Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints

2015 ◽  
Vol 31 (3) ◽  
pp. 252-256 ◽  
Author(s):  
M.L. Huang ◽  
F. Yang
Keyword(s):  
Intermetallic Compound ◽  
Size Effect ◽  
Early Stage ◽  
Interfacial Intermetallic Compound

Direct observation of Fe-Al-Zn ternary intermetallic compound and its transformation during the early stage of hot-dip galvanizing

1993 ◽  
Vol 51 ◽  
pp. 1116-1117
Author(s):  
C. S. Lin ◽  
W. A. Chiou ◽  
M. Meshii
Keyword(s):  
Intermetallic Compound ◽  
Reaction Rate ◽  
Diffusion Rate ◽  
Early Stage ◽  
Zinc Bath ◽  
Steel Sheets ◽  
Direct Observations ◽  
Solid Iron ◽  
Iron And Zinc ◽  
Ternary Intermetallic Compound

The galvannealed steel sheets have received ever increased attention because of their excellent post-painting corrosion resistance and good weldability. However, its powdering and flaking tendency during press forming processes strongly impairs its performance. In order to optimize the properties of galvanneal coatings, it is critical to control the reaction rate between solid iron and molten zinc.In commercial galvannealing line, aluminum is added to zinc bath to retard the diffusion rate between iron and zinc by the formation of a thin layer of Al intermetallic compound on the surface of steel at initial hot-dip galvanizing. However, the form of this compound and its transformation are still speculated. In this paper, we report the direct observations of this compound and its transformation.The specimens were prepared in a hot-dip simulator in which the steel was galvanized in the zinc bath containing 0.14 wt% of Al at a temperature of 480 °C for 5 seconds and was quenched by liquid nitrogen.

Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates

2019 ◽  
Vol 33 (01) ◽  
pp. 1850425 ◽  
Author(s):  
Hongming Cai ◽  
Yang Liu ◽  
Shengli Li ◽  
Hao Zhang ◽  
Fenglian Sun ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Diffusion Barrier ◽  
Graphene Layer ◽  
Solder Joints ◽  
Cu Substrate ◽  
Ni Content ◽  
Increasing Trend ◽  
Cu Substrates ◽  
Interfacial Intermetallic Compound ◽  
Positive Effect

In this paper, solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu (G-Cu) substrates were studied. As Ni content increases in the solder, the solderability improves gradually on both the Cu and G-Cu substrates. The solderability of SAC0705-xNi is better on G-Cu substrate than that on Cu substrate. The increasing Ni content in the solder has a positive effect on the microstructure refinement of both the kinds of substrates. Such effect is more significant on G-Cu substrate than that on Cu substrate. With the increase of Ni content, the thickness of the interfacial intermetallic compound (IMC) shows an increasing trend first and then decreasing trend on the two kinds of substrates. Since the graphene layer works as a diffusion barrier, the IMC on G-Cu is thinner than that on Cu substrate. The addition of Ni leads to the strengthening of the microstructure and thus increases the hardness of the solder bulks.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Solderability and Interfacial Intermetallic Compound (IMC) Growth of Sn-Cu-Ni Solder with Additions of Germanium

2016 ◽  
Vol 857 ◽  
pp. 8-12
Author(s):  
Fatin Afeeqa Mohd Sobri ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Che Mohd Ruzaidi Ghazali ◽  
Pavithiran Narayanan
Keyword(s):  
Intermetallic Compound ◽  
Aging Time ◽  
Thermal Aging ◽  
Maximum Force ◽  
Wetting Time ◽  
Interfacial Intermetallic Compound

The wettability of Sn-Cu-Ni with Germanium (Ge) additions of 0 ppm, 10 ppm, 60 ppm, 100 ppm and 200 ppm were investigated with Gen3 machine. The range of the wettability shows the lowest and the highest reading of wetting time and maximum force. Three different conditions were investigated which consist of as soldered, reflowed and aged. Further interfacial IMC observation was done for 0 ppm and 60 ppm of Ge to investigate the growth of interfacial IMC after thermal aging. From the measurement, the thickness of IMC for 0 ppm Ge is 2.075μm, 3.936μm and 4.502μm with aging time at 24,120 and 240 hours respectively. While for 60 ppm Ge, the IMC thickness are much lower with 1.8μm, 3.11μm and 4.154μm at the same aging time with 0ppm Ge. The results indicate that 60 ppm of Ge in Sn-Cu-Ni has the lowest wetting time, higher maximum force and slow IMC growth.

Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy

2018 ◽  
Vol 273 ◽  
pp. 27-33 ◽  
Author(s):  
Mohd Izrul Izwan Ramli ◽  
M.S.S. Yusof ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Rita Mohd Said ◽  
Kazuhiro Nogita
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compound ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Alloying Additions ◽  
Wetting Properties ◽  
Intermetallic Compound Formation ◽  
Interfacial Intermetallic Compound ◽  
Free Solder ◽  
Intermetallic Layers

The effect of bismuth (Bi) micro-alloying additions on wettability and mechanical properties of Sn-0.7Cu lead-free solder were explored. This paper also investigates the influences of various Bi percentages on the suppression of intermetallic compound formation. Scanning electron microscope (SEM) was used to observe the microstructure evolution of solder joint including the thickness of interfacial intermetallic layers. Overall, with the addition of Bi to Sn-0.7Cu solder, the size of primary Cu6Sn5become smaller and suppresses the thickness of interfacial intermetallic compound between solder and the Cu substrate. Microhardness value and wetting properties also increased with Bi addition which resulted in smaller size of β-Sn and Cu6Sn5.

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