Perspectives and recent innovations on white cheese produced by conventional methods or ultrafiltration technique – A review

2021 ◽  
pp. 105232
Author(s):  
M. Soltani ◽  
S. Saremnezhad ◽  
A. Faraji ◽  
A.A. Hayaloglu
Keyword(s):  
White Cheese ◽  
Conventional Methods

Spin-polarized Scanning Electron Microscopy

1990 ◽  
Vol 48 (4) ◽  
pp. 768-769
Author(s):  
Kazuyuki Koike ◽  
Hideo Matsuyama
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
High Speed ◽  
Magnetic Thin Films ◽  
Electron Spin Polarization ◽  
Acquisition Time ◽  
Magnetization Direction ◽  
Spin Polarized ◽  
Conventional Methods ◽  
Scanning Electron

Spin-polarized scanning electron microscopy (spin SEM), where the secondary electron spin polarization is used as the image signal, is a novel technique for magnetic domain observation. Since its first development by Koike and Hayakawa in 1984, several laboratories have extensively studied this technique and have greatly improved its capability for data extraction and its range of applications. This paper reviews the progress over the last few years.Almost all the high expectations initially held for spin SEM have been realized. A spatial resolution of several hundreds angstroms has been attained, which is nearly one order of magnitude higher than that of conventional methods for thick samples. Quantitative analysis of magnetization direction has been performed more easily than with conventional methods. Domain observation of the surface of three-dimensional samples has been confirmed to be possible. One of the drawbacks, a long image acquisition time, has been eased by combining highspeed image-signal processing with high speed scanning, although at the cost of image quality. By using spin SEM, the magnetic structure of a 180 degrees surface Neel wall, magnetic thin films, multilayered films, magnetic discs, etc., have been investigated.

The Need Inventory of Sensation Seeking (NISS)

2012 ◽  
Vol 28 (1) ◽  
pp. 11-18 ◽  
Author(s):  
Marcus Roth ◽  
Philipp Hammelstein
Keyword(s):  
Sensation Seeking ◽  
Reliability And Validity ◽  
Assessment Method ◽  
Factorial Structure ◽  
Conventional Methods ◽  
New Research ◽  
Sensation Seeking Scale ◽  
Temperamental Trait ◽  
Nonclinical Study

Based on the conception of sensation seeking as a need rather than a temperamental trait ( Hammelstein, 2004 ), we present a new assessment method, the Need Inventory of Sensation Seeking (NISS), which is considered to assess a motivational disposition. Three studies are presented: The first examined the factorial structure and the reliability of the German versions of the NISS; the second study compared the German and the English versions of the NISS; and finally, the validity of the NISS was examined in a nonclinical study and compared to the validity of conventional methods of assessing sensation seeking (Sensation Seeking Scale – Form V; SSS-V). Compared to the SSS-V, the NISS shows better reliability and validity in addition to providing new research possibilities including application in experimental areas.

Eco-Friendly Synthesis of Pyrazoline Derivatives

2017 ◽  
Vol 9 (04) ◽  
Author(s):  
Mahesh G. Kharatmol ◽  
Deepali Jagdale
Keyword(s):  
Ionic Liquids ◽  
Microwave Irradiation ◽  
Organic Synthesis ◽  
Ultrasonic Irradiation ◽  
Minimal Energy ◽  
Anticancer Activities ◽  
Conventional Methods

Pyrazoline class of compounds serve as better moieties for an array of treatments, they have antibacterial, antifungal, antiinflammatory, antipyretic, diuretic, cardiovascular activities. Apart from these they also have anticancer activities. So, pertaining to its importance, many attempts are made to synthesize pyrazolines. Since conventional methods of organic synthesis are energy and time consuming. There are elaborate pathways for green and eco-friendly synthesis of pyrazoline derivatives including microwave irradiation, ultrasonic irradiation, grinding and use of ionic liquids which assures the synthesis of the same within much lesser time and by use of minimal energy

Estimation of Aflatoxin M1 Levels in Some Dairy Products Manufactured from Raw Milk Experimentally Inoculated with Toxin

2019 ◽  
Vol 43 (1) ◽  
pp. 50-58
Author(s):  
H. S. Alnaemi
Keyword(s):  
Dairy Products ◽  
Raw Milk ◽  
Aflatoxin M1 ◽  
Consumer Health ◽  
Goat’S Milk ◽  
White Cheese ◽  
Elisa Technique ◽  
Permissible Levels ◽  
Goat's Milk

     Fate of AflatoxinM1 in soft white cheese and its by-product (whey) and in yogurt locally made from raw sheep's and goat's milk experimentally inoculated with 0.05 and 0.5 µg/l AflatoxinM1 were investigated using ELISA technique. Results reported that AflatoxinM1 was concentrated in cheese at levels significantly higher than that recorded in the raw milk that used for its processing, with a significant decrease in AflatoxinM1 levels in its by-product (whey) comparable to the raw milk used in manufacturing at both inoculated levels. Yogurt produced from raw sheep's milk at second inoculated level exerted AflatoxinM1concentration significantly lower than that present in the milk. Significant differences in AflatoxinM1distribution in cheese and whey produced from sheep's milk comparable to their counterparts produced from goat's milk were recorded. Finally, results revealed the efficacious role of the various dairy manufacturing processes in AflatoxinM1 distribution and the necessity to issue of local legislations concerning the maximum permissible limits for AflatoxinM1 in milk in order to stay within the universal permissible levels for AflatoxinM1 in dairy products to provide greater protection for consumer health. 

A Novel Junction Profiling Methodology

2010 ◽  
Author(s):  
Tomokazu Nakai
Keyword(s):  
Failure Analysis ◽  
Profile Analysis ◽  
Semiconductor Devices ◽  
Wet Etching ◽  
Two Dimensional ◽  
Electrical Characteristics ◽  
Conventional Methods

Abstract Currently many methods are available to obtain a junction profile of semiconductor devices, but the conventional methods have drawbacks, and they could be obstacles for junction profile analysis. This paper introduces an anodic wet etching-based two-dimensional junction profiling method, which is practical, efficient, and reliable for failure analysis and electrical characteristics evaluation.

An Alternative to High-Temperature and Acid/Solvent-Based Methods for Removing Integrated Circuits from Ceramic or Other Problem Substrates

2005 ◽  
Author(s):  
Carl M. Nail
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Success Rate ◽  
Mechanical Damage ◽  
Test Equipment ◽  
High Success Rate ◽  
Automated Test Equipment ◽  
Removal Method ◽  
Automated Test ◽  
Conventional Methods

Abstract Dice must often be removed from their packages and reassembled into more suitable packages for them to be tested in automated test equipment (ATE). Removing bare dice from their substrates using conventional methods poses risks for chemical, thermal, and/or mechanical damage. A new removal method is offered using metallography-based and parallel polishing-based techniques to remove the substrate while exposing the die to minimized risk for damage. This method has been tested and found to have a high success rate once the techniques are learned.

Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing

2012 ◽  
Author(s):  
P. Larré ◽  
H. Tupin ◽  
C. Charles ◽  
R.H. Newton ◽  
A. Reverdy
Keyword(s):  
Electron Beam ◽  
Failure Analysis ◽  
Test Structure ◽  
Precise Localization ◽  
Isolation Method ◽  
Accurate Detection ◽  
Conventional Methods ◽  
Technology Nodes ◽  
Tem Lamella

Abstract As technology nodes continue to shrink, resistive opens have become increasingly difficult to detect using conventional methods such as AVC and PVC. The failure isolation method, Electron Beam Absorbed Current (EBAC) Imaging has recently become the preferred method in failure analysis labs for fast and highly accurate detection of resistive opens and shorts on a number of structures. This paper presents a case study using a two nanoprobe EBAC technique on a 28nm node test structure. This technique pinpointed the fail and allowed direct TEM lamella.

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