Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing

AlN and TiN thin films are widely used in electronic devices and acoustic material and other fields because of its unique merit, the preparation of nitride thin films by using the arc ion plating has not been a systematic and deep study. The article presents our research procedure which the AlN and TiN thin films are deposited on stainless steel substrate by arc ion plating (AIP). The characteristics of thin films, for example microstructure, morphology, composition analysis and hardness, are examined and analyzed. The results showed that: Droplet-like particles appear in the microstructure of nitride thin films, and the grain size of droplet-like particles in AlN thin films is greater than in TiN thin films. The micro-hardness of nitride films preparation in experiment has improved significantly, and establish firmly basic for extending the application field of nitride film.

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Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Materials ◽

10.3390/ma14040776 ◽

2021 ◽

Vol 14 (4) ◽

pp. 776

Author(s):

Nur Syahirah Mohamad Zaimi ◽

Mohd Arif Anuar Mohd Salleh ◽

Andrei Victor Sandu ◽

Mohd Mustafa Al Bakri Abdullah ◽

Norainiza Saud ◽

...

Keyword(s):

Shear Strength ◽

Composite Solder ◽

Printed Circuit Board ◽

Microwave Sintering ◽

Copper Substrate ◽

Bulk Diffusion ◽

Circuit Board ◽

Sac305 Solder ◽

Lap Shear ◽

Isothermal Ageing

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

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Effect of NH3 flow on electrical and mechanical properties of ALD TiN thin films

Materials Letters ◽

10.1016/j.matlet.2021.129554 ◽

2021 ◽

Vol 291 ◽

pp. 129554

Author(s):

Hyunchol Cho ◽

Ben Nie ◽

Ajit Dhamdhere ◽

Yifei Meng ◽

Monica Neuburger ◽

...

Keyword(s):

Thin Films ◽

Mechanical Properties ◽

Tin Thin Films

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Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate

Materials Research Express ◽

10.1088/2053-1591/ab155f ◽

2019 ◽

Vol 6 (7) ◽

pp. 076306 ◽

Cited By ~ 1

Author(s):

Nifa Bao ◽

Xiaowu Hu ◽

Qinglin Li

Keyword(s):

Intermetallic Compound ◽

Growth Behavior ◽

Interfacial Reactions ◽

Interfacial Intermetallic Compound ◽

Sn37pb Solder

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LiNiO2 Thin Films Fabricated by Diffusion of Li on Ni Tapes

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.336-338.505 ◽

2007 ◽

Vol 336-338 ◽

pp. 505-508

Author(s):

Cheol Jin Kim ◽

In Sup Ahn ◽

Kwon Koo Cho ◽

Sung Gap Lee ◽

Jun Ki Chung

Keyword(s):

Thin Films ◽

Heat Treatment ◽

Grain Size ◽

Sol Gel ◽

Surface Oxidation ◽

Cold Isostatic Pressing ◽

Tube Furnace ◽

Treatment Conditions ◽

Average Grain Size ◽

Cold Rolling And Annealing

LiNiO2 thin films for the application of cathode of the rechargeable battery were fabricated by Li ion diffusion on the surface oxidized NiO layer. Bi-axially textured Ni-tapes with 50 ~ 80 μm thickness were fabricated using cold rolling and annealing of Ni-rod prepared by cold isostatic pressing of Ni powder. Surface oxidation of Ni-tapes were conducted using tube furnace or line-focused infrared heater at 700 °C for 150 sec in flowing oxygen atmosphere, resulted in NiO layer with thickness of 400 and 800 μm, respectively. After Li was deposited on the NiO layer by thermal evaporation, LiNiO2 was formed by Li diffusion through the NiO layer during subsequent heat treatment using IR heater with various heat treatment conditions. IR-heating resulted in the smoother surface and finer grain size of NiO and LiNiO2 layer compared to the tube-furnace heating. The average grain size of LiNiO2 layer was 0.5~1 μm, which is much smaller than that of sol-gel processed LiNiO2. The reacted LiNiO2 region showed homogeneous composition throughout the thickness and did not show any noticeable defects frequently found in the solid state reacted LiNiO2, but crack and delamination between the reacted LiNiO2 and Ni occurred as the reaction time increased above 4hrs.

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