Reducing p-type Schottky contact barrier in metal/ZnO heterostructure through Ni-doping

2021 ◽  
Vol 545 ◽  
pp. 149023
Author(s):  
A. El Haimeur ◽  
A. Slassi ◽  
A. Pershin ◽  
D. Cornil ◽  
M. Makha ◽  
...  
1989 ◽  
Vol 48 (4) ◽  
pp. 391-395 ◽  
Author(s):  
G. A. Adegboyega ◽  
A. Poggi ◽  
E. Susi ◽  
A. Castaldini ◽  
A. Cavallini

2007 ◽  
Vol 101 (5) ◽  
pp. 053705 ◽  
Author(s):  
Yu-Long Jiang ◽  
Jia Luo ◽  
Ye Yao ◽  
Fang Lu ◽  
Guo-Ping Ru ◽  
...  

2013 ◽  
Author(s):  
L. Dasaradha Rao ◽  
N. Ramesha Reddy ◽  
A. Ashok Kumar ◽  
V. Rajagopal Reddy

2011 ◽  
Vol 679-680 ◽  
pp. 613-616 ◽  
Author(s):  
Konstantinos Rogdakis ◽  
Edwige Bano ◽  
Laurent Montes ◽  
Mikhael Bechelany ◽  
David Cornu ◽  
...  

Back-gated field effect transistors (FETs) based on catalyst-free grown 3C-SiC nanowire (NW) were fabricated. Devices with rectifying Source (S) and Drain (D) contacts have been observed. In contrast with the ohmic-like devices reported in the literature, the Schottky contact barrier (SB) at S/ D regions acts beneficially for the FET performance by suppressing the off-current. At high positive gate voltages (>10 V), the Schottky barriers tend to be more transparent leading to ION/IOFF ratio equal to ~ 103 in contrast to the weak gating effect of the ohmic-contacted 3C-SiC NWFETs.


2019 ◽  
Vol 963 ◽  
pp. 553-557
Author(s):  
Yaren Huang ◽  
Jonas Buettner ◽  
Benedikt Lechner ◽  
Gerhard Wachutka

The wide band gap of SiC semiconductor devices constitutes a serious challenge to build good Ohmic contacts on the surface of the p-type material. This is reflected in the numerical analysis of ”realistic” devices, where we have to cope with serious problems, such as a shifting threshold voltage, reduced forward conductivity, and no noticeable conductivity modulation by minority carrier injection from p+-emitters, in matching measured data with simulation results, as a consequence of the significant impact of non-ideal poor Ohmic contacts. In this work, we used a Schottky contact model together with a barrier tunneling model, instead of common ideal Ohmic contact model, to simulate the non-ideal Ohmic contact on SiC MPS diodes. Based on this approach, the I-V characteristics of real Ohmic contacts can be reproduced in high-fidelity simulations, providing us physical insight of the observed operational behavior.


Author(s):  
Changkun Zeng ◽  
Weizong Xu ◽  
Yuanyang Xia ◽  
Ke Wang ◽  
Fangfang Ren ◽  
...  

Abstract Narrow gate margin has been the critical limiting factor for the p-gate normally-off GaN HEMTs, imposing significant challenges in both gate-drive design and gate reliability. In this work, by developing dopant-free p-type polarization doping technique in composition-graded InGaN layer, high-quality Schottky contact between the gate metal and cap layer was demonstrated, achieving excellent gate current blocking performance (10-6 mA/mm) after the turning-on of the gate heterojunction structure. Resultantly, normally-off GaN HEMTs with enhanced gate breakdown voltage up to 15.2 V was realized, being especially beneficial for the simplification of gate drive design and the safe operation of gate terminal.


2013 ◽  
Vol 740-742 ◽  
pp. 1111-1114 ◽  
Author(s):  
Ji Sheng Han ◽  
Philip Tanner ◽  
Sima Dimitrijev ◽  
Qu Shuang ◽  
Yan Shen ◽  
...  

In this work, we studied the effect of surface preparation and substrate temperature during sputter deposition of Schottky contacts on N-GaN/SiC/Si substrates, looking at parameters such as on-resistance, reverse leakage, and contact barrier height. Ti, Ni and Mo were sputtered to form the contacts, and we characterized the I-V curves with the different substrate temperatures during the sputtering as shown in Figure 1. For the Ti Schottky contact, the substrate temperature of 100oC during the sputtering demonstrates the minimum series resistance with Rs about 0.04cm2, while temperatures greater than 3000C increased reverse bias leakage. The Mott-Schottky plot reveals a barrier height of 1.2V for this contact. Results for sputtered Ni contacts using different substrate temperatures will also be presented, as well as the effect of Ar sputter cleaning before contact deposition.


2015 ◽  
Vol 1109 ◽  
pp. 153-157 ◽  
Author(s):  
A.K.M. Muaz ◽  
U. Hashim ◽  
Sharipah Nadzirah ◽  
M. Wesam Al-Mufti ◽  
Fatimah Ibrahim ◽  
...  

Titanium dioxide (TiO2) thin films were successfully prepared using the use of titanium isopropoxide as a precursor with an ethyl alcohol solution at a molar ratio 1.0:10 by sol-gel precipitation method at room temperature (~24°C). The gel solution was formed after mixed for different times. TiO2thin films were deposited on the P-type <100> silicon substrates by spin coating technique. In this paper, we report the comparison between conductivity and resistivity of TiO2thin films prepared at different heat treatment. The results show that the electrical properties of TiO2thin film were changed with the changes of heat treatment. The results exhibit that the resistance tends to decline as the annealing temperature increases. The most conductive sample is 700°C followed with 500°C, 300°C, 100°C and least conductive is as-deposited film. From the I-V curve, the graph giving a Schottky contact properties.


2002 ◽  
Vol 126 (2-3) ◽  
pp. 213-218 ◽  
Author(s):  
M. Çakar ◽  
Y. Onganer ◽  
A. Türüt

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