frontal Crash ◽  
Physical Evidence

Full Frontal Crashworthiness of Carbon Fiber Composite Front Bumper Crush Can (FBCC) Structures

2017 ◽  
Author(s):  
Y. Dixit ◽  
P. Begeman ◽  
G. S. Dhaliwal ◽  
G. Newaz ◽  
D. Board ◽  
...  
Keyword(s):  
Carbon Fiber ◽  
High Speed ◽  
Fiber Composite ◽  
Video Tracking ◽  
Carbon Fiber Composite ◽  
Component Level ◽  
Frontal Crash ◽  
Impact Performance ◽  
Testing Method ◽  
The Impact

This research study highlights the testing method and relevant results for assessing impact performance of a carbon fiber composite front bumper crush can (FBCC) assembly subjected to full frontal crash loading. It becomes extremely important to study the behavior of lightweight composite components under a crash scenario in order to apply them to automotive structures to reduce the overall weight of the vehicle. Computer-aided engineering (CAE) models are extremely important tools to virtually validate the physical testing by assessing the performances of these structures. Due to lack of available studies on carbon fiber composite FBCCs assemblies under the frontal crash scenario, a new component-level test approach would provide assistance to CAE models and better correlation between results can be made. In this study, all the tests were performed by utilizing a sled-on-sled testing method. An extreme care was taken to ensure that there is no bottoming-out force for this type of test while adjusting the impact speed of sled. Full frontal tests on FBCC structures were conducted by utilizing five high-speed cameras (HSCs), several accelerometers and a load wall. Excellent correlation was achieved between video tracking and accelerometers results for time histories of displacement and velocity. The standard deviation and coefficient of variance for the energy absorbed were very low suggesting the repeatability of the full frontal tests. The impact histories of FBCC specimens were consistent and in excellent agreement with respect to each other. Post-impact photographs showed the consistent crushing of composite crush cans and breakage of the bumper beam from middle due to the production of tensile stresses stretched caused by straightening of the bumper curvature after hitting the load wall.

Frontal Crash Characteristics of Compact Car at a High Speed Collision

1998 ◽  
Author(s):  
Kazunari Mogami ◽  
Kenshi Fujiwara ◽  
Hiroki Yamamoto ◽  
Yasumi Itho ◽  
Masami Kubota ◽  
...  
Keyword(s):  
High Speed ◽  
Frontal Crash ◽  
High Speed Collision ◽  
Crash Characteristics

Analysis of a Real-World High-Speed Rollover Crash from a Video Record and Physical Evidence

2008 ◽  
Author(s):  
J. D. Anderson ◽  
R. S. Gee ◽  
G. J. Germane ◽  
K. C. Henry ◽  
S. DiBiase ◽  
...  
Keyword(s):  
Real World ◽  
High Speed ◽  
Physical Evidence ◽  
Video Record ◽  
Rollover Crash

Microfabrication research at the National Submicron Facility

1983 ◽  
Vol 41 ◽  
pp. 86-89
Author(s):  
E.D. Wolf
Keyword(s):  
Integrated Circuits ◽  
Particle Physics ◽  
High Speed ◽  
New Technology ◽  
High Energy ◽  
High Energy Particle ◽  
New Science ◽  
Wide Range ◽  
Intermediate Domain ◽  
Circuit Function

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.

Vacuum System to Minimize the Specimen Contamination of High-Performance EM

1977 ◽  
Vol 35 ◽  
pp. 68-69
Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh
Keyword(s):  
Electron Microscope ◽  
High Speed ◽  
High Performance ◽  
High Vacuum ◽  
Vacuum System ◽  
Pump System ◽  
Pumping System ◽  
Diffusion Pump ◽  
Almost All ◽  
Cascade Type

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.

Use of SEM, X-ray analysis and TEM to localize Fe3+ reduction in roots

1988 ◽  
Vol 46 ◽  
pp. 392-393 ◽  
Author(s):  
William P. Wergin ◽  
P. F. Bell ◽  
Rufus L. Chaney
Keyword(s):  
Electron Microscopy ◽  
Root Hairs ◽  
Rapid Reduction ◽  
X Ray ◽  
Physical Evidence ◽  
Transmission Electron ◽  
Young Root ◽  
Insoluble Precipitate ◽  
Uptake And Transport ◽  
Scanning Electron

In dicotyledons, Fe3+ must be reduced to Fe2+ before uptake and transport of this essential macronutrient can occur. Ambler et al demonstrated that reduction along the root could be observed by the formation of a stain, Prussian blue (PB), Fe4 [Fe(CN)6]3 n H2O (where n = 14-16). This stain, which is an insoluble precipitate, forms at the reduction site when the nutrient solution contains Fe3+ and ferricyanide. In 1972, Chaney et al proposed a model which suggested that the Fe3+ reduction site occurred outside the cell membrane; however, no physical evidence to support the model was presented at that time. A more recent study using the PB stain indicates that rapid reduction of Fe3+ occurs in a region of the root containing young root hairs. Furthermore the most pronounced activity occurs in plants that are deficient in Fe. To more precisely localize the site of Fe3+ reduction, scanning electron microscopy (SEM), x-ray analysis, and transmission electron microscopy (TEM) were utilized to examine the distribution of the PB precipitate that was induced to form in roots.

The on-line use of histogram data for high-speed correction and alignment of electron microscope images

1984 ◽  
Vol 42 ◽  
pp. 556-557
Author(s):  
William Krakow
Keyword(s):  
Power Spectrum ◽  
High Speed ◽  
Direct Memory Access ◽  
Digital Television ◽  
Contrast Transfer Function ◽  
The Past ◽  
High Resolution Tem ◽  
On Line ◽  
Correction Of Astigmatism ◽  
The Fourier Transform

In the past few years on-line digital television frame store devices coupled to computers have been employed to attempt to measure the microscope parameters of defocus and astigmatism. The ultimate goal of such tasks is to fully adjust the operating parameters of the microscope and obtain an optimum image for viewing in terms of its information content. The initial approach to this problem, for high resolution TEM imaging, was to obtain the power spectrum from the Fourier transform of an image, find the contrast transfer function oscillation maxima, and subsequently correct the image. This technique requires a fast computer, a direct memory access device and even an array processor to accomplish these tasks on limited size arrays in a few seconds per image. It is not clear that the power spectrum could be used for more than defocus correction since the correction of astigmatism is a formidable problem of pattern recognition.

Structural changes in silicon-on-insulator material during post-implantation annealing

1986 ◽  
Vol 44 ◽  
pp. 736-737
Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson
Keyword(s):  
Integrated Circuits ◽  
Oxide Layer ◽  
High Speed ◽  
Structural Changes ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Quality ◽  
Radiation Hardened ◽  
Post Implantation ◽  
Very High

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.

An atomic-resolution microscope study of Al contracts on GaAs

1986 ◽  
Vol 44 ◽  
pp. 726-727
Author(s):  
Z. Liliental-Weber ◽  
C. Nelson ◽  
R. Ludeke ◽  
R. Gronsky ◽  
J. Washburn
Keyword(s):  
High Speed ◽  
Schottky Contacts ◽  
Detailed Knowledge ◽  
The Past ◽  
Semiconductor Interfaces ◽  
Deposited Metal ◽  
Microwave Applications ◽  
Free Interfaces ◽  
Potential Use

The properties of metal/semiconductor interfaces have received considerable attention over the past few years, and the Al/GaAs system is of special interest because of its potential use in high-speed logic integrated optics, and microwave applications. For such materials a detailed knowledge of the geometric and electronic structure of the interface is fundamental to an understanding of the electrical properties of the contact. It is well known that the properties of Schottky contacts are established within a few atomic layers of the deposited metal. Therefore surface contamination can play a significant role. A method for fabricating contamination-free interfaces is absolutely necessary for reproducible properties, and molecularbeam epitaxy (MBE) offers such advantages for in-situ metal deposition under UHV conditions

Sign in / Sign up

Export Citation Format

Share Document