Investigation of the relation between bainitic-ferritic microstructures and coincidence-site lattice boundaries by electron backscatter diffraction

2020 ◽  
Vol 267 ◽  
pp. 127553
Author(s):  
Ronghai Wu ◽  
Yufan Zhang ◽  
Fengwei Sun
Keyword(s):  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
Site Lattice ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Effect of Nickel Purity on Self-Diffusion along High-Diffusivity Paths

2007 ◽  
Vol 567-568 ◽  
pp. 245-248 ◽  
Author(s):  
Vĕra Rothová ◽  
Jiří Buršík ◽  
Milan Svoboda ◽  
Jiří Čermák
Keyword(s):  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
Impurity Content ◽  
Serial Sectioning ◽  
Site Lattice ◽  
Microstructure Characteristics ◽  
Self Diffusion ◽  
Sectioning Method ◽  
Electron Backscatter ◽  
Backscatter Diffraction

In the temperature range 600–1000 °C, the effect of material purity on self-diffusion along grain boundaries has been studied in both the pure (Puratronic 99.9945%) and the technical (99.5%) nickel. The penetration profiles were measured by the serial sectioning method using the 63Ni radiotracer. The extensive electron backscatter diffraction (EBSD) analysis was performed on the same samples in order to reveal possible differences in microstructure induced by the impurity content. The obtained microstructure characteristics were further interpreted in terms of the coincidence site lattice (CSL) model.

Grain Boundary Self-Diffusion in Nickel

2007 ◽  
Vol 263 ◽  
pp. 207-212 ◽  
Author(s):  
Vĕra Rothová ◽  
Jiří Buršík ◽  
Milan Svoboda ◽  
Jiří Čermák
Keyword(s):  
Grain Boundary ◽  
Grain Orientation ◽  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
Self Diffusion ◽  
Electron Backscatter ◽  
Cold Rolled ◽  
Backscatter Diffraction ◽  
Arrhenius Temperature ◽  
Diffusion Profiles

Grain boundary self-diffusion in both the cast and the cold-rolled Puratronic 4N5 nickel was studied in the temperature range from 600 °C to 1000 °C. The experiments were carried out with the samples pre-annealed at 1100 °C in comparison to the samples pre-annealed at intended individual diffusion temperatures. The relative grain orientation was analyzed on the same samples by means of electron backscatter diffraction (EBSD) and grain boundaries (GBs) were characterized in terms of the coincidence site lattice (CSL) model. Considering the non-linear Arrhenius temperature dependencies obtained for most specimens by using conventional method of profile evaluation in the B-type kinetics and the appearance of two high-diffusivity paths in diffusion profiles measured, a more suitable BB-type and AB-type diffusion models were applied for data evaluation.

Morphology Evolution of Grain Boundary Carbides in Highly Twinned Inconel Alloy 600

2016 ◽  
Vol 879 ◽  
pp. 1111-1116 ◽  
Author(s):  
Hui Li ◽  
Jiao Rong Ma ◽  
Xin Rong Liu ◽  
Shuang Xia ◽  
Wen Qing Liu ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Aging Time ◽  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
Morphology Evolution ◽  
Alloy 600 ◽  
Inconel Alloy ◽  
Electron Backscatter ◽  
Backscatter Diffraction

The effects of grain boundary characters on the morphology evolution of grain boundary carbides in Inconel Alloy 600 with high proportional low Σ coincidence site lattice (CSL) boundaries aged at 715 oC for 1-100 h were investigated by scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD). During the aging process, the carbides precipitated at coherent twin (Σ3) boundaries are very few and finest within all the aging time. Bar like carbides precipitated near both sides of the incoherent twin (Σ3) boundaries, and bigger carbides than that of coherent Σ3 boundaries had been found on the incoherent Σ3 boundaries. Bar like carbides precipitated near only one side of Σ9 boundaries, and much bigger carbides than that of Σ3 boundaries have been found on the Σ9 boundaries. The morphology of carbides precipitated at Σ27 and random grain boundaries are similar, and is bigger than that of precipitated at other grain boundaries. The carbides precipitated at grain boundaries with all types grow bigger with the aging time prolonging, but their growth rates are different.

Effect of Phosphorus Contents on Texture and Grain Boundary Character for the Annealing High Strength Ti-IF Steels

2013 ◽  
Vol 652-654 ◽  
pp. 929-933 ◽  
Author(s):  
Xin Li Song ◽  
Kun Peng ◽  
P.P. Zhang ◽  
J.Y. Wu ◽  
J. Zhou ◽  
...  
Keyword(s):  
Grain Boundaries ◽  
Recrystallization Texture ◽  
Volume Fraction ◽  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
High Strength ◽  
Fiber Texture ◽  
Grain Boundary Character ◽  
Electron Backscatter ◽  
Backscatter Diffraction

The effect of phosphorus contents on texture and grain boundaries character for the high strength Ti-IF annealed for 120sec at 810oC are researched by electron backscatter diffraction technique（EBSD）. The recrystallization texture is approximated by the γ-fiber texture whose components are {111} and {111} orientation texture. The highest volume fraction of //ND texture is almost 80% for the sample containing 0.056%P. A large amount of coincidence site lattice(CSL) grain boundaries ∑3，∑5, ∑7，∑9，∑11 and ∑13b are obtained.

Effect of Trench Aspect Ratio on Microstructure and Texture in Damascene Cu Interconnects

2012 ◽  
Vol 706-709 ◽  
pp. 2605-2610
Author(s):  
L. Chen ◽  
G.J. Yuan ◽  
J.G. Xu ◽  
F. Guo ◽  
N. Pang
Keyword(s):  
Aspect Ratio ◽  
Grain Boundaries ◽  
Electron Backscatter Diffraction ◽  
Coincidence Site Lattice ◽  
X Ray Diffraction ◽  
X Ray ◽  
Cu Interconnects ◽  
Electron Backscatter ◽  
Line Spacing ◽  
Backscatter Diffraction

The effect of trench aspect ratio and line spacing on microstructure and texture in annealed damascene Cu interconnects has been investigated. The X-ray diffraction (XRD) and electron backscatter diffraction (EBSD) analyses of Cu lines, showed a preferred {111} orientation and the trenches reduce the proportion of high-angle grain boundaries and increase the fraction of coincidence site lattice (CSL) grain boundaries, comparing with the Cu blanket film. In addition, both trench aspect ratio and line spacing can largely affect the microstructure and texture in annealed damascene Cu interconnects.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

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